SCHEMBL1089102

SCHEMBL1089102

C=C(CC12CCC(C1)C2)C(=O)O

nearest known ligand 0.33

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.33
POLB P06746 1/20 0.33
P2RX7 Q99572 1/20 0.30
SMN1; SMN2 Q16637 1/20 0.30
KDM4E B2RXH2 1/20 0.30
HPGD P15428 1/20 0.30
CYP1A2 P05177 1/20 0.30
GAA P10253 1/20 0.30
BPTF Q12830 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL418818 0.92 KDM4E (0.35) ALDH1A1POLBP2RX7SMN1; SMN2KDM4E
SCHEMBL701574 0.88 TET2 (0.30)
SCHEMBL4804370 0.86 CYP1A2 (0.33) KDM4EHPGDCYP1A2BPTF
SCHEMBL19400064 0.81 CYP1A2 (0.35) ALDH1A1POLBCYP1A2BPTF
SCHEMBL704030 0.80 ALDH1A1 (0.50) ALDH1A1POLBP2RX7SMN1; SMN2BPTF
SCHEMBL3680659 0.77 GAA (0.53) ALDH1A1POLBGAA
SCHEMBL1088144 0.73 POLB (0.33) ALDH1A1POLBGAA
SCHEMBL5354981 0.72 ALDH1A1 (0.39) ALDH1A1POLBP2RX7SMN1; SMN2BPTF
SCHEMBL1089318 0.72 POLB (0.46) ALDH1A1POLBHPGDGAA
SCHEMBL4579249 0.72 MEN1 (0.47) CYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8535872-B2 Thermally cured underlayer for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2013-09-17 US disclosed
US-20120178871-A1 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION DE BINOD B (US) 2012-07-12 US disclosed
US-8153346-B2 Hydroxyl containing polymer, amino crosslinking agent and thermal acid generator; undercoating for multilayer lithography material FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2012-04-10 US disclosed
WO-2008103776-A2 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2008-08-28 WO disclosed
US-20080206676-A1 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS, U.S.A, INC 2008-08-28 US disclosed
US-7416821-B2 Thermally cured undercoat for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2008-08-26 US disclosed
EP-1743363-A2 THERMALLY CURED UNDERCOAT FOR LITHOGRAPHIC APPLICATION FujiFilm Electronic Materials USA, Inc. (US) 2007-01-17 EP disclosed
US-20050238997-A1 Thermally cured undercoat for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. 2005-10-27 US disclosed
WO-2005089150-A2 THERMALLY CURED UNDERCOAT FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS USA INC. (US) 2005-09-29 WO disclosed