⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL13928030 | 0.79 | — | — | |
| SCHEMBL15390632 | 0.75 | TSHR (0.37) | — | |
| SCHEMBL8776546 | 0.73 | ALDH1A1 (0.35) | — | |
| SCHEMBL11785570 | 0.65 | — | — | |
| SCHEMBL2016755 | 0.65 | — | — | |
| SCHEMBL508005 | 0.65 | LMNA (0.32) | — | |
| SCHEMBL5103 | 0.65 | CRBN (0.32) | — | |
| SCHEMBL1332813 | 0.65 | — | — | |
| SCHEMBL457688 | 0.62 | — | — | |
| Water SCHEMBL9343736 | 0.62 | TSHR (0.30) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 58 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119752459-A | Preparation method of water-soluble organophosphorus flame retardant | 安徽科赛富新材料科技有限公司 | 2025-04-04 | — | — | CN | claimed |
| CN-114436380-A | Lignin-based flocculant and preparation method thereof | 中国石油化工股份有限公司 | 2022-05-06 | — | — | CN | claimed |
| US-20080029126-A1 | Compositions and methods for improved planarization of copper utilizing inorganic oxide abrasive | ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. | 2008-02-07 | — | — | US | claimed |
| US-6971945-B2 | Multi-step polishing solution for chemical mechanical planarization | ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. (US) | 2005-12-06 | — | — | US | claimed |
| US-20050194357-A1 | MULTI-STEP POLISHING SOLUTION FOR CHEMICAL MECHANICAL PLANARIZATION | ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. | 2005-09-08 | — | — | US | claimed |
| EP-1548076-A1 | Compositions and methods for low downforce pressure polishing of copper | Rohm and Haas Electronic Materials CMP Holdings, Inc. (US) | 2005-06-29 | — | — | EP | claimed |
| US-20050136671-A1 | Compositions and methods for low downforce pressure polishing of copper | ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. | 2005-06-23 | — | — | US | claimed |
| CN-122068047-A | Multi-element nonmetallic functional group gradient distributed composite electrode and preparation method and application thereof | 辽宁金谷炭材料股份有限公司 | 2026-05-19 | — | — | CN | disclosed |
| CN-119752459-A | Preparation method of water-soluble organophosphorus flame retardant | 安徽科赛富新材料科技有限公司 | 2025-04-04 | — | — | CN | disclosed |
| CN-119725671-A | Battery and electric equipment | 欣旺达动力科技股份有限公司 | 2025-03-28 | — | — | CN | disclosed |
| CN-119581684-A | Secondary battery and electric equipment | 欣旺达动力科技股份有限公司 | 2025-03-07 | — | — | CN | disclosed |
| CN-118695874-A | Cancer therapy with TLR7/8 agonists | 阿森迪斯药物肿瘤股份有限公司 | 2024-09-24 | — | — | CN | disclosed |
| CN-115911390-A | Electrode plate, preparation method thereof and battery | 蜂巢能源科技(上饶)有限公司 | 2023-04-04 | — | — | CN | disclosed |
| US-20060110924-A1 | Abrasive-free chemical mechanical polishing compositions and methods relating thereto | DuPont Electronic Materials Holding, Inc. | 2006-05-25 | — | — | US | disclosed |
| US-6971945-B2 | Multi-step polishing solution for chemical mechanical planarization | ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. (US) | 2005-12-06 | — | — | US | disclosed |
| US-20050211952-A1 | Compositions and methods for chemical mechanical planarization of tungsten and titanium | ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. | 2005-09-29 | — | — | US | disclosed |
| US-20050214191-A1 | Abrasives and compositions for chemical mechanical planarization of tungsten and titanium | ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. | 2005-09-29 | — | — | US | disclosed |
| US-20050194357-A1 | MULTI-STEP POLISHING SOLUTION FOR CHEMICAL MECHANICAL PLANARIZATION | ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. | 2005-09-08 | — | — | US | disclosed |
| EP-1548076-A1 | Compositions and methods for low downforce pressure polishing of copper | Rohm and Haas Electronic Materials CMP Holdings, Inc. (US) | 2005-06-29 | — | — | EP | disclosed |
| US-20050136671-A1 | Compositions and methods for low downforce pressure polishing of copper | ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. | 2005-06-23 | — | — | US | disclosed |