SCHEMBL106926

SCHEMBL106926

CC(C)(C)CO[SiH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Biphenyl SCHEMBL9722114 0.77 ALDH1A1 (0.41)
SCHEMBL1900603 0.72
SCHEMBL705103 0.72
SCHEMBL1802993 0.72
SCHEMBL3482345 0.69
SCHEMBL837169 0.69
SCHEMBL9458370 0.69
SCHEMBL2316884 0.67
SCHEMBL1313555 0.67
SCHEMBL7924017 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 286 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12583222-B2 Solvent compatible nozzle plate BRADY WORLDWIDE, INC. (US) 2026-03-24 US claimed
EP-4634324-A1 AMPHIPHILIC ABRASIVE PARTICLES AND THEIR USE FOR CHEMICAL MECHANICAL PLANARIZATION Versum Materials US, LLC (US) 2025-10-22 EP claimed
CN-117866204-B Silicon-containing surface modifier and etching-resistant agent underlayer film composition, and preparation method and application thereof 福建泓光半导体材料有限公司 2024-12-13 CN claimed
WO-2024129435-A1 AMPHIPHILIC ABRASIVE PARTICLES AND THEIR USE FOR CHEMICAL MECHANICAL PLANARIZATION VERSUM MATERIALS US, LLC (US) 2024-06-20 WO claimed
US-20240198675-A1 SOLVENT COMPATIBLE NOZZLE PLATE FUNAI ELECTRIC CO., LTD. (JP) 2024-06-20 US claimed
US-11958292-B2 Solvent compatible nozzle plate FUNAI ELECTRIC CO., LTD. (JP) 2024-04-16 US claimed
CN-117866204-A Silicon-containing surface modifier and etching-resistant agent underlayer film composition, and preparation method and application thereof 福建泓光半导体材料有限公司 2024-04-12 CN claimed
CN-117866205-A Silicon-containing surface modifier and resist underlayer film composition, and preparation method and application thereof 福建泓光半导体材料有限公司 2024-04-12 CN claimed
CN-115113480-A Composite photoresist material, preparation method thereof and fluid ejection head 船井电机株式会社 2022-09-27 CN claimed
US-20220297428-A1 Solvent Compatible Nozzle Plate FUNAI ELECTRIC CO., LTD. (JP) 2022-09-22 US claimed
EP-4060406-A2 COMPOSITE PHOTORESIST MATERIAL AND METHOD FOR MAKING THEREOF, AND FLUID EJECTION HEAD Funai Electric Co., Ltd. (JP) 2022-09-21 EP claimed
US-10599034-B2 Method for manufacturing MEMS devices and nano devices with varying degrees of hydrophobicity and hydrophilicity in a composite photoimageable dry film FUNAI ELECTRIC CO., LTD. (JP) 2020-03-24 US claimed
EP-2628745-B1 Silicon-containing surface modifier, resist lower layer film-forming composition containing the same, and patterning process SHINETSU CHEMICAL CO (JP) 2015-03-25 EP claimed
US-20120071700-A1 CATALYSTS FOR HYDROGENATION OF UNSATURATED HYDROCARBONS AND PREPARATIONS AND USES THEREOF CHINA PETROLEUM & CHEMICAL CORPORATION (CN) 2012-03-22 US claimed
WO-2010082710-A1 METHOD FOR PREPARING A HIGHLY DURABLE REVERSE OSMOSIS MEMBRANE UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY (KR) 2010-07-22 WO claimed
US-20260118767-A1 REVERSE PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-04-30 US disclosed
US-12600130-B2 Ejection head nozzle flooding control BRADY WORLDWIDE, INC. (US) 2026-04-14 US disclosed
US-4732814-A MAGNETIC RECORDING MEDIA TORAY INDUSTRIES, INC. (JP) 1988-03-22 US disclosed
EP-0238663-A1 POLYESTER FILM WITH SMOOTH AND HIGHLY ADHESIVE SURFACE AND METHOD OF MAKING SAME. TORAY INDUSTRIES (JP) 1987-09-30 EP disclosed
WO-1987002172-A1 POLYESTER FILM WITH SMOOTH AND HIGHLY ADHESIVE SURFACE AND METHOD OF MAKING SAME TORAY INDUSTRIES, INC. (JP) 1987-04-09 WO disclosed