SCHEMBL1088564

SCHEMBL1088564

C=Cc1ccc(OC(C)=O)c(Cl)c1

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
JUN P05412 1/20 0.44
NFKB1 P19838 1/20 0.44
PTGS1 P23219 1/20 0.43
KDM4E B2RXH2 4/20 0.41
GAA P10253 2/20 0.41
TSHR P16473 2/20 0.41
ALDH1A1 P00352 2/20 0.41
TRPA1 O75762 1/20 0.41
RAB9A P51151 1/20 0.41
VCP P55072 1/20 0.40
CYP3A4 P08684 2/20 0.40
KMT2A Q03164 2/20 0.40
CFD P00746 1/20 0.40
ALOX12 P18054 1/20 0.40
TDP1 Q9NUW8 1/20 0.40
CBS P35520 1/20 0.39
MEN1 O00255 1/20 0.39
LMNA P02545 1/20 0.39
TTR P02766 1/20 0.39
TP53 P04637 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2391067 0.85 ALDH1A1 (0.55) JUNNFKB1KDM4EGAATSHR
SCHEMBL31518926 0.84 JUN (0.55) JUNNFKB1PTGS1KDM4EGAA
SCHEMBL726364 0.84 JUN (0.55) JUNNFKB1PTGS1KDM4EGAA
SCHEMBL29030377 0.81 TRPA1 (0.50) JUNNFKB1PTGS1KDM4EGAA
SCHEMBL1089315 0.81 JUN (0.45) JUNNFKB1PTGS1KDM4EGAA
SCHEMBL727002 0.80 JUN (0.68) JUNNFKB1PTGS1GAATSHR
SCHEMBL22599120 0.80 JUN (0.44) JUNNFKB1PTGS1KDM4EGAA
SCHEMBL22991600 0.80 JUN (0.44) JUNNFKB1PTGS1KDM4EGAA
SCHEMBL31260194 0.80 JUN (0.68) JUNNFKB1PTGS1GAATSHR
SCHEMBL2144094 0.80 JUN (0.59) JUNNFKB1PTGS1KDM4EGAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8535872-B2 Thermally cured underlayer for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2013-09-17 US disclosed
US-20120178871-A1 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION DE BINOD B (US) 2012-07-12 US disclosed
US-8153346-B2 Hydroxyl containing polymer, amino crosslinking agent and thermal acid generator; undercoating for multilayer lithography material FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2012-04-10 US disclosed
US-20080206676-A1 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS, U.S.A, INC 2008-08-28 US disclosed
WO-2008103776-A2 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2008-08-28 WO disclosed