SCHEMBL11065660

SCHEMBL11065660

O=S(=O)(O)CCOCC#CCOCCS(=O)(=O)O

nearest known ligand 0.42

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
PTGS1 P23219 1/20 0.42
PDE4A P27815 1/20 0.42
LMNA P02545 1/20 0.36
SLC6A6 P31641 1/20 0.36
CYP2C19 P33261 1/20 0.36
BLM P54132 1/20 0.36
APP P05067 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28438799 0.87 ADAM17 (0.36) PTGS1PDE4ALMNASLC6A6CYP2C19
SCHEMBL11079760 0.81 TSHR (0.45) PTGS1PDE4ALMNASLC6A6CYP2C19
SCHEMBL418534 0.81 PTGS1 (0.53) PTGS1PDE4ALMNASLC6A6CYP2C19
SCHEMBL5904821 0.79 APP (0.35) APP
SCHEMBL28038731 0.78 PTGS1 (0.50) PTGS1PDE4ALMNASLC6A6CYP2C19
SCHEMBL7869938 0.78 PTGS1 (0.50) PTGS1PDE4ALMNASLC6A6CYP2C19
SCHEMBL31325977 0.75 POLB (0.30)
SCHEMBL1155608 0.72
SCHEMBL375597 0.72 TSHR (0.53) PTGS1PDE4ALMNASLC6A6CYP2C19
SCHEMBL263732 0.72 APP (0.46) PTGS1PDE4ALMNASLC6A6CYP2C19

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4196007-A OXY-SUBSTITUTED ACETYLENIC HUMECTANT, DIRECT DYE WHITTAKER CORPORATION (US) 1980-04-01 US claimed
US-4170482-A Jet printing ink composition containing an acetylenic compound and a lactone M & T CHEMICALS INC. (US) 1979-10-09 US claimed
CN-119121333-A Composition for cobalt or cobalt alloy electroplating 巴斯夫欧洲公司 2024-12-13 CN disclosed
CN-112154228-B Composition for cobalt or cobalt alloy electroplating 巴斯夫欧洲公司 2024-09-24 CN disclosed
CN-118475728-A Alkaline composition for copper electroplating comprising a defect reducing agent 巴斯夫欧洲公司 2024-08-09 CN disclosed
CN-118451219-A Alkaline composition for copper electroplating comprising a grain refiner 巴斯夫欧洲公司 2024-08-06 CN disclosed
EP-3714085-B1 COMPOSITION FOR COBALT ELECTROPLATING COMPRISING LEVELING AGENT BASF SE (DE) 2023-08-09 EP disclosed
US-20230203694-A1 ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A GRAIN REFINER BASF SE (DE) 2023-06-29 US disclosed
US-20230203695-A1 Alkaline Composition For Copper Electroplating Comprising A Defect Reduction Agent BASF SE (DE) 2023-06-29 US disclosed
US-11585004-B2 Composition for cobalt or cobalt alloy electroplating BASF SE (DE) 2023-02-21 US disclosed
US-11377748-B2 Composition for cobalt electroplating comprising leveling agent BASF SE (DE) 2022-07-05 US disclosed
US-20210040635-A1 COMPOSITION FOR COBALT PLATING COMPRISING ADDITIVE FOR VOID-FREE SUBMICRON FEATURE FILLING BASF SE (DE) 2021-02-11 US disclosed
US-20200347503-A1 COMPOSITION FOR COBALT ELECTROPLATING COMPRISING LEVELING AGENT BASF SE (DE) 2020-11-05 US disclosed
CN-111344438-A Composition for electroplating cobalt comprising leveling agent 巴斯夫欧洲公司 2020-06-26 CN disclosed
US-20190226107-A1 COMPOSITION FOR COBALT PLATING COMPRISING ADDITIVE FOR VOID-FREE SUBMICRON FEATURE FILLING BASF SE (DE) 2019-07-25 US disclosed
EP-0025694-B1 BRIGHT NICKEL PLATING BATH AND PROCESS AND COMPOSITION THEREFOR M & T CHEMICALS, INC. (US) 1984-03-28 EP disclosed
US-4435254-A ACETYLENIC AMINES AND SULFONATES M&T CHEMICALS INC. (US) 1984-03-06 US disclosed
EP-0025694-A1 Bright nickel plating bath and process and composition therefor M & T CHEMICALS, INC. (US) 1981-03-25 EP disclosed
US-4069112-A UNSATURATED CYCLOSULFONE M & T CHEMICALS INC. (US) 1978-01-17 US disclosed
US-4046647-A BETA-SUBSTITUTED, GAMMA-SUBSTITUTED, OR BETA, GAMMA-DISUBSTITUTED SULFONE M&T CHEMICALS INC. (US) 1977-09-06 US disclosed