Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALPL | P05186 | 2/20 | 0.46 |
| ▸ | ALPI | P09923 | 2/20 | 0.46 |
| ▸ | CA2 | P00918 | 5/20 | 0.33 |
| ▸ | CA12 | O43570 | 3/20 | 0.33 |
| ▸ | CA1 | P00915 | 2/20 | 0.33 |
| ▸ | MMP2 | P08253 | 1/20 | 0.33 |
| ▸ | MMP7 | P09237 | 1/20 | 0.33 |
| ▸ | MMP9 | P14780 | 1/20 | 0.33 |
| ▸ | MMP14 | P50281 | 1/20 | 0.33 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.33 |
| ▸ | CA9 | Q16790 | 1/20 | 0.33 |
| ▸ | CA14 | Q9ULX7 | 1/20 | 0.33 |
| ▸ | CHRM2 | P08172 | 2/20 | 0.32 |
| ▸ | LMNA | P02545 | 1/20 | 0.32 |
| ▸ | CHRM1 | P11229 | 1/20 | 0.32 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.32 |
| ▸ | TSHR | P16473 | 1/20 | 0.32 |
| ▸ | ACHE | P22303 | 1/20 | 0.32 |
| ▸ | KCNH2 | Q12809 | 1/20 | 0.32 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1088213 | 0.86 | ALPL (0.40) | ALPLALPICA2CA12CA1 | |
| SCHEMBL8015484 | 0.83 | ALPL (0.47) | ALPLALPIELANE | |
| SCHEMBL4965022 | 0.81 | ALPL (0.52) | ALPLALPI | |
| SCHEMBL4484229 | 0.80 | TSHR (0.46) | TSHRKMT2A | |
| SCHEMBL2882285 | 0.80 | ALPL (0.54) | ALPLALPI | |
| SCHEMBL926413 | 0.78 | ALPL (0.32) | ALPLALPIKMT2A | |
| SCHEMBL28833567 | 0.78 | ALDH1A1 (0.50) | CA2CA12CA1MMP2MMP9 | |
| SCHEMBL14861976 | 0.77 | ALDH1A1 (0.43) | ALPLALPISMN1; SMN2LMNATSHR | |
| SCHEMBL1056080 | 0.77 | CA1 (0.42) | ALPLALPICA2CA12CA1 | |
| SCHEMBL14862234 | 0.77 | CA12 (0.54) | CA2CA12CA1SMN1; SMN2CA9 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 49 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-5470996-A | Pattern forming material and process for forming pattern using the same | HITACHI, LTD. (JP) | 1995-11-28 | — | — | US | claimed |
| US-5118582-A | PATTERN FORMING MATERIAL AND PROCESS FOR FORMING PATTERN USING THE SAME | HITACHI, LTD. (JP) | 1992-06-02 | — | — | US | claimed |
| EP-2387735-B1 | NONPOLYMERIC BINDERS FOR SEMICONDUCTOR SUBSTRATE COATINGS | FUJIFILM ELECTRONIC MAT USA INC (US) | 2019-03-13 | — | — | EP | disclosed |
| US-8535872-B2 | Thermally cured underlayer for lithographic application | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2013-09-17 | — | — | US | disclosed |
| US-8268540-B2 | Method of manufacturing light receiving device | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2012-09-18 | — | — | US | disclosed |
| EP-2477215-A2 | Resin composition, embedding material, insulating layer and semiconductor device | Sumitomo Bakelite Company Limited (JP) | 2012-07-18 | — | — | EP | disclosed |
| US-20120178871-A1 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | DE BINOD B (US) | 2012-07-12 | — | — | US | disclosed |
| US-8153346-B2 | Hydroxyl containing polymer, amino crosslinking agent and thermal acid generator; undercoating for multilayer lithography material | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2012-04-10 | — | — | US | disclosed |
| US-7999354-B2 | Resin composition, filling material, insulating layer and semiconductor device | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2011-08-16 | — | — | US | disclosed |
| US-7915467-B2 | layer contains a cyclic olefin resin having an epoxy group and a photoacid generator; low stress properties and adhesion; prevent breakage of the semiconductor wafer in a process for grinding the backside to make them thinner | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2011-03-29 | — | — | US | disclosed |
| US-20100193122-A1 | PROCESS FOR MANUFACTURING ELECTRONIC DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2010-08-05 | — | — | US | disclosed |
| EP-0388813-B1 | Pattern forming material and process for forming pattern using the same | HITACHI LTD (JP) | 1997-12-10 | — | — | EP | disclosed |
| US-5565304-A | ALKALI SOLUBLE BINDER RESIN FROM HYDROXYSTYRENEAND METHYLOLATED PHENOLIC COMPOUND | OCG MICROELECTRONIC MATERIALS, INC. (US) | 1996-10-15 | — | — | US | disclosed |
| US-5550004-A | RESIN BINDER HAVING HYDROXYSTYRENE AND MONOMETHYLOLATED PHENOLIC COMPOUNDS | OCG MICROELECTRONIC MATERIALS, INC. (US) | 1996-08-27 | — | — | US | disclosed |
| EP-0727711-A2 | Photoresist compositions containing supercritical fluid fractionated polymeric binder resins | OCG MICROELECTRONIC MATERIALS, INC. (US) | 1996-08-21 | — | — | EP | disclosed |
| EP-0697632-A2 | Chemically amplified radiation-sensitive composition | OCG MICROELECTRONIC MATERIALS, INC. (US) | 1996-02-21 | — | — | EP | disclosed |
| US-5470996-A | Pattern forming material and process for forming pattern using the same | HITACHI, LTD. (JP) | 1995-11-28 | — | — | US | disclosed |
| US-5318876-A | Solutions of water insoluble, base soluble polymeric binder, substituted sulfonium salts, substituted benzenesulfonates, having tolerance for delay between exposure and heating to develop | BASF AKTIENGESELLSCHAFT (DE) | 1994-06-07 | — | — | US | disclosed |
| US-5118582-A | PATTERN FORMING MATERIAL AND PROCESS FOR FORMING PATTERN USING THE SAME | HITACHI, LTD. (JP) | 1992-06-02 | — | — | US | disclosed |
| EP-0388813-A2 | Pattern forming material and process for forming pattern using the same | HITACHI, LTD. (JP) | 1990-09-26 | — | — | EP | disclosed |