SCHEMBL1089207

SCHEMBL1089207

C=C(C(=O)O)c1ccc(C2CCCC2)cc1

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HAO1 Q9UJM8 1/20 0.57
HDAC8 Q9BY41 2/20 0.56
HDAC6 Q9UBN7 2/20 0.56
HDAC1 Q13547 1/20 0.56
DEGS1 O15121 2/20 0.46
HDAC3 O15379 1/20 0.46
HDAC11 Q96DB2 1/20 0.46
ACMSD Q8TDX5 2/20 0.45
KMO O15229 1/20 0.45
SMN1; SMN2 Q16637 2/20 0.44
KMT2A Q03164 2/20 0.44
KDM4E B2RXH2 1/20 0.44
GLA P06280 1/20 0.44
HTT P42858 1/20 0.44
HIF1A Q16665 1/20 0.44
TDP1 Q9NUW8 1/20 0.44
L3MBTL1 Q9Y468 1/20 0.44
SERPINE1 P05121 1/20 0.42
NAMPT P43490 1/20 0.41
BCL2L1 Q07817 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1088758 0.98 HAO1 (0.59) HAO1HDAC8HDAC6HDAC1DEGS1
SCHEMBL1088367 0.98 HAO1 (0.59) HAO1HDAC8HDAC6HDAC1DEGS1
SCHEMBL1087965 0.88 HAO1 (0.50) HAO1HDAC8HDAC6HDAC1DEGS1
SCHEMBL1088238 0.86 NPC1 (0.44) HAO1HDAC8HDAC6HDAC1DEGS1
SCHEMBL28334528 0.86 ESR2 (0.52) HAO1HDAC8HDAC6HDAC1DEGS1
SCHEMBL4802628 0.84 HAO1 (0.42) HAO1HDAC8HDAC6HDAC1DEGS1
SCHEMBL1088809 0.84 ESR2 (0.53) HAO1HDAC8HDAC6HDAC1DEGS1
SCHEMBL1088833 0.82 HAO1 (0.41) HAO1HDAC8HDAC6HDAC1DEGS1
SCHEMBL4801277 0.82 NPC1 (0.44) HAO1HDAC8HDAC6HDAC1HDAC3
SCHEMBL1088682 0.80 HAO1 (0.42) HAO1HDAC8HDAC6HDAC1HDAC3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8535872-B2 Thermally cured underlayer for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2013-09-17 US disclosed
US-20120178871-A1 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION DE BINOD B (US) 2012-07-12 US disclosed
US-8153346-B2 Hydroxyl containing polymer, amino crosslinking agent and thermal acid generator; undercoating for multilayer lithography material FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2012-04-10 US disclosed
US-20080206676-A1 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS, U.S.A, INC 2008-08-28 US disclosed
WO-2008103776-A2 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2008-08-28 WO disclosed
US-7416821-B2 Thermally cured undercoat for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2008-08-26 US disclosed
EP-1743363-A2 THERMALLY CURED UNDERCOAT FOR LITHOGRAPHIC APPLICATION FujiFilm Electronic Materials USA, Inc. (US) 2007-01-17 EP disclosed
US-20050238997-A1 Thermally cured undercoat for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. 2005-10-27 US disclosed
WO-2005089150-A2 THERMALLY CURED UNDERCOAT FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS USA INC. (US) 2005-09-29 WO disclosed