SCHEMBL1089132

SCHEMBL1089132

C=C(Cc1ccc(C2CCC(C)CC2)cc1)C(=O)O

nearest known ligand 0.49

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
ESR2 Q92731 1/20 0.49
PANK3 Q9H999 7/20 0.39
CYP19A1 P11511 1/20 0.38
HRH3 Q9Y5N1 1/20 0.37
NPC1 O15118 2/20 0.36
RAB9A P51151 2/20 0.36
RORC P51449 1/20 0.36
HAO1 Q9UJM8 1/20 0.36
CACNA1G O43497 1/20 0.36
CACNA1H O95180 1/20 0.36
CACNA1I Q9P0X4 1/20 0.36
ALDH1A1 P00352 2/20 0.36
CYP2C19 P33261 1/20 0.36
MCL1 Q07820 1/20 0.36
KDM4C Q9H3R0 1/20 0.36
CYP2C9 P11712 1/20 0.35
SMN1; SMN2 Q16637 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1088632 0.86 PANK3 (0.41) PANK3HRH3NPC1RAB9AHAO1
SCHEMBL1088773 0.86 HAO1 (0.49) HRH3RORCHAO1ALDH1A1MCL1
SCHEMBL4809032 0.85 NPC1 (0.41) PANK3HRH3NPC1RAB9ARORC
SCHEMBL4797944 0.85 PANK3 (0.38) PANK3HRH3NPC1RAB9ARORC
SCHEMBL1088973 0.84 HAO1 (0.51) HRH3NPC1RAB9ARORCHAO1
SCHEMBL1089454 0.84 HAO1 (0.51) HRH3NPC1RAB9ARORCHAO1
SCHEMBL1089029 0.84 CYP19A1 (0.41) PANK3CYP19A1RORCHAO1ALDH1A1
SCHEMBL1089122 0.83 FFAR4 (0.40) HRH3RORCHAO1ALDH1A1SMN1; SMN2
SCHEMBL4802987 0.82 ALDH1A1 (0.45) PANK3HRH3NPC1RAB9ARORC
SCHEMBL15043560 0.77 ESR2 (0.50) ESR2PANK3CYP19A1RORCCACNA1G

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8535872-B2 Thermally cured underlayer for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2013-09-17 US disclosed
US-20120178871-A1 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION DE BINOD B (US) 2012-07-12 US disclosed
US-8153346-B2 Hydroxyl containing polymer, amino crosslinking agent and thermal acid generator; undercoating for multilayer lithography material FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2012-04-10 US disclosed
US-20080206676-A1 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS, U.S.A, INC 2008-08-28 US disclosed
WO-2008103776-A2 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2008-08-28 WO disclosed
US-7416821-B2 Thermally cured undercoat for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2008-08-26 US disclosed
EP-1743363-A2 THERMALLY CURED UNDERCOAT FOR LITHOGRAPHIC APPLICATION FujiFilm Electronic Materials USA, Inc. (US) 2007-01-17 EP disclosed
US-20050238997-A1 Thermally cured undercoat for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. 2005-10-27 US disclosed
WO-2005089150-A2 THERMALLY CURED UNDERCOAT FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS USA INC. (US) 2005-09-29 WO disclosed