SCHEMBL1088682

SCHEMBL1088682

C=C(C(=O)O)c1ccc(C2CCC(C(C)(C)C)CC2)cc1

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HAO1 Q9UJM8 1/20 0.42
CYP2C9 P11712 1/20 0.41
MAPT P10636 3/20 0.40
ALDH1A1 P00352 2/20 0.40
LMNA P02545 1/20 0.40
GLA P06280 1/20 0.39
MEN1 O00255 3/20 0.38
KMT2A Q03164 3/20 0.38
SLC18A3 Q16572 2/20 0.37
HDAC8 Q9BY41 2/20 0.37
HDAC6 Q9UBN7 2/20 0.37
HDAC1 Q13547 1/20 0.37
HDAC3 O15379 1/20 0.37
HDAC11 Q96DB2 1/20 0.37
HSD11B1 P28845 2/20 0.36
NPC1 O15118 1/20 0.36
RAB9A P51151 1/20 0.36
DGAT1 O75907 1/20 0.35
ESR2 Q92731 1/20 0.34
MAPK1 P28482 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1088809 0.83 ESR2 (0.53) HAO1CYP2C9MAPTALDH1A1LMNA
SCHEMBL28334528 0.81 ESR2 (0.52) HAO1CYP2C9MAPTALDH1A1LMNA
SCHEMBL1088238 0.81 NPC1 (0.44) HAO1CYP2C9MAPTALDH1A1LMNA
SCHEMBL1089207 0.80 HAO1 (0.57) HAO1MAPTALDH1A1GLAMEN1
SCHEMBL4801277 0.80 NPC1 (0.44) HAO1CYP2C9MAPTALDH1A1LMNA
SCHEMBL4802628 0.80 HAO1 (0.42) HAO1CYP2C9MAPTALDH1A1LMNA
SCHEMBL178806 0.79 CYP2C9 (0.68) HAO1CYP2C9MAPTALDH1A1LMNA
SCHEMBL1088758 0.79 HAO1 (0.59) HAO1MAPTALDH1A1GLAMEN1
SCHEMBL1088367 0.79 HAO1 (0.59) HAO1MAPTALDH1A1GLAMEN1
SCHEMBL1089029 0.78 CYP19A1 (0.41) HAO1CYP2C9MAPTALDH1A1LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8535872-B2 Thermally cured underlayer for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2013-09-17 US disclosed
US-20120178871-A1 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION DE BINOD B (US) 2012-07-12 US disclosed
US-8153346-B2 Hydroxyl containing polymer, amino crosslinking agent and thermal acid generator; undercoating for multilayer lithography material FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2012-04-10 US disclosed
US-20080206676-A1 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS, U.S.A, INC 2008-08-28 US disclosed
US-7416821-B2 Thermally cured undercoat for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2008-08-26 US disclosed
EP-1743363-A2 THERMALLY CURED UNDERCOAT FOR LITHOGRAPHIC APPLICATION FujiFilm Electronic Materials USA, Inc. (US) 2007-01-17 EP disclosed
US-20050238997-A1 Thermally cured undercoat for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. 2005-10-27 US disclosed
WO-2005089150-A2 THERMALLY CURED UNDERCOAT FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS USA INC. (US) 2005-09-29 WO disclosed