Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | FAAH | O00519 | 8/20 | 0.35 |
| ▸ | CES1 | P23141 | 6/20 | 0.34 |
| ▸ | CES2 | O00748 | 3/20 | 0.34 |
| ▸ | MEN1 | O00255 | 1/20 | 0.34 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.34 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.34 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.34 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.33 |
| ▸ | CA1 | P00915 | 1/20 | 0.32 |
| ▸ | CA2 | P00918 | 1/20 | 0.32 |
| ▸ | FDPS | P14324 | 1/20 | 0.32 |
| ▸ | DNM1 | Q05193 | 1/20 | 0.32 |
| ▸ | EPHX1 | P07099 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8801518 | 0.86 | — | — | |
| SCHEMBL9101043 | 0.76 | CA2 (0.48) | FAAHCES1CES2MEN1KMT2A | |
| SCHEMBL11299270 | 0.76 | CA2 (0.48) | FAAHCES1CES2MEN1KMT2A | |
| SCHEMBL11307885 | 0.76 | CA2 (0.48) | FAAHCES1CES2MEN1KMT2A | |
| SCHEMBL10442273 | 0.74 | CA2 (0.38) | FAAHCES1CES2MEN1CYP1A2 | |
| SCHEMBL8995458 | 0.71 | CES2 (0.52) | FAAHCES1CES2MEN1CYP1A2 | |
| SCHEMBL11298990 | 0.71 | CA2 (0.36) | FAAHCES1CES2MEN1CYP1A2 | |
| SCHEMBL6115859 | 0.71 | PDF (0.41) | FAAHCES1CES2MEN1CYP1A2 | |
| SCHEMBL6115966 | 0.71 | CA2 (0.44) | FAAHCES1CES2MEN1CYP1A2 | |
| SCHEMBL6117851 | 0.70 | CA1 (0.36) | FAAHCES1CES2MEN1CYP1A2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 556 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3385791-B1 | PATTERN FORMATION METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, LAMINATE FILM, AND UPPER LAYER FILM FORMATION COMPOSITION | FUJIFILM CORP (JP) | 2024-02-28 | — | — | EP | disclosed |
| WO-2024009732-A1 | POSITIVE-ACTING PHOTOSENSITIVE RESIN COMPOSITION | 日本ポリテック株式会社 | 2024-01-11 | — | — | WO | disclosed |
| WO-2023080254-A1 | POSITIVE-ACTING PHOTOSENSITIVE RESIN COMPOSITION | 株式会社レゾナック | 2023-05-11 | — | — | WO | disclosed |
| WO-2023286586-A1 | PATTERN FORMING METHOD, ELECTRONIC DEVICE MANUFACTURING METHOD, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, AND RESIST FILM | 富士フイルム株式会社 | 2023-01-19 | — | — | WO | disclosed |
| US-11249395-B2 | Pattern forming method, method for manufacturing electronic device, laminate film, and composition for forming upper layer film | FUJIFILM CORPORATION (JP) | 2022-02-15 | — | — | US | disclosed |
| US-20210286263-A1 | ACTIVE RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2021-09-16 | — | — | US | disclosed |
| EP-2550562-B1 | PATTERN FORMING METHOD AND RESIST COMPOSITION | FUJIFILM CORP (JP) | 2021-04-21 | — | — | EP | disclosed |
| EP-2539769-B1 | PATTERN FORMING METHOD AND RESIST COMPOSITION | FUJIFILM CORP (JP) | 2021-04-07 | — | — | EP | disclosed |
| EP-2414896-B1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMING METHOD USING THE SAME | FUJIFILM CORP (JP) | 2020-11-11 | — | — | EP | disclosed |
| US-10761426-B2 | Pattern forming method, method for manufacturing electronic device, and laminate | FUJIFILM CORPORATION (JP) | 2020-09-01 | — | — | US | disclosed |
| US-20080206669-A1 | POSITIVE WORKING RESIST COMPOSITION AND PATTERN FORMING METHOD | FUJIFILM CORPORATION (JP) | 2008-08-28 | — | — | US | disclosed |
| EP-1962139-A1 | Negative resist composition and pattern forming method using the same | FUJIFILM Corporation (JP) | 2008-08-27 | — | — | EP | disclosed |
| US-20080187860-A1 | PATTERN FORMING METHOD, RESIST COMPOSITION FOR MULTIPLE DEVELOPMENT USED IN THE PATTERN FORMING METHOD, DEVELOPER FOR NEGATIVE DEVELOPMENT USED IN THE PATTERN FORMING METHOD, AND RINSING SOLUTION FOR NEGATIVE DEVELOPMENT USED IN THE PATTERN FORMING METHOD | FUJIFILM CORPORATION (JP) | 2008-08-07 | — | — | US | disclosed |
| WO-2008093856-A1 | POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE POSITIVE RESIST COMPOSITION | FUJIFILM CORPORATION (JP) | 2008-08-07 | — | — | WO | disclosed |
| US-20080081290-A1 | RESIST COMPOSITION, RESIN FOR USE IN THE RESIST COMPOSITION, COMPOUND FOR USE IN THE SYNTHESIS OF THE RESIN, AND PATTERN-FORMING METHOD USING THE RESIST COMPOSITION | FUJIFILM CORPORATION (JP) | 2008-04-03 | — | — | US | disclosed |
| EP-1903394-A1 | Resist composition, resin for use in the resist composition, and pattern-forming method using the resist composition | FUJIFILM Corporation (JP) | 2008-03-26 | — | — | EP | disclosed |
| US-20070178405-A1 | Positive resist composition and method of pattern formation with the same | FUJI PHOTO FILM CO., LTD. | 2007-08-02 | — | — | US | disclosed |
| US-20070134588-A1 | Positive resist composition, resin used for the positive resist composition, compound used for synthesis of the resin and pattern forming method using the positive resist composition | FUJIFILM CORPORATION (JP) | 2007-06-14 | — | — | US | disclosed |
| EP-1795960-A2 | Positive resist composition, resin used for the positive resist composition, compound used for synthesis of the resin and pattern forming method using the positive resist composition | Fujifilm Corporation (JP) | 2007-06-13 | — | — | EP | disclosed |
| EP-1754999-A2 | Positive resist composition and method of pattern formation with the same | Fuji Photo Film Co., Ltd. (JP) | 2007-02-21 | — | — | EP | disclosed |