Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.63 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.50 |
| ▸ | HTT | P42858 | 1/20 | 0.45 |
| ▸ | ABCC1 | P33527 | 1/20 | 0.43 |
| ▸ | RECQL | P46063 | 1/20 | 0.42 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.42 |
| ▸ | TSHR | P16473 | 1/20 | 0.42 |
| ▸ | HDAC3 | O15379 | 1/20 | 0.41 |
| ▸ | HDAC4 | P56524 | 1/20 | 0.41 |
| ▸ | HDAC1 | Q13547 | 1/20 | 0.41 |
| ▸ | HDAC7 | Q8WUI4 | 1/20 | 0.41 |
| ▸ | HDAC2 | Q92769 | 1/20 | 0.41 |
| ▸ | HDAC10 | Q969S8 | 1/20 | 0.41 |
| ▸ | HDAC11 | Q96DB2 | 1/20 | 0.41 |
| ▸ | HDAC8 | Q9BY41 | 1/20 | 0.41 |
| ▸ | HDAC6 | Q9UBN7 | 1/20 | 0.41 |
| ▸ | HDAC9 | Q9UKV0 | 1/20 | 0.41 |
| ▸ | HDAC5 | Q9UQL6 | 1/20 | 0.41 |
| ▸ | POLB | P06746 | 1/20 | 0.41 |
| ▸ | TP53 | P04637 | 1/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30295469 | 1.00 | ALDH1A1 (0.63) | ALDH1A1L3MBTL1HTTABCC1RECQL | |
| SCHEMBL27328773 | 0.86 | ALDH1A1 (0.60) | ALDH1A1L3MBTL1HTTABCC1TSHR | |
| SCHEMBL30761772 | 0.84 | ALDH1A1 (0.56) | ALDH1A1HTTABCC1RECQLSMN1; SMN2 | |
| SCHEMBL7089269 | 0.84 | ALDH1A1 (0.56) | ALDH1A1HTTABCC1RECQLSMN1; SMN2 | |
| SCHEMBL4048833 | 0.77 | GAA (0.53) | ALDH1A1HTTTSHRTP53GAA | |
| SCHEMBL30782571 | 0.77 | GAA (0.53) | ALDH1A1HTTTSHRTP53GAA | |
| SCHEMBL5814278 | 0.77 | NPC1 (0.64) | ALDH1A1HTTSMN1; SMN2POLB | |
| SCHEMBL11807130 | 0.77 | ALDH1A1 (0.51) | ALDH1A1L3MBTL1HTTABCC1TP53 | |
| SCHEMBL29840042 | 0.76 | GAA (0.52) | ALDH1A1L3MBTL1HTTRECQLSMN1; SMN2 | |
| SCHEMBL465541 | 0.76 | GAA (0.52) | ALDH1A1L3MBTL1HTTRECQLSMN1; SMN2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3248066-B1 | LIQUID ELECTROPHOTOGRAPHIC VARNISH COMPOSITION | HP INDIGO BV (NL) | 2022-04-20 | — | — | EP | claimed |
| US-10168629-B2 | Liquid electrophotographic varnish composition | HP INDIGO B.V. (NL) | 2019-01-01 | — | — | US | claimed |
| US-20180004104-A1 | LIQUID ELECTROPHOTOGRAPHIC VARNISH COMPOSITION | HP INDIGO B.V. (NL) | 2018-01-04 | — | — | US | claimed |
| EP-3248066-A1 | LIQUID ELECTROPHOTOGRAPHIC VARNISH COMPOSITION | Hewlett-Packard Indigo B.V. (NL) | 2017-11-29 | — | — | EP | claimed |
| US-9353256-B2 | Epoxy resin composition for fiber-reinforced composite material | THE YOKOHAMA RUBBER CO., LTD. (JP) | 2016-05-31 | — | — | US | claimed |
| EP-2708567-B1 | EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL | YOKOHAMA RUBBER CO LTD (JP) | 2016-04-06 | — | — | EP | claimed |
| EP-2708567-A1 | EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL | The Yokohama Rubber Co., Ltd. (JP) | 2014-03-19 | — | — | EP | claimed |
| US-20110027574-A1 | COATING FOR ELASTOMERIC SUBSTRATES | LORD CORPORATION (US) | 2011-02-03 | — | — | US | claimed |
| US-6893736-B2 | Thermosetting resin compositions useful as underfill sealants | HENKEL CORPORATION (US) | 2005-05-17 | — | — | US | claimed |
| US-20030131937-A1 | Thermosetting resin compositions useful as underfill sealants | HENKEL LOCTITE CORPORATION | 2003-07-17 | — | — | US | claimed |
| US-20030054173-A1 | Flexible epoxy sound damping coatings | DOW CHEMICAL COMPANY, THE | 2003-03-20 | — | — | US | claimed |
| EP-4289889-A2 | TOUGHENED ADHESIVE AND BONDING METHOD USING THE SAME | Cytec Industries Inc. (US) | 2023-12-13 | — | — | EP | disclosed |
| US-11377530-B2 | Toughened adhesive and bonding method using the same | CYTEC INDUSTRIES INC. (US) | 2022-07-05 | — | — | US | disclosed |
| US-20210380855-A1 | SOLID POLYMERIC ADHESIVE COMPOSITIONS HAVING HIGH USE TEMPERATURE, AND ARTICLES AND METHODS THEREOF | ZEPHYROS, INC. | 2021-12-09 | — | — | US | disclosed |
| EP-3728422-A1 | TOUGHENED ADHESIVE AND BONDING METHOD USING THE SAME | Cytec Industries Inc. (US) | 2020-10-28 | — | — | EP | disclosed |
| EP-2262852-A1 | COATING FOR ELASTOMERIC SUBSTRATES | Lord Corporation (US) | 2010-12-22 | — | — | EP | disclosed |
| WO-2009120818-A1 | COATING FOR ELASTOMERIC SUBSTRATES | LORD CORPORATION (US) | 2009-10-01 | — | — | WO | disclosed |
| US-6893736-B2 | Thermosetting resin compositions useful as underfill sealants | HENKEL CORPORATION (US) | 2005-05-17 | — | — | US | disclosed |
| US-20030131937-A1 | Thermosetting resin compositions useful as underfill sealants | HENKEL LOCTITE CORPORATION | 2003-07-17 | — | — | US | disclosed |
| US-20030054173-A1 | Flexible epoxy sound damping coatings | DOW CHEMICAL COMPANY, THE | 2003-03-20 | — | — | US | disclosed |