SCHEMBL1123795

SCHEMBL1123795

C1=C2C3CC3C3CC3C2C2CC3CCCC1C32

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1123940 0.73
SCHEMBL2382753 0.58 ALDH1A1 (0.30)
SCHEMBL31406992 0.51
SCHEMBL4534039 0.50 ALDH1A1 (0.37)
SCHEMBL22213458 0.49
SCHEMBL17479374 0.49
SCHEMBL1123944 0.49
SCHEMBL17400836 0.49 NOS1 (0.33)
SCHEMBL5443628 0.49 MAPT (0.34)
SCHEMBL1408600 0.49 ALDH1A1 (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-3031230-A None JP disclosed
EP-4644439-A1 COPOLYMER, PRODUCING METHOD FOR SAME, AND CURED BODY CONTAINING COPOLYMER Denka Company Limited (JP) 2025-11-05 EP disclosed
EP-4632012-A1 RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, AND PRINTED SUBSTRATE Zeon Corporation (JP) 2025-10-15 EP disclosed
WO-2025028516-A1 UNCURED SHEET AND CURED BODY OF SAME デンカ株式会社 2025-02-06 WO disclosed
WO-2024143509-A1 COPOLYMER, PRODUCING METHOD FOR SAME, AND CURED BODY CONTAINING COPOLYMER デンカ株式会社 2024-07-04 WO disclosed
WO-2024122426-A1 RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, AND PRINTED SUBSTRATE 日本ゼオン株式会社 2024-06-13 WO disclosed
US-20110130484-A1 PROCESS FOR PRODUCING POLYMER ALLOY AND POLYMER ALLOY SEKISUI CHEMICAL CO., LTD. (JP) 2011-06-02 US disclosed
EP-1473328-B1 RESIN COMPOSITION SEKISUI CHEMICAL CO LTD (JP) 2011-05-04 EP disclosed
EP-2284212-A1 PROCESS FOR PRODUCING POLYMER ALLOY AND POLYMER ALLOY Sekisui Chemical Co., Ltd. (JP) 2011-02-16 EP disclosed
US-7754803-B2 Resin composition SEKISUI CHEMICAL CO., LTD. (JP) 2010-07-13 US disclosed
EP-1316947-A1 MAGNETIC DISK SUBSTRATE AND MAGNETIC DISK Zeon Corporation (JP) 2003-06-04 EP disclosed
US-6060527-A ROLLING THE RECORDING MEDIA AND CONTACTING WITH HOT WATER SEPARATING THE COATING FILM PEELED FROM THE RECORDING MEDIA, GRINDING THE RESULTING RECORDING MEDIA AND TREATING WITH HOT WATER TO DETACH THIN METAL FILM; RECOVERING RECORDING MEDIA TEIJIN CHEMICALS LTD (JP) 2000-05-09 US disclosed
EP-0900639-A1 METHOD OF RECOVERING RESIN Teijin Chemicals, Ltd. (JP) 1999-03-10 EP disclosed
EP-0498564-B1 Thermoplastic saturated norbornene group polymer composition NIPPON ZEON CO (JP) 1998-04-08 EP disclosed
EP-0405843-B1 Molding material NIPPON ZEON CO (JP) 1995-04-05 EP disclosed
US-5276098-A Thermoplastic saturated norbornene group polymer composition NIPPON ZEON CO., LTD. (JP) 1994-01-04 US disclosed
US-5143979-A Hydrogenated polymer formed by ring-opening polymerization of a norbornene-type polymer NIPPON ZEON CO., LTD (JP) 1992-09-01 US disclosed
EP-0498564-A2 Thermoplastic saturated norbornene group polymer composition NIPPON ZEON CO., LTD. (JP) 1992-08-12 EP disclosed
JP-H0331230-A CONDENSED RING-CONTAINING COMPOUND KURARAY CO LTD 1991-02-12 JP disclosed
EP-0405843-A2 Molding material NIPPON ZEON CO., LTD. (JP) 1991-01-02 EP disclosed