SCHEMBL1088620

SCHEMBL1088620

O=C(OCC1CC2C=CC1C2)C1CC2CCC1C2

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.39
TDP1 Q9NUW8 2/20 0.39
GAA P10253 1/20 0.39
POLB P06746 2/20 0.38
HPGD P15428 3/20 0.34
KDM4E B2RXH2 2/20 0.34
L3MBTL1 Q9Y468 3/20 0.33
RAB9A P51151 2/20 0.33
KMT2A Q03164 1/20 0.33
EPHX2 P34913 1/20 0.33
HSD11B1 P28845 1/20 0.33
LMNA P02545 1/20 0.33
APEX1 P27695 1/20 0.32
RECQL P46063 1/20 0.32
BLM P54132 1/20 0.32
ESR2 Q92731 1/20 0.32
HSD17B10 Q99714 1/20 0.32
TSHR P16473 1/20 0.32
NPC1 O15118 1/20 0.32
MAPT P10636 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7609159 0.84 ALDH1A1 (0.40) ALDH1A1TDP1GAAPOLBHPGD
SCHEMBL417020 0.81 ALDH1A1 (0.46) ALDH1A1TDP1POLBHPGDKDM4E
SCHEMBL19708550 0.81 ALDH1A1 (0.46) ALDH1A1TDP1POLBHPGDKDM4E
SCHEMBL1088893 0.80 ALDH1A1 (0.44) ALDH1A1TDP1GAAPOLBHPGD
SCHEMBL12481918 0.77 KDM4E (0.42) ALDH1A1TDP1GAAPOLBHPGD
SCHEMBL1088861 0.76 ALDH1A1 (0.38) ALDH1A1TDP1GAAPOLBHPGD
SCHEMBL4401217 0.74 KDM4E (0.39) ALDH1A1TDP1POLBKDM4EEPHX2
SCHEMBL14434848 0.74 KDM4E (0.39) ALDH1A1TDP1POLBKDM4EEPHX2
SCHEMBL21895381 0.74 POLB (0.44) ALDH1A1POLBHPGDL3MBTL1RAB9A
SCHEMBL13841335 0.73 ALDH1A1 (0.41) ALDH1A1TDP1GAAPOLBHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8535872-B2 Thermally cured underlayer for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2013-09-17 US disclosed
US-20120178871-A1 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION DE BINOD B (US) 2012-07-12 US disclosed
US-8153346-B2 Hydroxyl containing polymer, amino crosslinking agent and thermal acid generator; undercoating for multilayer lithography material FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2012-04-10 US disclosed
US-7727705-B2 High etch resistant underlayer compositions for multilayer lithographic processes FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2010-06-01 US disclosed
WO-2008140846-A1 HIGH ETCH RESISTANT UNDERLAYER COMPOSITIONS FOR MULTILAYER LITHOGRAPHIC PROCESSES FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2008-11-20 WO disclosed
WO-2008103776-A2 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2008-08-28 WO disclosed
US-20080206676-A1 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS, U.S.A, INC 2008-08-28 US disclosed
US-20080206667-A1 HIGH ETCH RESISTANT UNDERLAYER COMPOSITIONS FOR MULTILAYER LITHOGRAPHIC PROCESSES FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. 2008-08-28 US disclosed