⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1889268 | 0.96 | — | — | |
| Dimethylamine SCHEMBL8207427 | 0.89 | — | — | |
| SCHEMBL27923946 | 0.86 | TSHR (0.38) | — | |
| SCHEMBL12361970 | 0.84 | — | — | |
| SCHEMBL4849944 | 0.84 | — | — | |
| SCHEMBL5846089 | 0.83 | — | — | |
| SCHEMBL3672238 | 0.78 | DNM1 (0.41) | — | |
| SCHEMBL6277887 | 0.78 | — | — | |
| SCHEMBL10711374 | 0.78 | — | — | |
| SCHEMBL2005777 | 0.78 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 64 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240173235-A1 | PERSONAL CARE COMPOSITIONS COMPRISING SILAHYDROCARBONS | MOMENTIVE PERFORMANCE MATERIALS INC. | 2024-05-30 | — | — | US | claimed |
| EP-4322915-A1 | PERSONAL CARE COMPOSITIONS COMPRISING SILAHYDROCARBONS | Momentive Performance Materials Inc. (US) | 2024-02-21 | — | — | EP | claimed |
| CN-117425467-A | Personal care compositions comprising silicone based | 迈图高新材料公司 | 2024-01-19 | — | — | CN | claimed |
| WO-2022221354-A1 | PERSONAL CARE COMPOSITIONS COMPRISING SILAHYDROCARBONS | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2022-10-20 | — | — | WO | claimed |
| US-8822619-B1 | Directed self assembly copolymer composition and related methods | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2014-09-02 | — | — | US | claimed |
| US-8822615-B1 | Block copolymer composition and methods relating thereto | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2014-09-02 | — | — | US | claimed |
| US-20140227445-A1 | Directed self assembly copolymer composition and related methods | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2014-08-14 | — | — | US | claimed |
| US-20140227448-A1 | Block copolymer composition and methods relating thereto | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2014-08-14 | — | — | US | claimed |
| US-6436824-B1 | Low dielectric constant materials for copper damascene | CHARTERED SEMICONDUCTOR MANUFACTURING LTD. (SG) | 2002-08-20 | — | — | US | claimed |
| WO-2000050478-A1 | NOVEL FORMULATIONS OF ALKYLLITHIUMS WITH IMPROVED THERMAL STABILITY, PROCESSES TO PRODUCE THESE FORMULATIONS AND PROCESSES FOR USING THE SAME TO IMPROVE STABILITY OF LIVING POLYMER CHAIN ENDS | FMC CORPORATION (US) | 2000-08-31 | — | — | WO | claimed |
| US-20240173235-A1 | PERSONAL CARE COMPOSITIONS COMPRISING SILAHYDROCARBONS | MOMENTIVE PERFORMANCE MATERIALS INC. | 2024-05-30 | — | — | US | disclosed |
| EP-4322915-A1 | PERSONAL CARE COMPOSITIONS COMPRISING SILAHYDROCARBONS | Momentive Performance Materials Inc. (US) | 2024-02-21 | — | — | EP | disclosed |
| CN-117425467-A | Personal care compositions comprising silicone based | 迈图高新材料公司 | 2024-01-19 | — | — | CN | disclosed |
| WO-2022221354-A1 | PERSONAL CARE COMPOSITIONS COMPRISING SILAHYDROCARBONS | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2022-10-20 | — | — | WO | disclosed |
| US-9856349-B2 | Catalysts and methods for polymer synthesis | SAUDI ARAMCO TECHNOLOGIES COMPANY (SA) | 2018-01-02 | — | — | US | disclosed |
| CN-1512196-A | Optical element with anti reflective film | ������������ʽ���� | 2004-07-14 | — | — | CN | disclosed |
| EP-1433809-A1 | Optical member having antireflection film | HOYA CORPORATION (JP) | 2004-06-30 | — | — | EP | disclosed |
| US-6649314-B1 | Forming latent image; toner developing; charge erasing to remove residual surface charge; transferring image to receiver | NEXPRESS SOLUTIONS LLC | 2003-11-18 | — | — | US | disclosed |
| US-6436824-B1 | Low dielectric constant materials for copper damascene | CHARTERED SEMICONDUCTOR MANUFACTURING LTD. (SG) | 2002-08-20 | — | — | US | disclosed |
| WO-2000050478-A1 | NOVEL FORMULATIONS OF ALKYLLITHIUMS WITH IMPROVED THERMAL STABILITY, PROCESSES TO PRODUCE THESE FORMULATIONS AND PROCESSES FOR USING THE SAME TO IMPROVE STABILITY OF LIVING POLYMER CHAIN ENDS | FMC CORPORATION (US) | 2000-08-31 | — | — | WO | disclosed |