SCHEMBL1070748

SCHEMBL1070748

CCOC(=O)N=C(N)NC(=O)OCC

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 1/20 0.42
TP53 P04637 1/20 0.42
NFKB1 P19838 1/20 0.42
MAPK1 P28482 1/20 0.42
RAB9A P51151 1/20 0.42
NFKB2 Q00653 1/20 0.42
RELA Q04206 1/20 0.42
SMN1; SMN2 Q16637 1/20 0.42
ALOX15 P16050 1/20 0.41
TRPM8 Q7Z2W7 1/20 0.38
GAA P10253 2/20 0.37
MGAM O43451 1/20 0.37
SI P14410 1/20 0.37
MGAM2 Q2M2H8 1/20 0.37
CYP1A2 P05177 1/20 0.36
CYP2C9 P11712 1/20 0.36
CYP2C19 P33261 1/20 0.36
MALT1 Q9UDY8 1/20 0.36
MAPT P10636 1/20 0.35
ALDH1A1 P00352 3/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23796909 0.81 ACHE (0.43) KMT2A
SCHEMBL24178194 0.81 ACHE (0.43) KMT2A
SCHEMBL14598243 0.80 ALOX15 (0.44) SMN1; SMN2ALOX15GAAMGAMSI
SCHEMBL6866100 0.79 RAB9A (0.44) NPC1RAB9ASMN1; SMN2MAPTALDH1A1
SCHEMBL10604930 0.78 GAA (0.38) NFKB1NFKB2RELAALOX15GAA
SCHEMBL10604935 0.78 GAA (0.38) NFKB1NFKB2RELAALOX15GAA
SCHEMBL18528394 0.75 EGLN1 (0.40) SMN1; SMN2ALOX15GAAMGAMSI
SCHEMBL17234488 0.75 EGLN1 (0.40) SMN1; SMN2ALOX15GAAMGAMSI
SCHEMBL420598 0.74
SCHEMBL1579478 0.74

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260109849-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-23 US disclosed
US-20240301176-A1 EPOXY RESIN COMPOSITION, ADHESIVE FILM, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR DEVICE, AND METHOD FOR USING ADHESIVE FILM ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-09-12 US disclosed
US-9359327-B2 Process for the preparation of substituted pyrimidine derivatives JANSSEN PHARMACEUTICA NV (BE) 2016-06-07 US disclosed
EP-2924025-A1 SUBSTITUTED PYRIMIDINE DERIVATIVES Janssen Pharmaceutica NV (BE) 2015-09-30 EP disclosed
EP-2924023-A1 piperidine und piperazine derivativs Janssen Pharmaceutica NV (BE) 2015-09-30 EP disclosed
EP-2924035-A1 SUBSTITUTED PYRIMIDINE DERIVATIVES Janssen Pharmaceutica NV (BE) 2015-09-30 EP disclosed
US-9079882-B2 Process for the preparation of substituted pyrimidine derivatives JANSSEN PHARMACEUTICA NV (BE) 2015-07-14 US disclosed
US-9079884-B2 Process for the preparation of substituted pyrimidine derivatives JANSSEN PHARMACEUTICA NV (BE) 2015-07-14 US disclosed
US-9079883-B2 Process for the preparation of substituted pyrimidine derivatives JANSSEN PHARMACEUTICA NV (BE) 2015-07-14 US disclosed
US-9006432-B2 Process for the preparation of substituted pyrimidine derivatives JANSSEN PHARMACEUTICA NV (BE) 2015-04-14 US disclosed
US-20130053561-A1 Process for the preparation of substituted pyrimidine derivatives JANSSEN PHARMACEUTICA NV (US) 2013-02-28 US disclosed
US-8309720-B2 Process for the preparation of substituted pyrimidine derivatives JANSSEN PHARMACEUTICA NV (BE) 2012-11-13 US disclosed
EP-1867672-B1 EPOXY RESIN COMPOSITION ASAHI KASEI CHEMICALS CORP (JP) 2011-01-26 EP disclosed
US-7671147-B2 Composition of oxazolidine epoxy resin, epoxy phosphazene, phosphorus compound or polyphenylene ether and curing agent ASAHI KASEI CHEMICALS CORPORATION (JP) 2010-03-02 US disclosed
US-20100004450-A1 Process for the preparation of substituted pyrimidine derivatives CESCO-CANCIAN SERGIO 2010-01-07 US disclosed
US-20090032286-A1 Epoxy Resin Composition ASAHI KASEI CHEMICALS CORPORATION (JP) 2009-02-05 US disclosed
US-20080050596-A1 Flame-Retardant Epoxy Resin Composition ASAHI KASEI CHEMICALS CORPORATION (JP) 2008-02-28 US disclosed
EP-1867672-A1 EPOXY RESIN COMPOSITION Asahi Kasei Chemicals Corporation (JP) 2007-12-19 EP disclosed
EP-1775321-A1 FLAME-RETARDANT EPOXY RESIN COMPOSITION Asahi Kasei Chemicals Corporation (JP) 2007-04-18 EP disclosed
US-4833204-A Epoxy resin composition for a copper-clad laminate HITACHI CHEMICAL COMPANY, LTD. (JP) 1989-05-23 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20100004450-A1 Process for the preparation of substituted pyrimidine derivatives HRH4, HRH2, HRH3 NPC1 3461/4885TP53 3892/4885NFKB1 2901/4885
US-20130053561-A1 Process for the preparation of substituted pyrimidine derivatives HRH4, HRH2, HRH3 NPC1 3461/4885TP53 3892/4885NFKB1 2901/4885
US-20260109849-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE ASH2L, DOT1L, ASH1L NPC1 4813/4885TP53 4270/4885NFKB1 2022/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.