⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1616112 | 0.83 | ADRB2 (0.38) | — | |
| SCHEMBL2946093 | 0.81 | CA1 (0.33) | — | |
| SCHEMBL4188617 | 0.81 | CA1 (0.30) | — | |
| SCHEMBL661549 | 0.75 | — | — | |
| SCHEMBL30712217 | 0.73 | ALDH1A1 (0.32) | — | |
| SCHEMBL30712218 | 0.73 | — | — | |
| SCHEMBL30712215 | 0.73 | — | — | |
| SCHEMBL30712211 | 0.73 | ALDH1A1 (0.32) | — | |
| SCHEMBL30712209 | 0.73 | ALDH1A1 (0.32) | — | |
| SCHEMBL3194364 | 0.72 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-108389512-B | Laminate, flexible device, and method for producing laminate | 东京应化工业株式会社 | 2022-04-15 | — | — | CN | disclosed |
| CN-108387954-B | Laminate, flexible device, and method for producing laminate | 东京应化工业株式会社 | 2022-01-18 | — | — | CN | disclosed |
| US-9663598-B2 | Organosilicon compound-containing thermosetting composition and cured product thereof | TOAGOSEI CO., LTD. (JP) | 2017-05-30 | — | — | US | disclosed |
| EP-2154710-B1 | Substrate joining method and 3-D semiconductor device | SHINETSU CHEMICAL CO (JP) | 2016-11-16 | — | — | EP | disclosed |
| US-20160200842-A1 | ORGANOSILICON COMPOUND-CONTAINING THERMOSETTING COMPOSITION AND CURED PRODUCT THEREOF | TOAGOSEI CO., LTD. (JP) | 2016-07-14 | — | — | US | disclosed |
| US-8829142-B2 | Curable composition and process for production of organosilicon compound | TOAGOSEI CO., LTD. (JP) | 2014-09-09 | — | — | US | disclosed |
| EP-2270070-B1 | CURABLE COMPOSITION, AND PROCESS FOR PRODUCTION OF ORGANOSILICON COMPOUND | TOAGOSEI CO LTD (JP) | 2014-07-30 | — | — | EP | disclosed |
| EP-2565217-B1 | Curable composition and process for production of organosilicon compound | TOAGOSEI CO LTD (JP) | 2014-05-14 | — | — | EP | disclosed |
| US-20130149455-A1 | CURABLE COMPOSITION AND PROCESS FOR PRODUCTION OF ORGANOSILICON COMPOUND | TOAGOSEI CO., LTD. (JP) | 2013-06-13 | — | — | US | disclosed |
| EP-2565217-A1 | Curable composition and process for production of organosilicon compound | TOAGOSEI CO., LTD. (JP) | 2013-03-06 | — | — | EP | disclosed |
| US-20080118737-A1 | excels in dielectric properties, adhesion, film consistency, mechanical strength, easily thinned; made from an amorphous polymer made by hydrolyzing and condensing an silane compoundl, and and a zeolite sol made with a quaternary ammonium hydroxide | SHIN-ETSU CHEMICAL CO. LTD. | 2008-05-22 | — | — | US | disclosed |
| US-7309722-B2 | excels in dielectric properties, adhesion, film consistency, mechanical strength, easily thinned; made from an amorphous polymer made by hydrolyzing and condensing an silane compoundl, and and a zeolite sol made with a quaternary ammonium hydroxide | SHIN-ETSU CHEMICAL CO. LTD. (JP) | 2007-12-18 | — | — | US | disclosed |
| US-20070213204-A1 | Ziegler-Natta catalyst with in situ-generated donor | NOVOLEN TECHNOLOGY HOLDINGS C.V. | 2007-09-13 | — | — | US | disclosed |
| US-7244657-B2 | Zeolite sol and method for preparing the same, composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device | SHIN-ETSU CHEMICAL CO. LTD. (JP) | 2007-07-17 | — | — | US | disclosed |
| US-7238462-B2 | Undercoating material for wiring, embedded material, and wiring formation method | TOKYO OHKA KOGYO CO., LTD. (JP) | 2007-07-03 | — | — | US | disclosed |
| US-20070108593-A1 | Zeolite sol and method for preparing the same, composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device | OGIHARA TSUTOMU | 2007-05-17 | — | — | US | disclosed |
| US-20050074695-A1 | Undercoating material for wiring, embedded material, and wiring formation method | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-04-07 | — | — | US | disclosed |
| US-20040105986-A1 | excels in dielectric properties, adhesion, film consistency, mechanical strength, easily thinned; made from an amorphous polymer made by hydrolyzing and condensing an silane compoundl, and and a zeolite sol made with a quaternary ammonium hydroxide | PANASONIC CORPORATION (JP) | 2004-06-03 | — | — | US | disclosed |
| US-20040091419-A1 | Zeolite sol and method for preparing the same, composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2004-05-13 | — | — | US | disclosed |
| EP-0125910-B1 | PROCESS FOR PRODUCTION OF 4-METHYL-1-PENTENE POLYMER OR COPOLYMER | MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) | 1986-10-08 | — | — | EP | disclosed |