SCHEMBL1089463

SCHEMBL1089463

O=C(CCC1CC2C=CC1C2)OC1CC2CCC1C2

nearest known ligand 0.46

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
CYP19A1 P11511 1/20 0.44
TDP1 Q9NUW8 3/20 0.40
ALDH1A1 P00352 3/20 0.40
GAA P10253 1/20 0.40
ATM Q13315 1/20 0.39
KDM4E B2RXH2 6/20 0.35
GRM1 Q13255 4/20 0.34
EPHX2 P34913 1/20 0.34
PKM P14618 2/20 0.32
POLB P06746 1/20 0.31
ALOX15 P16050 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2995532 0.77 CYP19A1 (0.56) CYP19A1ALDH1A1ATMGRM1EPHX2
SCHEMBL11907466 0.75 ALDH1A1 (0.45) CYP19A1TDP1ALDH1A1GAAATM
SCHEMBL3870190 0.74 ATM (0.43) CYP19A1TDP1ALDH1A1GAAATM
SCHEMBL1089298 0.74 ALDH1A1 (0.41) CYP19A1TDP1ALDH1A1GAAKDM4E
SCHEMBL15467671 0.74 ALDH1A1 (0.40) CYP19A1TDP1ALDH1A1GAAKDM4E
SCHEMBL4104590 0.73 ALDH1A1 (0.40) TDP1ALDH1A1GAAKDM4EEPHX2
SCHEMBL32688759 0.73 ALDH1A1 (0.40) TDP1ALDH1A1GAAKDM4EEPHX2
SCHEMBL7278307 0.71 CYP19A1 (0.51) CYP19A1ALDH1A1ATMGRM1EPHX2
SCHEMBL1720769 0.71 ATM (0.53) CYP19A1ALDH1A1ATMGRM1POLB
SCHEMBL9142723 0.71 CYP19A1 (0.51) CYP19A1ALDH1A1ATMGRM1EPHX2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8535872-B2 Thermally cured underlayer for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2013-09-17 US disclosed
US-20120178871-A1 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION DE BINOD B (US) 2012-07-12 US disclosed
US-8153346-B2 Hydroxyl containing polymer, amino crosslinking agent and thermal acid generator; undercoating for multilayer lithography material FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2012-04-10 US disclosed
WO-2008103776-A2 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2008-08-28 WO disclosed
US-20080206676-A1 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS, U.S.A, INC 2008-08-28 US disclosed