Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA12 | O43570 | 1/20 | 0.48 |
| ▸ | CA1 | P00915 | 1/20 | 0.48 |
| ▸ | CA2 | P00918 | 1/20 | 0.48 |
| ▸ | CA4 | P22748 | 1/20 | 0.48 |
| ▸ | CA6 | P23280 | 1/20 | 0.48 |
| ▸ | CA5A | P35218 | 1/20 | 0.48 |
| ▸ | CA7 | P43166 | 1/20 | 0.48 |
| ▸ | CA9 | Q16790 | 1/20 | 0.48 |
| ▸ | CA14 | Q9ULX7 | 1/20 | 0.48 |
| ▸ | CA5B | Q9Y2D0 | 1/20 | 0.48 |
| ▸ | TSHR | P16473 | 2/20 | 0.46 |
| ▸ | GLA | P06280 | 1/20 | 0.46 |
| ▸ | POLB | P06746 | 1/20 | 0.46 |
| ▸ | GAA | P10253 | 1/20 | 0.46 |
| ▸ | CFTR | P13569 | 2/20 | 0.38 |
| ▸ | KIF11 | P52732 | 2/20 | 0.38 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.37 |
| ▸ | MEN1 | O00255 | 1/20 | 0.37 |
| ▸ | USP2 | O75604 | 1/20 | 0.37 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrochloric Acid SCHEMBL8643220 | 0.97 | CA12 (0.46) | CA12CA1CA2CA4CA6 | |
| SCHEMBL27082424 | 0.94 | CA12 (0.45) | CA12CA1CA2CA4CA6 | |
| SCHEMBL10662268 | 0.90 | TSHR (0.44) | CA12CA1CA2CA4CA6 | |
| SCHEMBL22607168 | 0.89 | GLA (0.50) | CA12CA1CA2CA4CA6 | |
| SCHEMBL13385803 | 0.89 | GLA (0.50) | CA12CA1CA2CA4CA6 | |
| SCHEMBL29725318 | 0.87 | CA2 (0.48) | CA12CA1CA2CA4CA6 | |
| SCHEMBL3189421 | 0.87 | CA2 (0.48) | CA12CA1CA2CA4CA6 | |
| SCHEMBL15695593 | 0.84 | TSHR (0.52) | CA12CA1CA2CA4CA6 | |
| SCHEMBL5522928 | 0.84 | CA12 (0.44) | CA12CA1CA2CA4CA6 | |
| SCHEMBL17986783 | 0.84 | PARP1 (0.40) | CA12CA1CA2CA4CA6 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 156 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-120005188-A | Polyimide film and preparation method thereof | 中天电子材料有限公司 | 2025-05-16 | — | — | CN | claimed |
| CN-118184603-A | Diamine monomer containing piperazine unit, polyimide acid salt separation membrane, and preparation method and application thereof | 天津科技大学 | 2024-06-14 | — | — | CN | claimed |
| CN-117659399-A | Intrinsic color polyimide with main chain containing chromophore, and preparation method and application thereof | 上海大学 | 2024-03-08 | — | — | CN | claimed |
| CN-117342998-A | Diamine monomer containing N-aminophthalimide structure, preparation method thereof, polyimide compound and application | 浙江工业大学 | 2024-01-05 | — | — | CN | claimed |
| CN-115536845-B | Preparation method of hydrophobic polyimide resin and application of hydrophobic polyimide resin in enameled wire | 科城铜业(英德)有限公司 | 2023-07-21 | — | — | CN | claimed |
| CN-116003793-A | Polyamide-imide film and preparation method thereof | 株洲时代华昇新材料技术有限公司 | 2023-04-25 | — | — | CN | claimed |
| CN-115536845-A | Preparation method of hydrophobic polyimide resin and application of hydrophobic polyimide resin in enameled wire | 科城铜业(英德)有限公司 | 2022-12-30 | — | — | CN | claimed |
| CN-111171567-B | Polyimide composite film and preparation method and application thereof | 中山职业技术学院 | 2022-07-26 | — | — | CN | claimed |
| EP-2092807-B1 | COMPOSITE ORGANIC ENCAPSULANTS | CDA PROC LTD LIABILITY COMPANY (US) | 2013-04-17 | — | — | EP | claimed |
| US-7745516-B2 | Composition of polyimide and sterically-hindered hydrophobic epoxy | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 2010-06-29 | — | — | US | claimed |
| US-20090111948-A1 | Compositions comprising polyimide and hydrophobic epoxy and phenolic resins, and methods relating thereto | CDA PROCESSING LIMITED LIABILITY COMPANY | 2009-04-30 | — | — | US | claimed |
| EP-1943311-A1 | COMPOSITIONS COMPRISING POLYIMIDE AND HYDROPHOBIC EPOXY, AND METHODS RELATING THERETO | E.I.Du pont de nemours and company (US) | 2008-07-16 | — | — | EP | claimed |
| US-20070290379-A1 | Hydrophobic compositions for electronic applications | E. I. DU PONT DE NEMOURS AND COMPANY | 2007-12-20 | — | — | US | claimed |
| WO-2007047384-A1 | COMPOSITIONS COMPRISING POLYIMIDE AND HYDROPHOBIC EPOXY, AND METHODS RELATING THERETO | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 2007-04-26 | — | — | WO | claimed |
| US-20070083016-A1 | Photosensitive polyimide compositions | E. I. DUPONT DE NEMOURS AND COMPANY | 2007-04-12 | — | — | US | claimed |
| US-20070083017-A1 | Compositions comprising polyimide and hydrophobic epoxy, and methods relating thereto | CDA PROCESSING LIMITED LIABILITY COMPANY | 2007-04-12 | — | — | US | claimed |
| EP-0568977-B1 | Stabilized aminobenzotrifluorides | HOECHST AG (DE) | 1996-08-21 | — | — | EP | claimed |
| US-5349104-A | Base stabilized compound for heat resistance and storage stability | HOECHST AKTIENGESELLSCHAFT (DE) | 1994-09-20 | — | — | US | claimed |
| EP-0568977-A2 | Stabilized aminobenzotrifluorides | HOECHST AKTIENGESELLSCHAFT (DE) | 1993-11-10 | — | — | EP | claimed |
| US-20250346020-A1 | LAMINATE AND DISPLAY | KANEKA CORPORATION (JP) | 2025-11-13 | — | — | US | disclosed |
| US-20250320338-A1 | TRANSPARENT FILM, HARD COAT FILM, AND DISPLAY | KANEKA CORPORATION (JP) | 2025-10-16 | — | — | US | disclosed |
| CN-120005188-A | Polyimide film and preparation method thereof | 中天电子材料有限公司 | 2025-05-16 | — | — | CN | disclosed |
| WO-2025100302-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND SEMICONDUCTOR DEVICE | 旭化成株式会社 | 2025-05-15 | — | — | WO | disclosed |
| CN-119948089-A | Hard coating film and display | 株式会社钟化 | 2025-05-06 | — | — | CN | disclosed |
| US-20250138422-A1 | PHOTOSENSITIVE RESIN COMPOSITION, MANUFACTURING METHOD OF ELECTRONIC DEVICE, AND ELECTRONIC DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2025-05-01 | — | — | US | disclosed |
| US-20250109264-A1 | FILM, METHOD FOR MANUFACTURING SAME, AND IMAGE DISPLAY DEVICE | KANEKA CORPORATION (JP) | 2025-04-03 | — | — | US | disclosed |
| US-12234323-B2 | Transparent polyimide film and production method therefor | KANEKA CORPORATION (JP) | 2025-02-25 | — | — | US | disclosed |
| CN-119403881-A | Resin composition, molded article, and film | 株式会社钟化 | 2025-02-07 | — | — | CN | disclosed |
| CN-119234485-A | Laminate body | 三菱瓦斯化学株式会社 | 2024-12-31 | — | — | CN | disclosed |
| US-20240392131-A1 | RESIN COMPOSITION, MOLDED BODY, AND FILM | KANEKA CORPORATION (JP) | 2024-11-28 | — | — | US | disclosed |
| CN-118974146-A | Film, method for producing the same, and image display device | 株式会社钟化 | 2024-11-15 | — | — | CN | disclosed |
| WO-2024204317-A1 | RESIN COMPOSITION, FILM, FILM SET, OPTICAL WAVEGUIDE, PHOTOELECTRIC COMPOSITE SUBSTRATE, AND ELECTRONIC COMPONENT | 住友ベークライト株式会社 | 2024-10-03 | — | — | WO | disclosed |
| WO-2024172021-A1 | HARD COATING FILM, METHOD FOR PRODUCING SAME, AND DISPLAY | 株式会社カネカ | 2024-08-22 | — | — | WO | disclosed |
| CN-117279780-B | Laminated substrate, laminated body manufacturing method, laminated body with member for electronic device, and electronic device manufacturing method | ＡＧＣ株式会社 | 2024-08-16 | — | — | CN | disclosed |
| WO-2024166911-A1 | LAMINATE AND DISPLAY | 株式会社カネカ | 2024-08-15 | — | — | WO | disclosed |
| CN-118488991-A | Resin composition, molded article and film | 株式会社钟化 | 2024-08-13 | — | — | CN | disclosed |
| WO-2024157935-A1 | LAMINATE AND DISPLAY | 株式会社カネカ | 2024-08-02 | — | — | WO | disclosed |
| CN-118339218-A | Film, method for producing the same, and image display device | 株式会社钟化 | 2024-07-12 | — | — | CN | disclosed |
| WO-2024143295-A1 | TRANSPARENT FILM, HARD COAT FILM, AND DISPLAY | 株式会社カネカ | 2024-07-04 | — | — | WO | disclosed |
| WO-2024143296-A1 | LAMINATE AND DISPLAY | 株式会社カネカ | 2024-07-04 | — | — | WO | disclosed |
| US-20240199878-A1 | RESIN COMPOSITION, FORMED ARTICLE AND FILM | KANEKA CORPORATION (JP) | 2024-06-20 | — | — | US | disclosed |
| CN-118215713-A | Resin composition, molded article and film | 株式会社钟化 | 2024-06-18 | — | — | CN | disclosed |
| CN-118184603-A | Diamine monomer containing piperazine unit, polyimide acid salt separation membrane, and preparation method and application thereof | 天津科技大学 | 2024-06-14 | — | — | CN | disclosed |
| CN-117940515-A | Resin composition, molded article, and film | 株式会社钟化 | 2024-04-26 | — | — | CN | disclosed |
| WO-2024071314-A1 | HARD COAT FILM AND DISPLAY | 株式会社カネカ | 2024-04-04 | — | — | WO | disclosed |
| WO-2024053564-A1 | PHOTOSENSITIVE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE | 住友ベークライト株式会社 | 2024-03-14 | — | — | WO | disclosed |
| CN-117659399-A | Intrinsic color polyimide with main chain containing chromophore, and preparation method and application thereof | 上海大学 | 2024-03-08 | — | — | CN | disclosed |
| WO-2023249079-A1 | RESIN COMPOSITION, MOLDED BODY, AND FILM | 株式会社カネカ | 2023-12-28 | — | — | WO | disclosed |
| CN-117279780-A | Laminated substrate, laminated body manufacturing method, laminated body with member for electronic device, and electronic device manufacturing method | ＡＧＣ株式会社 | 2023-12-22 | — | — | CN | disclosed |
| CN-117202984-A | Polyimide porous film | 东京应化工业株式会社 | 2023-12-08 | — | — | CN | disclosed |
| WO-2023228986-A1 | LAMINATE | 三菱瓦斯化学株式会社 | 2023-11-30 | — | — | WO | disclosed |
| CN-114026179-B | Transparent polyimide film and method for producing same | 株式会社钟化 | 2023-11-24 | — | — | CN | disclosed |
| CN-112823184-B | Method for producing transparent polyimide film | 株式会社钟化 | 2023-11-07 | — | — | CN | disclosed |
| US-11806661-B2 | Polymer and method for producing the same, gas separation membrane, gas separation module, and gas separation apparatus using the polymer, and m-phenylenediamine compound | FUJIFILM CORPORATION (JP) | 2023-11-07 | — | — | US | disclosed |
| WO-2023195525-A1 | FILM, METHOD FOR MANUFACTURING SAME, AND IMAGE DISPLAY DEVICE | 株式会社カネカ | 2023-10-12 | — | — | WO | disclosed |
| CN-116867846-A | Polyimide film, method for producing the same, hard coat film, and image display device | 株式会社钟化 | 2023-10-10 | — | — | CN | disclosed |
| WO-2023190309-A1 | SURFACE-MODIFIER RESIN COMPOSITION | 住友ベークライト株式会社 | 2023-10-05 | — | — | WO | disclosed |
| CN-113906083-B | Polyimide resin and method for producing same, and polyimide film and method for producing same | 株式会社钟化 | 2023-08-22 | — | — | CN | disclosed |
| WO-2023149435-A1 | RESIN COMPOSITION, MOLDED OBJECT, AND FILM | 株式会社カネカ | 2023-08-10 | — | — | WO | disclosed |
| CN-115536845-B | Preparation method of hydrophobic polyimide resin and application of hydrophobic polyimide resin in enameled wire | 科城铜业(英德)有限公司 | 2023-07-21 | — | — | CN | disclosed |
| CN-115536845-B | Preparation method of hydrophobic polyimide resin and application of hydrophobic polyimide resin in enameled wire | 科城铜业(英德)有限公司 | 2023-07-21 | — | — | CN | disclosed |
| WO-2023132310-A1 | RESIN COMPOSITION, MOLDED BODY, AND FILM | 株式会社カネカ | 2023-07-13 | — | — | WO | disclosed |
| CN-116419848-A | Hard coat film, method for producing same, and image display device | 株式会社钟化 | 2023-07-11 | — | — | CN | disclosed |
| CN-112079743-B | Diamine, polyimide and polyimide film | 浙江中科玖源新材料有限公司 | 2023-06-27 | — | — | CN | disclosed |
| WO-2023100806-A1 | FILM, PRODUCTION METHOD THEREFOR, AND IMAGE DISPLAY DEVICE | 株式会社カネカ | 2023-06-08 | — | — | WO | disclosed |
| CN-111699218-B | Hybrid resin composition | 日产化学株式会社 | 2023-05-26 | — | — | CN | disclosed |
| WO-2023085325-A1 | RESIN COMPOSITION, MOLDED BODY AND FILM | 株式会社カネカ | 2023-05-19 | — | — | WO | disclosed |
| CN-116003793-A | Polyamide-imide film and preparation method thereof | 株洲时代华昇新材料技术有限公司 | 2023-04-25 | — | — | CN | disclosed |
| WO-2023054381-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING ELECTRONIC DEVICE, ELECTRONIC DEVICE AND LIGHT DEVICE | 住友ベークライト株式会社 | 2023-04-06 | — | — | WO | disclosed |
| WO-2023021684-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE | 住友ベークライト株式会社 | 2023-02-23 | — | — | WO | disclosed |
| WO-2023021688-A1 | PHOTOSENSITIVE RESIN COMPOSITION, ELECTRONIC DEVICE MANUFACTURING METHOD, AND ELECTRONIC DEVICE | 住友ベークライト株式会社 | 2023-02-23 | — | — | WO | disclosed |
| CN-115536845-A | Preparation method of hydrophobic polyimide resin and application of hydrophobic polyimide resin in enameled wire | 科城铜业(英德)有限公司 | 2022-12-30 | — | — | CN | disclosed |
| CN-115536845-A | Preparation method of hydrophobic polyimide resin and application of hydrophobic polyimide resin in enameled wire | 科城铜业(英德)有限公司 | 2022-12-30 | — | — | CN | disclosed |
| US-20220411584-A1 | Transparent Polyimide Film and Production Method Therefor | KANEKA CORPORATION (JP) | 2022-12-29 | — | — | US | disclosed |
| WO-2022230546-A1 | POROUS POLYIMIDE FILM | 東京応化工業株式会社 | 2022-11-03 | — | — | WO | disclosed |
| WO-2022224933-A1 | LAMINATED SUBSTRATE, LAMINATE, METHOD FOR PRODUCING LAMINATE, LAMINATE EQUIPPED WITH MEMBER FOR ELECTRONIC DEVICE, AND METHOD FOR PRODUCING ELECTRONIC DEVICE | ＡＧＣ株式会社 | 2022-10-27 | — | — | WO | disclosed |
| US-20220282089-A1 | RESIN COMPOSITION AND FILM | KANEKA CORPORATION (JP) | 2022-09-08 | — | — | US | disclosed |
| WO-2022176919-A1 | POLYIMIDE FILM AND PRODUCTION METHOD THEREFOR, HARDCOAT FILM, AND IMAGE DISPLAY DEVICE | 株式会社カネカ | 2022-08-25 | — | — | WO | disclosed |
| CN-111344130-B | Method for manufacturing substrate for flexible device | 日产化学株式会社 | 2022-08-19 | — | — | CN | disclosed |
| CN-114846082-A | Resin composition and film | 株式会社钟化 | 2022-08-02 | — | — | CN | disclosed |
| CN-111171567-B | Polyimide composite film and preparation method and application thereof | 中山职业技术学院 | 2022-07-26 | — | — | CN | disclosed |
| CN-112639038-B | Hard coat composition, polyimide film with hard coat layer, method for producing the same, and image display device | 株式会社钟化 | 2022-07-15 | — | — | CN | disclosed |
| WO-2022124195-A1 | POLYIMIDE RESIN, POLYIMIDE FILM AND MANUFACTURING METHOD THEREFOR | 株式会社カネカ | 2022-06-16 | — | — | WO | disclosed |
| WO-2022085735-A1 | HARD COATING FILM, METHOD FOR PRODUCING SAME, AND IMAGE DISPLAY DEVICE | 株式会社カネカ | 2022-04-28 | — | — | WO | disclosed |
| US-20210394113-A1 | POLYMER AND METHOD FOR PRODUCING THE SAME, GAS SEPARATION MEMBRANE, GAS SEPARATION MODULE, AND GAS SEPARATION APPARATUS USING THE POLYMER, AND m-PHENYLENEDIAMINE COMPOUND | FUJIFILM CORPORATION (JP) | 2021-12-23 | — | — | US | disclosed |
| US-20210179795-A1 | HARD COAT COMPOSITION, HARD COAT-EQUIPPED POLYIMIDE FILM, METHOD FOR MANUFACTURING THE SAME, AND IMAGE DISPLAY DEVICE | KANEKA CORPORATION (JP) | 2021-06-17 | — | — | US | disclosed |
| US-20210115192-A1 | POLYIMIDE RESIN, PRODUCTION METHOD FOR POLYIMIDE RESIN, POLYIMIDE FILM, AND PRODUCTION METHOD FOR POLYIMIDE FILM | KANEKA CORPORATION (JP) | 2021-04-22 | — | — | US | disclosed |
| US-10974207-B2 | Gas separation membrane, gas separation membrane module, and gas separation device | FUJIFILM CORPORATION (JP) | 2021-04-13 | — | — | US | disclosed |
| WO-2021027099-A1 | POLYIMIDE, PREPARATION METHOD THEREFOR AND FLEXIBLE OLED PANEL | 武汉华星光电半导体显示技术有限公司 | 2021-02-18 | — | — | WO | disclosed |
| US-10654005-B2 | Method for producing gas separation composite membrane, liquid composition, gas separation composite membrane, gas separation module, gas separation apparatus, and gas separation method | FUJIFILM CORPORATION (JP) | 2020-05-19 | — | — | US | disclosed |
| US-10537859-B2 | Gas separation membrane, gas separation module, gas separation device, gas separation method, and polyimide compound | FUJIFILM CORPORATION (JP) | 2020-01-21 | — | — | US | disclosed |
| US-20190176081-A1 | GAS SEPARATION MEMBRANE, GAS SEPARATION MODULE, GAS SEPARATION DEVICE, GAS SEPARATION METHOD, AND POLYIMIDE COMPOUND | FUJIFILM CORPORATION (JP) | 2019-06-13 | — | — | US | disclosed |
| US-20190091635-A1 | GAS SEPARATION MEMBRANE, GAS SEPARATION MEMBRANE MODULE, AND GAS SEPARATION DEVICE | FUJIFILM CORPORATION (JP) | 2019-03-28 | — | — | US | disclosed |
| US-20190076777-A1 | GAS SEPARATION MEMBRANE, GAS SEPARATION MEMBRANE MODULE, AND GAS SEPARATION DEVICE | FUJIFILM CORPORATION (JP) | 2019-03-14 | — | — | US | disclosed |
| US-10226743-B2 | Gas separation composite membrane, gas separation module, gas separation device, gas separation method, and method of producing gas separation composite membrane | FUJIFILM CORPORATION (JP) | 2019-03-12 | — | — | US | disclosed |
| US-10040035-B2 | Gas separation membrane, gas separation module, gas separation device, and gas separation method | FUJIFILM CORPORATION (JP) | 2018-08-07 | — | — | US | disclosed |
| US-20180147546-A1 | METHOD FOR PRODUCING GAS SEPARATION COMPOSITE MEMBRANE, LIQUID COMPOSITION, GAS SEPARATION COMPOSITE MEMBRANE, GAS SEPARATION MODULE, GAS SEPARATION APPARATUS, AND GAS SEPARATION METHOD | FUJIFILM CORPORATION (JP) | 2018-05-31 | — | — | US | disclosed |
| US-20180085716-A1 | GAS SEPARATION MEMBRANE, GAS SEPARATION MODULE, GAS SEPARATION DEVICE, GAS SEPARATION METHOD, AND POLYIMIDE COMPOUND | FUJIFILM CORPORATION (JP) | 2018-03-29 | — | — | US | disclosed |
| US-9889412-B2 | Composite gas separation membrane, gas separation module, gas separation apparatus and gas separation method | FUJIFILM CORPORATION (JP) | 2018-02-13 | — | — | US | disclosed |
| US-9764293-B2 | Gas separation composite membrane, method of producing the same, gas separating module using the same, and gas separation apparatus and gas separation method | FUJIFILM CORPORATION (JP) | 2017-09-19 | — | — | US | disclosed |
| US-9687777-B2 | Gas separation composite membrane, gas separation module, gas separation apparatus, gas separation method, and method of producing gas separation composite membrane | FUJIFILM CORPORATION (JP) | 2017-06-27 | — | — | US | disclosed |
| US-20170014754-A1 | GAS SEPARATION COMPOSITE AND METHOD OF PRODUCING SAME | FUJIFILM CORPORATION (JP) | 2017-01-19 | — | — | US | disclosed |
| US-20160310911-A1 | GAS SEPARATION COMPOSITE MEMBRANE, GAS SEPARATION MODULE, GAS SEPARATION DEVICE, GAS SEPARATION METHOD, AND METHOD OF PRODUCING GAS SEPARATION COMPOSITE MEMBRANE | FUJIFILM CORPORATION (JP) | 2016-10-27 | — | — | US | disclosed |
| US-9452392-B2 | Gas separation composite membrane and method of producing the same, and gas separating module, gas separation apparatus and gas separation method using the same | FUJIFILM CORPORATION (JP) | 2016-09-27 | — | — | US | disclosed |
| US-20160199790-A1 | GAS SEPARATION MEMBRANE, GAS SEPARATION MODULE, GAS SEPARATION DEVICE, AND GAS SEPARATION METHOD | FUJIFILM CORPORATION (JP) | 2016-07-14 | — | — | US | disclosed |
| US-20160184779-A1 | COMPOSITE GAS SEPARATION MEMBRANE, GAS SEPARATION MODULE, GAS SEPARATION APPARATUS AND GAS SEPARATION METHOD | FUJIFILM CORPORATION (JP) | 2016-06-30 | — | — | US | disclosed |
| US-9272248-B2 | Gas separation composite membrane, and gas separating module, gas separation apparatus and gas separation method using the same | FUJIFILM CORPORATION (JP) | 2016-03-01 | — | — | US | disclosed |
| US-9238204-B2 | Gas separation composite membrane and gas separating module, gas separation apparatus and gas separation method using the same | FUJIFILM CORPORATION (JP) | 2016-01-19 | — | — | US | disclosed |
| US-20150265964-A1 | GAS SEPARATION COMPOSITE MEMBRANE, GAS SEPARATION MODULE, GAS SEPARATION APPARATUS, GAS SEPARATION METHOD, AND METHOD OF PRODUCING GAS SEPARATION COMPOSITE MEMBRANE | FUJIFILM CORPORATION (JP) | 2015-09-24 | — | — | US | disclosed |
| US-20150011726-A1 | DIAMINE, POLYIMIDE, AND POLYIMIDE FILM AND UTILIZATION THEREOF | TOHO UNIVERSITY (JP) | 2015-01-08 | — | — | US | disclosed |
| US-20140352534-A1 | GAS SEPARATION COMPOSITE MEMBRANE, METHOD OF PRODUCING THE SAME, GAS SEPARATING MODULE USING THE SAME, AND GAS SEPARATION APPARATUS AND GAS SEPARATION METHOD | FUJIFILM CORPORATION (JP) | 2014-12-04 | — | — | US | disclosed |
| US-20140345456-A1 | GAS SEPARATION COMPOSITE MEMBRANE AND METHOD OF PRODUCING THE SAME, AND GAS SEPARATING MODULE, GAS SEPARATION APPARATUS AND GAS SEPARATION METHOD USING THE SAME | FUJIFILM CORPORATION (JP) | 2014-11-27 | — | — | US | disclosed |
| CN-104066768-A | Resin composition for display substrates | NISSAN CHEMICAL IND LTD | 2014-09-24 | — | — | CN | disclosed |
| CN-104066769-A | Resin composition for display substrates | NISSAN CHEMICAL IND LTD | 2014-09-24 | — | — | CN | disclosed |
| US-20140130669-A1 | GAS SEPARATION COMPOSITE MEMBRANE, AND GAS SEPARATING MODULE, GAS SEPARATION APPARATUS AND GAS SEPARATION METHOD USING THE SAME | FUJIFILM CORPORATION (JP) | 2014-05-15 | — | — | US | disclosed |
| US-20140130668-A1 | GAS SEPARATION COMPOSITE MEMBRANE AND GAS SEPARATING MODULE, GAS SEPARATION APPARATUS AND GAS SEPARATION METHOD USING THE SAME | FUJIFILM CORPORATION (JP) | 2014-05-15 | — | — | US | disclosed |
| US-8466252-B2 | Optical film, optical film manufacturing method, transparent substrate, image display device, and solar cell | KANEKA CORPORATION (JP) | 2013-06-18 | — | — | US | disclosed |
| EP-2092807-B1 | COMPOSITE ORGANIC ENCAPSULANTS | CDA PROC LTD LIABILITY COMPANY (US) | 2013-04-17 | — | — | EP | disclosed |
| US-20120270999-A1 | OPTICAL FILM, OPTICAL FILM MANUFACTURING METHOD, TRANSPARENT SUBSTRATE, IMAGE DISPLAY DEVICE, AND SOLAR CELL | KANEKA CORPORATION (JP) | 2012-10-25 | — | — | US | disclosed |
| US-8233261-B2 | Composite organic encapsulants | CDA PROCESSING LIMITED LIABILITY COMPANY (US) | 2012-07-31 | — | — | US | disclosed |
| US-8153260-B2 | Composite material | ADEKA CORPORATION (JP) | 2012-04-10 | — | — | US | disclosed |
| US-7851121-B2 | Photosensitive polyimide composition and polyimide precursor composition | CENTRAL GLASS CO., LTD. (JP) | 2010-12-14 | — | — | US | disclosed |
| US-7745516-B2 | Composition of polyimide and sterically-hindered hydrophobic epoxy | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 2010-06-29 | — | — | US | disclosed |
| US-20100112323-A1 | COMPOSITE MATERIAL | ADEKA CORPORATION (JP) | 2010-05-06 | — | — | US | disclosed |
| US-20100085680-A1 | CRYSTALLINE ENCAPSULANTS | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 2010-04-08 | — | — | US | disclosed |
| US-20100067168-A1 | COMPOSITE ORGANIC ENCAPSULANTS | E.I. DU PONT DE NEMOURS AND COMPANY Patents Records Center/Dupont Legal (DE) | 2010-03-18 | — | — | US | disclosed |
| US-7604754-B2 | Resistor compositions for electronic circuitry applications | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 2009-10-20 | — | — | US | disclosed |
| EP-2102268-A2 | CRYSTALLINE ENCAPSULANTS | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 2009-09-23 | — | — | EP | disclosed |
| EP-2092807-A2 | COMPOSITE ORGANIC ENCAPSULANTS | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 2009-08-26 | — | — | EP | disclosed |
| US-20090176172-A1 | PHOTOSENSITIVE POLYIMIDE COMPOSITION AND POLYIMIDE PRECURSOR COMPOSITION | CENTRAL GLASS CO., LTD. (JP) | 2009-07-09 | — | — | US | disclosed |
| US-20090111948-A1 | Compositions comprising polyimide and hydrophobic epoxy and phenolic resins, and methods relating thereto | CDA PROCESSING LIMITED LIABILITY COMPANY | 2009-04-30 | — | — | US | disclosed |
| EP-2027184-A2 | HYDROPHOBIC COMPOSITIONS FOR ELECTRONIC APPLICATIONS | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 2009-02-25 | — | — | EP | disclosed |
| EP-2027757-A1 | ORGANIC ENCAPSULANT COMPOSITIONS BASED ON HETEROCYCLIC POLYMERS FOR PROTECTION OF ELECTRONIC COMPONENTS | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 2009-02-25 | — | — | EP | disclosed |
| US-20080185561-A1 | Resistor compositions for electronic circuitry applications | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2008-08-07 | — | — | US | disclosed |
| US-20080185361-A1 | Compositions for electronic circuitry applications and methods relating thereto | CDA PROCESSING LIMITED LIABILITY COMPANY | 2008-08-07 | — | — | US | disclosed |
| EP-1943311-A1 | COMPOSITIONS COMPRISING POLYIMIDE AND HYDROPHOBIC EPOXY, AND METHODS RELATING THERETO | E.I.Du pont de nemours and company (US) | 2008-07-16 | — | — | EP | disclosed |
| WO-2008073410-A2 | CRYSTALLINE ENCAPSULANTS | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 2008-06-19 | — | — | WO | disclosed |
| WO-2008073409-A2 | COMPOSITE ORGANIC ENCAPSULANTS | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 2008-06-19 | — | — | WO | disclosed |
| WO-2007146383-A1 | ORGANIC ENCAPSULANT COMPOSITIONS BASED ON HETEROCYCLIC POLYMERS FOR PROTECTION OF ELECTRONIC COMPONENTS | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 2007-12-21 | — | — | WO | disclosed |
| WO-2007146382-A2 | HYDROPHOBIC COMPOSITIONS FOR ELECTRONIC APPLICATIONS | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 2007-12-21 | — | — | WO | disclosed |
| US-20070291440-A1 | Organic encapsulant compositions based on heterocyclic polymers for protection of electronic components | E. I. DU PONT DE NEMOURS AND COMPANY | 2007-12-20 | — | — | US | disclosed |
| US-20070290379-A1 | Hydrophobic compositions for electronic applications | E. I. DU PONT DE NEMOURS AND COMPANY | 2007-12-20 | — | — | US | disclosed |
| WO-2007047384-A1 | COMPOSITIONS COMPRISING POLYIMIDE AND HYDROPHOBIC EPOXY, AND METHODS RELATING THERETO | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 2007-04-26 | — | — | WO | disclosed |
| US-20070083016-A1 | Photosensitive polyimide compositions | E. I. DUPONT DE NEMOURS AND COMPANY | 2007-04-12 | — | — | US | disclosed |
| US-20070083017-A1 | Compositions comprising polyimide and hydrophobic epoxy, and methods relating thereto | CDA PROCESSING LIMITED LIABILITY COMPANY | 2007-04-12 | — | — | US | disclosed |
| US-6316170-B2 | COATING, EXPOSURE, DEVELOPMENT AND HEAT TREATMENT | KABUSHIKI KAISHA TOSHIBA (JP) | 2001-11-13 | — | — | US | disclosed |
| US-20010006767-A1 | Developing solution and method of forming polyimide pattern by using the developing solution | YOSHIAKI KAWAMONZEN | 2001-07-05 | — | — | US | disclosed |
| US-6183934-B1 | FOE USE IN FORMATION OF PATTERN OF INSULATION FILM, PASSIVATION FILM, .ALPHA.-RAY SHIELDING FILM, OPTICAL WAVEGUIDE | KABUSHIKI KAISHA TOSHIBA (JP) | 2001-02-06 | — | — | US | disclosed |
| US-6159654-A | Negative photosensitive polymer composition of a thermosetting polymer precursor curable by cyclodehydration upon heating | KABUSHIKI KAISHA TOSHIBA (JP) | 2000-12-12 | — | — | US | disclosed |
| US-6001517-A | A THERMOSETTING POLYMER WHICH CAN BE CURED THROUGH CYCLODEHYDRATION UPON HEATING AND A CURE ACCELERATOR WHICH CAN BE DEACTIVATED OF ITS CURE ACCELERATION PROPERTY BY IRRIDIATION OF LIGHT | KABUSHIKI KAISHA TOSHIBA (JP) | 1999-12-14 | — | — | US | disclosed |
| US-5756650-A | COMPOSITION COMPRISING POLYAMIC ACID, CURE ACCELERATOR SELECTED FROM GROUP CONSISTING OF NITROGEN-CONTAINING HETEROCYCLIC COMPOUND, AMINO ACID COMPOUND, AROMATIC COMPOUND HAVING TWO OR MORE HYDROXYL GROUPS | KABUSHIKI KAISHA TOSHIBA (JP) | 1998-05-26 | — | — | US | disclosed |
| US-5578697-A | DIELECTRIC POLYMERS FOR ELECTRONICS | KABUSHIKI KAISHA TOSHIBA (JP) | 1996-11-26 | — | — | US | disclosed |
| US-5324813-A | High molecular weight | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1994-06-28 | — | — | US | disclosed |
| EP-0594947-A2 | Low dielectric constant fluorinated polymers and methods of fabrication thereof | International Business Machines Corporation (US) | 1994-05-04 | — | — | EP | disclosed |
| US-4065449-A | Tetrachloro substituted disazo pigments | CIBA-GEIGY CORPORATION (US) | 1977-12-27 | — | — | US | disclosed |
| US-3994921-A | COLORING PLASTICS AND LACQUERS YELLOW | CIBA-GEIGY CORPORATION (US) | 1976-11-30 | — | — | US | disclosed |
| US-3994921-A | COLORING PLASTICS AND LACQUERS YELLOW | CIBA-GEIGY CORPORATION (US) | 1976-11-30 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20210394113-A1 | POLYMER AND METHOD FOR PRODUCING THE SAME, GAS SEPARATION MEMBRANE, GAS SEPARATION MODULE, AND GAS SEPARATION APPARATUS USING THE POLYMER, AND m-PHENYLENEDIAMINE COMPOUND | PRMT9, PRMT1, PNMT | CA12 1432/4885CA1 1088/4885CA2 2721/4885 |
| US-11806661-B2 | Polymer and method for producing the same, gas separation membrane, gas separation module, and gas separation apparatus using the polymer, and m-phenylenediamine compound | PRMT9, PRMT1, PNMT | CA12 1432/4885CA1 1088/4885CA2 2721/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.