Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MEN1 | O00255 | 3/20 | 0.57 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.57 |
| ▸ | POLB | P06746 | 1/20 | 0.52 |
| ▸ | THRB | P10828 | 1/20 | 0.49 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL14802626 | 0.84 | MEN1 (0.54) | MEN1KMT2APOLBTHRB | |
| SCHEMBL10723742 | 0.83 | KMT2A (0.56) | MEN1KMT2APOLB | |
| SCHEMBL10722675 | 0.83 | KMT2A (0.56) | MEN1KMT2APOLB | |
| SCHEMBL10722375 | 0.83 | KMT2A (0.58) | MEN1KMT2APOLB | |
| SCHEMBL28657720 | 0.80 | KDM4E (0.64) | MEN1KMT2APOLB | |
| SCHEMBL19634850 | 0.80 | KMT2A (0.64) | MEN1KMT2A | |
| SCHEMBL15471059 | 0.76 | KCNH2 (0.68) | — | |
| SCHEMBL106864 | 0.75 | KCNH2 (0.71) | — | |
| SCHEMBL20887230 | 0.72 | LMNA (0.55) | MEN1KMT2A | |
| SCHEMBL12019853 | 0.71 | MEN1 (0.51) | MEN1KMT2APOLBTHRB |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11656548-B2 | Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, mask blank with resist film, method for producing photomask, and method for manufacturing electronic device | FUJIFILM CORPORATION (JP) | 2023-05-23 | — | — | US | disclosed |
| US-9482947-B2 | Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition, resist film, manufacturing method of electronic device and electronic device | FUJIFILM CORPORATION (JP) | 2016-11-01 | — | — | US | disclosed |
| US-9423689-B2 | Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition, resist film, manufacturing method of electronic device and electronic device | FUJIFILM CORPORATION (JP) | 2016-08-23 | — | — | US | disclosed |
| US-9417528-B2 | Pattern forming method, multi-layered resist pattern, multi-layered film for organic solvent development, resist composition, method for manufacturing electronic device, and electronic device | FUJIFILM CORPORATION (JP) | 2016-08-16 | — | — | US | disclosed |
| US-9383645-B2 | Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition, actinic ray-sensitive or radiation-sensitive film, manufacturing method of electronic device, and electronic device | FUJIFILM CORPORATION (JP) | 2016-07-05 | — | — | US | disclosed |
| US-9250532-B2 | Pattern forming method, multi-layered resist pattern, multi-layered film for organic solvent development, resist composition, method for manufacturing electronic device, and electronic device | FUJIFILM CORPORATION (JP) | 2016-02-02 | — | — | US | disclosed |
| US-9244344-B2 | Actinic ray-sensitive or radiation-sensitive resin composition, and, resist film, pattern forming method, electronic device manufacturing method, and electronic device, each using the same | FUJIFILM CORPORATION (JP) | 2016-01-26 | — | — | US | disclosed |
| US-9213237-B2 | Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition, resist film, manufacturing method of electronic device, and electronic device | FUJIFILM CORPORATION (JP) | 2015-12-15 | — | — | US | disclosed |
| US-9140981-B2 | Actinic-ray-sensitive or radiation-sensitive resin composition, and resist film using the same, pattern forming method, electronic device manufacturing method, and electronic device, each using the same | FUJIFILM CORPORATION (JP) | 2015-09-22 | — | — | US | disclosed |
| US-20150248056-A1 | PATTERN FORMING METHOD, MULTI-LAYERED RESIST PATTERN, MULTI-LAYERED FILM FOR ORGANIC SOLVENT DEVELOPMENT, RESIST COMPOSITION, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2015-09-03 | — | — | US | disclosed |
| US-20140234761-A1 | PATTERN FORMING METHOD, MULTI-LAYERED RESIST PATTERN, MULTI-LAYERED FILM FOR ORGANIC SOLVENT DEVELOPMENT, RESIST COMPOSITION, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2014-08-21 | — | — | US | disclosed |
| US-20140227637-A1 | PATTERN FORMING METHOD, MULTI-LAYERED RESIST PATTERN, MULTI-LAYERED FILM FOR ORGANIC SOLVENT DEVELOPMENT, MANUFACTURING METHOD OF ELECTRONIC DEVICE, AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2014-08-14 | — | — | US | disclosed |
| US-8790860-B2 | Actinic ray-sensitive or radiation-sensitive resin composition, and resist film, pattern forming method, method for preparing electronic device, and electronic device, each using the same | FUJIFILM CORPORATION (JP) | 2014-07-29 | — | — | US | disclosed |
| US-20140141360-A1 | PATTERN FORMING METHOD, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, MANUFACTURING METHOD OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2014-05-22 | — | — | US | disclosed |
| US-20140045117-A1 | PATTERN FORMING METHOD, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, MANUFACTURING METHOD OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2014-02-13 | — | — | US | disclosed |
| US-20130078433-A1 | ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, AND RESIST FILM USING THE SAME, PATTERN FORMING METHOD, ELECTRONIC DEVICE MANUFACTURING METHOD, AND ELECTRONIC DEVICE, EACH USING THE SAME | FUJIFILM CORPORATION (JP) | 2013-03-28 | — | — | US | disclosed |
| US-20130078434-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, AND, RESIST FILM, PATTERN FORMING METHOD, ELECTRONIC DEVICE MANUFACTURING METHOD, AND ELECTRONIC DEVICE, EACH USING THE SAME | FUJIFILM CORPORATION (JP) | 2013-03-28 | — | — | US | disclosed |
| US-20130078426-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, AND RESIST FILM, PATTERN FORMING METHOD, METHOD FOR PREPARING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE, EACH USING THE SAME | FUJIFILM CORPORATION (JP) | 2013-03-28 | — | — | US | disclosed |
| US-20130004740-A1 | ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM AND PATTERN FORMING METHOD EACH USING THE COMPOSITION, METHOD FOR PREPARING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2013-01-03 | — | — | US | disclosed |
| US-20120058427-A1 | PATTERN FORMING METHOD, CHEMICAL AMPLIFICATION RESIST COMPOSITION AND RESIST FILM | FUJIFILM CORPORATION (JP) | 2012-03-08 | — | — | US | disclosed |