SCHEMBL1087965

SCHEMBL1087965

C=C(C(=O)O)c1ccc(C2CCCCC2)cc1.C=Cc1ccc(C2CCCCC2)cc1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HAO1 Q9UJM8 1/20 0.50
HDAC8 Q9BY41 2/20 0.45
HDAC6 Q9UBN7 2/20 0.45
HDAC1 Q13547 1/20 0.45
KMT2A Q03164 2/20 0.44
MEN1 O00255 1/20 0.44
NPC1 O15118 1/20 0.44
POLB P06746 1/20 0.44
RAB9A P51151 1/20 0.44
BLM P54132 1/20 0.44
GPR35 Q9HC97 1/20 0.44
DEGS1 O15121 2/20 0.42
HDAC3 O15379 1/20 0.42
HDAC11 Q96DB2 1/20 0.42
TAS1R3 Q7RTX0 1/20 0.41
TAS1R1 Q7RTX1 1/20 0.41
KMO O15229 1/20 0.40
SLC6A7 Q99884 1/20 0.40
SMN1; SMN2 Q16637 2/20 0.39
ACMSD Q8TDX5 2/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1088758 0.89 HAO1 (0.59) HAO1HDAC8HDAC6HDAC1KMT2A
SCHEMBL1088367 0.89 HAO1 (0.59) HAO1HDAC8HDAC6HDAC1KMT2A
SCHEMBL1089207 0.88 HAO1 (0.57) HAO1HDAC8HDAC6HDAC1KMT2A
SCHEMBL14938477 0.81 ALDH1A1 (0.48) HDAC1KMT2AMEN1POLBTAS1R3
SCHEMBL108064 0.81 ALDH1A1 (0.48) HAO1HDAC8HDAC6HDAC1KMT2A
SCHEMBL10492574 0.81 ALDH1A1 (0.48) HAO1HDAC8HDAC6HDAC1KMT2A
SCHEMBL9831633 0.81 ALDH1A1 (0.48) HAO1HDAC8HDAC6HDAC1KMT2A
Methane SCHEMBL21885559 0.79 ALDH1A1 (0.46) HAO1HDAC8HDAC6HDAC1KMT2A
SCHEMBL9830384 0.79 ALDH1A1 (0.50) HAO1HDAC8HDAC6HDAC1KMT2A
SCHEMBL1087968 0.78 NPC1 (0.51) HAO1HDAC8HDAC6HDAC1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8535872-B2 Thermally cured underlayer for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2013-09-17 US disclosed
US-20120178871-A1 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION DE BINOD B (US) 2012-07-12 US disclosed
US-8153346-B2 Hydroxyl containing polymer, amino crosslinking agent and thermal acid generator; undercoating for multilayer lithography material FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2012-04-10 US disclosed
WO-2008103776-A2 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2008-08-28 WO disclosed
US-20080206676-A1 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS, U.S.A, INC 2008-08-28 US disclosed