Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 1/20 | 0.32 |
| ▸ | TP53 | P04637 | 1/20 | 0.32 |
| ▸ | TSHR | P16473 | 1/20 | 0.32 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.32 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL472141 | 0.84 | CYP2C19 (0.39) | TP53TSHRSMN1; SMN2ALDH1A1 | |
| SCHEMBL472139 | 0.78 | NPSR1 (0.34) | LMNASMN1; SMN2 | |
| SCHEMBL13744290 | 0.74 | — | — | |
| SCHEMBL7640695 | 0.72 | TSHR (0.35) | LMNATP53TSHRSMN1; SMN2ALDH1A1 | |
| SCHEMBL4754739 | 0.72 | LMNA (0.37) | LMNATP53TSHRSMN1; SMN2ALDH1A1 | |
| SCHEMBL472143 | 0.70 | BRD4 (0.39) | SMN1; SMN2 | |
| SCHEMBL9657499 | 0.70 | LMNA (0.33) | LMNATP53TSHRSMN1; SMN2ALDH1A1 | |
| SCHEMBL5430000 | 0.69 | SMN1; SMN2 (0.40) | LMNATP53TSHRSMN1; SMN2ALDH1A1 | |
| SCHEMBL7902014 | 0.69 | LMNA (0.32) | LMNATP53TSHRSMN1; SMN2ALDH1A1 | |
| SCHEMBL11357195 | 0.69 | LMNA (0.32) | LMNATP53TSHRSMN1; SMN2ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20060147719-A1 | Curable epoxy composition with colloidal silica and phenolic resins on substrates | MOMENTIVE PERFORMANCE MATERIALS INC. | 2006-07-06 | — | — | US | claimed |
| JP-9067356-A | — | — | None | — | — | JP | disclosed |
| CN-115838362-A | Preparation method of alicyclic epoxy resin containing ester group or ether group | 中国石油化工股份有限公司 | 2023-03-24 | — | — | CN | disclosed |
| CN-104271667-B | Curable epoxy resin compositions and composites made therefrom | 陶氏环球技术有限责任公司 | 2018-01-26 | — | — | CN | disclosed |
| CN-103443669-B | Polaroid and liquid crystal indicator | 住友化学株式会社 | 2016-10-12 | — | — | CN | disclosed |
| CN-102471454-B | Prepare the method for granular epoxy resin | DOW GLOBAL TECHNOLOGIES LLC (US) | 2015-11-25 | — | — | CN | disclosed |
| CN-104837921-A | A curable epoxy composition and a composite made therefrom | DOW GLOBAL TECHNOLOGIES INC | 2015-08-12 | — | — | CN | disclosed |
| CN-101842401-B | Non-sintering isocyanate modified epoxy resin for fusion bonded epoxy applications | DOW GLOBAL TECHNOLOGY INC | 2015-06-24 | — | — | CN | disclosed |
| CN-101923245-B | Liquid crystal display device and polarizing plate used in the same | SUMITOMO CHEMICAL CO | 2015-06-17 | — | — | CN | disclosed |
| CN-104704018-A | Core shell rubber modified solid epoxy resins | DOW GLOBAL TECHNOLOGIES INC | 2015-06-10 | — | — | CN | disclosed |
| CN-1875477-A | Solvent-modified resin system containing filler that has high Tg, transparency and good reliability in wafer level underfill applications | GEN ELECTRIC (US) | 2006-12-06 | — | — | CN | disclosed |
| WO-2006107660-A1 | REFRACTORY SOLID, ADHESIVE COMPOSITION, AND DEVICE, AND ASSOCIATED METHOD | GENERAL ELECTRIC COMPANY (US) | 2006-10-12 | — | — | WO | disclosed |
| WO-2006107793-A1 | METHOD FOR PRODUCING CURE SYSTEM, ADHESIVE SYSTEM, AND ELECTRONIC DEVICE | GENERAL ELECTRIC COMPANY (US) | 2006-10-12 | — | — | WO | disclosed |
| WO-2006107792-A1 | CURE SYSTEM, ADHESIVE SYSTEM, ELECTRONIC DEVICE | GENERAL ELECTRIC COMPANY (US) | 2006-10-12 | — | — | WO | disclosed |
| US-20060219757-A1 | Method for producing cure system, adhesive system, and electronic device | GENERAL ELECTRIC COMPANY | 2006-10-05 | — | — | US | disclosed |
| US-20060223933-A1 | Cure system, adhesive system, electronic device | GENERAL ELECTRIC COMPANY | 2006-10-05 | — | — | US | disclosed |
| US-20060147719-A1 | Curable epoxy composition with colloidal silica and phenolic resins on substrates | MOMENTIVE PERFORMANCE MATERIALS INC. | 2006-07-06 | — | — | US | disclosed |
| US-20050266263-A1 | Refractory solid, adhesive composition, and device, and associated method | GENERAL ELECTRIC COMPANY | 2005-12-01 | — | — | US | disclosed |
| JP-H0967356-A | PURIFICATION OF CRUDE EPOXIDATION REACTION SOLUTION | DAICEL CHEM IND LTD | 1997-03-11 | — | — | JP | disclosed |
| CN-1118795-A | Reduced gloss, flame retarded, high impact thermoplastic composition | GEN ELECTRIC (US) | 1996-03-20 | — | — | CN | disclosed |