SCHEMBL1088893

SCHEMBL1088893

O=C(CC1CC2CCC1C2)OCC1CC2C=CC1C2

nearest known ligand 0.53

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 7/20 0.44
MEN1 O00255 4/20 0.44
KMT2A Q03164 4/20 0.44
LMNA P02545 4/20 0.44
MAPT P10636 3/20 0.44
KDM4E B2RXH2 2/20 0.44
HPGD P15428 2/20 0.44
HTT P42858 2/20 0.44
TDP1 Q9NUW8 3/20 0.43
SIRT5 Q9NXA8 1/20 0.43
L3MBTL1 Q9Y468 1/20 0.43
GAA P10253 2/20 0.40
RAB9A P51151 2/20 0.39
RXFP1 Q9HBX9 1/20 0.39
NPC1 O15118 1/20 0.38
MAPK1 P28482 1/20 0.37
POLB P06746 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1088620 0.80 ALDH1A1 (0.39) ALDH1A1KMT2ALMNAMAPTKDM4E
SCHEMBL1089298 0.80 ALDH1A1 (0.41) ALDH1A1MEN1KMT2ALMNAMAPT
SCHEMBL7609159 0.77 ALDH1A1 (0.40) ALDH1A1MEN1KMT2ALMNAMAPT
SCHEMBL414809 0.77 EPHX2 (0.41) ALDH1A1KMT2ALMNAKDM4ETDP1
SCHEMBL13888512 0.75 LMNA (0.33) ALDH1A1LMNAKDM4ETDP1
SCHEMBL32688531 0.75 KDM4E (0.37) ALDH1A1LMNAMAPTKDM4ETDP1
SCHEMBL8614083 0.74 EPHX2 (0.40) ALDH1A1LMNAKDM4ETDP1POLB
SCHEMBL457240 0.74 KDM4E (0.41) ALDH1A1MEN1KMT2ALMNAMAPT
SCHEMBL1087442 0.74 EPHX2 (0.40) ALDH1A1MEN1KMT2ALMNAKDM4E
SCHEMBL15467915 0.74 ALDH1A1 (0.43) ALDH1A1MEN1KMT2AKDM4EHTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8535872-B2 Thermally cured underlayer for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2013-09-17 US disclosed
US-20120178871-A1 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION DE BINOD B (US) 2012-07-12 US disclosed
US-8153346-B2 Hydroxyl containing polymer, amino crosslinking agent and thermal acid generator; undercoating for multilayer lithography material FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2012-04-10 US disclosed
US-7727705-B2 High etch resistant underlayer compositions for multilayer lithographic processes FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2010-06-01 US disclosed
WO-2008140846-A1 HIGH ETCH RESISTANT UNDERLAYER COMPOSITIONS FOR MULTILAYER LITHOGRAPHIC PROCESSES FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2008-11-20 WO disclosed
US-20080206676-A1 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS, U.S.A, INC 2008-08-28 US disclosed
US-20080206667-A1 HIGH ETCH RESISTANT UNDERLAYER COMPOSITIONS FOR MULTILAYER LITHOGRAPHIC PROCESSES FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. 2008-08-28 US disclosed
WO-2008103776-A2 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2008-08-28 WO disclosed