SCHEMBL1088809

SCHEMBL1088809

C=C(C(=O)O)c1ccc(C2CCC(C)CC2)cc1

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR2 Q92731 2/20 0.53
HAO1 Q9UJM8 1/20 0.42
CYP2C9 P11712 1/20 0.41
HDAC8 Q9BY41 3/20 0.40
HDAC6 Q9UBN7 3/20 0.40
HDAC1 Q13547 1/20 0.40
HDAC3 O15379 2/20 0.40
HDAC11 Q96DB2 2/20 0.40
ALDH1A1 P00352 2/20 0.39
LMNA P02545 1/20 0.39
MAPT P10636 1/20 0.39
NPC1 O15118 1/20 0.39
RAB9A P51151 1/20 0.39
USP2 O75604 1/20 0.38
ACHE P22303 1/20 0.36
HSD11B1 P28845 1/20 0.35
AKR1C3 P42330 1/20 0.34
AKR1C1 Q04828 1/20 0.34
HDAC2 Q92769 1/20 0.34
DEGS1 O15121 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28334528 0.85 ESR2 (0.52) ESR2HAO1CYP2C9HDAC8HDAC6
SCHEMBL1088238 0.85 NPC1 (0.44) ESR2HAO1CYP2C9HDAC8HDAC6
SCHEMBL1089207 0.84 HAO1 (0.57) HAO1HDAC8HDAC6HDAC1HDAC3
SCHEMBL4801277 0.84 NPC1 (0.44) ESR2HAO1CYP2C9HDAC8HDAC6
SCHEMBL4802628 0.83 HAO1 (0.42) ESR2HAO1CYP2C9HDAC8HDAC6
SCHEMBL1088758 0.83 HAO1 (0.59) HAO1HDAC8HDAC6HDAC1HDAC3
SCHEMBL1088367 0.83 HAO1 (0.59) HAO1HDAC8HDAC6HDAC1HDAC3
SCHEMBL1088682 0.83 HAO1 (0.42) ESR2HAO1CYP2C9HDAC8HDAC6
SCHEMBL13186036 0.82 ESR2 (0.60) ESR2HAO1CYP2C9HDAC8HDAC6
SCHEMBL1088833 0.81 HAO1 (0.41) HAO1HDAC8HDAC6HDAC1HDAC3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8535872-B2 Thermally cured underlayer for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2013-09-17 US disclosed
US-20120178871-A1 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION DE BINOD B (US) 2012-07-12 US disclosed
US-8153346-B2 Hydroxyl containing polymer, amino crosslinking agent and thermal acid generator; undercoating for multilayer lithography material FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2012-04-10 US disclosed
US-20080206676-A1 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS, U.S.A, INC 2008-08-28 US disclosed
WO-2008103776-A2 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2008-08-28 WO disclosed
US-7416821-B2 Thermally cured undercoat for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2008-08-26 US disclosed
EP-1743363-A2 THERMALLY CURED UNDERCOAT FOR LITHOGRAPHIC APPLICATION FujiFilm Electronic Materials USA, Inc. (US) 2007-01-17 EP disclosed
US-20050238997-A1 Thermally cured undercoat for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. 2005-10-27 US disclosed
WO-2005089150-A2 THERMALLY CURED UNDERCOAT FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS USA INC. (US) 2005-09-29 WO disclosed