Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | APLNR | P35414 | 2/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL31263697 | 0.95 | — | — | |
| SCHEMBL31263637 | 0.81 | ACHE (0.32) | — | |
| SCHEMBL6369437 | 0.81 | LMNA (0.38) | — | |
| Hydrochloric Acid SCHEMBL31263429 | 0.79 | ACHE (0.31) | — | |
| SCHEMBL491332 | 0.74 | APLNR (0.35) | APLNR | |
| SCHEMBL31263613 | 0.74 | — | — | |
| SCHEMBL2010475 | 0.72 | CA1 (0.31) | — | |
| SCHEMBL8236493 | 0.71 | — | — | |
| SCHEMBL63567 | 0.71 | — | — | |
| SCHEMBL1353564 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8153260-B2 | Composite material | ADEKA CORPORATION (JP) | 2012-04-10 | — | — | US | disclosed |
| US-7851121-B2 | Photosensitive polyimide composition and polyimide precursor composition | CENTRAL GLASS CO., LTD. (JP) | 2010-12-14 | — | — | US | disclosed |
| US-20100112323-A1 | COMPOSITE MATERIAL | ADEKA CORPORATION (JP) | 2010-05-06 | — | — | US | disclosed |
| CN-101652250-A | Composite material | ADEKA CORP JP | 2010-02-17 | — | — | CN | disclosed |
| US-20090176172-A1 | PHOTOSENSITIVE POLYIMIDE COMPOSITION AND POLYIMIDE PRECURSOR COMPOSITION | CENTRAL GLASS CO., LTD. (JP) | 2009-07-09 | — | — | US | disclosed |
| US-6316170-B2 | COATING, EXPOSURE, DEVELOPMENT AND HEAT TREATMENT | KABUSHIKI KAISHA TOSHIBA (JP) | 2001-11-13 | — | — | US | disclosed |
| US-20010006767-A1 | Developing solution and method of forming polyimide pattern by using the developing solution | YOSHIAKI KAWAMONZEN | 2001-07-05 | — | — | US | disclosed |
| US-6183934-B1 | FOE USE IN FORMATION OF PATTERN OF INSULATION FILM, PASSIVATION FILM, .ALPHA.-RAY SHIELDING FILM, OPTICAL WAVEGUIDE | KABUSHIKI KAISHA TOSHIBA (JP) | 2001-02-06 | — | — | US | disclosed |
| US-6159654-A | Negative photosensitive polymer composition of a thermosetting polymer precursor curable by cyclodehydration upon heating | KABUSHIKI KAISHA TOSHIBA (JP) | 2000-12-12 | — | — | US | disclosed |
| US-6001517-A | A THERMOSETTING POLYMER WHICH CAN BE CURED THROUGH CYCLODEHYDRATION UPON HEATING AND A CURE ACCELERATOR WHICH CAN BE DEACTIVATED OF ITS CURE ACCELERATION PROPERTY BY IRRIDIATION OF LIGHT | KABUSHIKI KAISHA TOSHIBA (JP) | 1999-12-14 | — | — | US | disclosed |
| US-5756650-A | COMPOSITION COMPRISING POLYAMIC ACID, CURE ACCELERATOR SELECTED FROM GROUP CONSISTING OF NITROGEN-CONTAINING HETEROCYCLIC COMPOUND, AMINO ACID COMPOUND, AROMATIC COMPOUND HAVING TWO OR MORE HYDROXYL GROUPS | KABUSHIKI KAISHA TOSHIBA (JP) | 1998-05-26 | — | — | US | disclosed |
| US-5578697-A | DIELECTRIC POLYMERS FOR ELECTRONICS | KABUSHIKI KAISHA TOSHIBA (JP) | 1996-11-26 | — | — | US | disclosed |