SCHEMBL1088973

SCHEMBL1088973

C=C(Cc1ccc(C2CCCCCC2)cc1)C(=O)O

nearest known ligand 0.51

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HAO1 Q9UJM8 1/20 0.51
RORC P51449 1/20 0.46
HRH3 Q9Y5N1 1/20 0.46
HTR2C P28335 1/20 0.44
HTR2B P41595 1/20 0.44
BCL2L1 Q07817 1/20 0.43
MCL1 Q07820 1/20 0.43
ACMSD Q8TDX5 2/20 0.43
KDM4E B2RXH2 1/20 0.43
GLA P06280 1/20 0.43
HTT P42858 1/20 0.43
KMT2A Q03164 1/20 0.43
SMN1; SMN2 Q16637 1/20 0.43
HIF1A Q16665 1/20 0.43
TDP1 Q9NUW8 1/20 0.43
L3MBTL1 Q9Y468 1/20 0.43
MITF O75030 1/20 0.43
KLF5 Q13887 1/20 0.43
HDAC1 Q13547 1/20 0.42
HDAC8 Q9BY41 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1089454 1.00 HAO1 (0.51) HAO1RORCHRH3HTR2CHTR2B
SCHEMBL1088773 0.98 HAO1 (0.49) HAO1RORCHRH3HTR2CHTR2B
SCHEMBL1088632 0.86 PANK3 (0.41) HAO1HRH3S1PR1S1PR5NPC1
SCHEMBL1089132 0.84 ESR2 (0.49) HAO1RORCHRH3MCL1SMN1; SMN2
SCHEMBL1920783 0.84 HAO1 (0.49) HAO1HRH3HTR2CHTR2BBCL2L1
SCHEMBL4797944 0.84 PANK3 (0.38) HAO1RORCHRH3NPC1RAB9A
SCHEMBL11674678 0.83 HAO1 (0.53) HAO1RORCHRH3HTR2CHTR2B
SCHEMBL2649112 0.83 HAO1 (0.53) HAO1RORCHRH3HTR2CHTR2B
SCHEMBL1089122 0.83 FFAR4 (0.40) HAO1RORCHRH3GLASMN1; SMN2
SCHEMBL1090017 0.82 KMO (0.54) HAO1ACMSDHDAC8NAAAEPHX2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8535872-B2 Thermally cured underlayer for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2013-09-17 US disclosed
US-20120178871-A1 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION DE BINOD B (US) 2012-07-12 US disclosed
US-8153346-B2 Hydroxyl containing polymer, amino crosslinking agent and thermal acid generator; undercoating for multilayer lithography material FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2012-04-10 US disclosed
US-20080206676-A1 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS, U.S.A, INC 2008-08-28 US disclosed
US-7416821-B2 Thermally cured undercoat for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2008-08-26 US disclosed
EP-1743363-A2 THERMALLY CURED UNDERCOAT FOR LITHOGRAPHIC APPLICATION FujiFilm Electronic Materials USA, Inc. (US) 2007-01-17 EP disclosed
US-20050238997-A1 Thermally cured undercoat for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. 2005-10-27 US disclosed
WO-2005089150-A2 THERMALLY CURED UNDERCOAT FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS USA INC. (US) 2005-09-29 WO disclosed