SCHEMBL1081941

SCHEMBL1081941

CCCCCCCCCCCC[Sn](CCCCCCCCCCCC)(OC(=O)CCC)O[Sn](CCCCCCCCCCCC)(CCCCCCCCCCCC)O[Sn](CCCCCCCCCCCC)(CCCCCCCCCCCC)OC(=O)CCC

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
DGKA P23743 1/20 0.40
ALDH1A1 P00352 3/20 0.39
LMNA P02545 2/20 0.38
CES2 O00748 3/20 0.38
CES1 P23141 3/20 0.38
PAM P19021 2/20 0.37
GPR84 Q9NQS5 6/20 0.36
PPARG P37231 6/20 0.36
PPARD Q03181 6/20 0.36
PPARA Q07869 6/20 0.36
HDAC11 Q96DB2 5/20 0.36
TSHR P16473 4/20 0.36
TLR2 O60603 2/20 0.36
TDP1 Q9NUW8 2/20 0.36
FABP4 P15090 2/20 0.36
PTPN1 P18031 2/20 0.36
SLC22A6 Q4U2R8 1/20 0.36
SLC22A8 Q8TCC7 1/20 0.36
MEN1 O00255 1/20 0.36
ESR1 P03372 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL557245 0.98 DGKA (0.41) DGKAALDH1A1LMNACES2CES1
SCHEMBL556636 0.98 DGKA (0.41) DGKAALDH1A1LMNACES2CES1
SCHEMBL1083409 0.93 DGKA (0.48) DGKAALDH1A1LMNACES2CES1
SCHEMBL1083084 0.93 DGKA (0.48) DGKAALDH1A1LMNACES2CES1
SCHEMBL556683 0.93 ALDH1A1 (0.41) DGKAALDH1A1LMNACES2CES1
SCHEMBL557016 0.91 DGKA (0.50) DGKAALDH1A1LMNACES2CES1
SCHEMBL557871 0.91 DGKA (0.50) DGKAALDH1A1LMNACES2CES1
SCHEMBL556453 0.91 DGKA (0.50) DGKAALDH1A1LMNACES2CES1
SCHEMBL557169 0.91 DGKA (0.50) DGKAALDH1A1LMNACES2CES1
SCHEMBL555673 0.91 ALDH1A1 (0.43) DGKAALDH1A1LMNACES2CES1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1652891-B1 CURABLE RESIN COMPOSITION AND COLD-SETTING ADHESIVE KONISHI CO LTD (JP) 2012-06-13 EP disclosed
EP-1788035-B1 REACTIVE HOT-MELT RESIN COMPOSITION AND REACTIVE HOT-MELT ADHESIVE KONISHI CO LTD (JP) 2011-01-19 EP disclosed
US-7576167-B2 Curable resin composition KONISHI CO., LTD. (JP) 2009-08-18 US disclosed
US-20080312401-A1 Reactive Hot-Melt Resin Composition and Reactive Hot-Melt Adhesive SATO SHINICHI 2008-12-18 US disclosed
US-7449519-B2 Curing resin, method for producing same and curing resin composition KONISHI CO., LTD. (JP) 2008-11-11 US disclosed
EP-1788035-A1 REACTIVE HOT-MELT RESIN COMPOSITION AND REACTIVE HOT-MELT ADHESIVE Konishi Co., Ltd. (JP) 2007-05-23 EP disclosed
US-20060189736-A1 Curable resin composition and cold-setting adhesive KONISHI CO., LTD. (JP) 2006-08-24 US disclosed
EP-1652891-A1 CURABLE RESIN COMPOSITION AND COLD-SETTING ADHESIVE KONISHI CO., LTD. (JP) 2006-05-03 EP disclosed
US-20060079605-A1 Curing resin, method for producing same and curing resin composition KONISHI CO., LTD. (JP) 2006-04-13 US disclosed
EP-1616886-A1 CURING RESIN, METHOD FOR PRODUCING SAME AND CURING RESIN COMPOSITION Konishi Co., Ltd. (JP) 2006-01-18 EP disclosed
US-20050182225-A1 Curable resin composition KONISHI CO. LTD (JP) 2005-08-18 US disclosed
EP-1514903-A1 CURABLE RESIN COMPOSITION Konishi Co., Ltd. (JP) 2005-03-16 EP disclosed