Bisphenol A

Bisphenol A

SCHEMBL1132731

CC(C)(c1ccc(O)cc1)c1ccc(O)cc1.[HH]

nearest known ligand 0.94

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ ESR1 P03372 13/20 0.94
▸ ESR2 Q92731 11/20 0.94
▸ CYP3A4 P08684 4/20 0.94
▸ HPGD P15428 2/20 0.94
▸ HSD17B10 Q99714 2/20 0.94
▸ AR P10275 1/20 0.94
▸ TSHR P16473 1/20 0.94
▸ SLC6A2 P23975 1/20 0.94
▸ SLC6A4 P31645 1/20 0.94
▸ HTR6 P50406 1/20 0.94
▸ ESRRG P62508 1/20 0.94
▸ SLC6A3 Q01959 1/20 0.94
▸ ALDH1A1 P00352 3/20 0.76
▸ LMNA P02545 2/20 0.65
▸ TYR P14679 2/20 0.65
▸ SHBG P04278 1/20 0.52
▸ MEN1 O00255 2/20 0.47
▸ KMT2A Q03164 2/20 0.47
▸ KDM4E B2RXH2 1/20 0.47
▸ NPC1 O15118 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Bisphenol A SCHEMBL8051951 0.97 ESR1 (1.00) ESR1ESR2CYP3A4HPGDHSD17B10
Bisphenol A SCHEMBL31267162 0.97 ESR1 (1.00) ESR1ESR2CYP3A4HPGDHSD17B10
Bisphenol A SCHEMBL15062 0.97 ESR1 (1.00) ESR1ESR2CYP3A4HPGDHSD17B10
Bisphenol A SCHEMBL278218 0.97 ESR1 (1.00) ESR1ESR2CYP3A4HPGDHSD17B10
SCHEMBL15868669 0.97 ESR1 (1.00) ESR1ESR2CYP3A4HPGDHSD17B10
Bisphenol A SCHEMBL9774987 0.97 ESR1 (1.00) ESR1ESR2CYP3A4HPGDHSD17B10
Bisphenol A SCHEMBL3170263 0.97 ESR1 (1.00) ESR1ESR2CYP3A4HPGDHSD17B10
SCHEMBL27996 0.97 ESR1 (1.00) ESR1ESR2CYP3A4HPGDHSD17B10
Bisphenol A SCHEMBL8058731 0.97 ESR1 (1.00) ESR1ESR2CYP3A4HPGDHSD17B10
Bisphenol A SCHEMBL1204623 0.94 ESR1 (0.94) ESR1ESR2CYP3A4HPGDHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250236693-A1 RESIN COMPOSITION, AND MOLDED PRODUCT, CURED PRODUCT, FILM, COMPOSITE MATERIAL, CURED COMPOSITE MATERIAL, LAMINATE, METAL FOIL WITH RESIN, AND VARNISH FOR CIRCUIT BOARD MATERIAL OBTAINEDTHEREFROM NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) 2025-07-24 — — US disclosed
US-20250215146-A1 POLYOL COMPOSITION FOR SOFT POLYURETHANE FOAM MOLDING, COMPOSITION FOR SOFT POLYURETHANE FOAM MOLDING, SOFT POLYURETHANE FOAM, AND PRODUCTION METHOD FOR SAME TOSOH CORPORATION (JP) 2025-07-03 — — US disclosed
CN-115279854-B Sheet-like adhesive for optical use 琳得科株式会社 2024-12-13 — — CN disclosed
CN-118546332-A Polyol composition for molding flexible polyurethane foam and flexible polyurethane foam 东曹株式会社 2024-08-27 — — CN disclosed
CN-113444351-B Resin composition and resin molded body 富士胶片商业创新有限公司 2024-04-05 — — CN disclosed
CN-117836338-A Resin composition and material for lining material 株式会社力森诺科 2024-04-05 — — CN disclosed
EP-4122975-B1 POLYOL COMPOSITION FOR SOFT POLYURETHANE FOAM MOLDING, COMPOSITION FOR SOFT POLYURETHANE FOAM MOLDING, SOFT POLYURETHANE FOAM, AND PRODUCTION METHOD FOR SAME TOSOH CORP (JP) 2024-04-03 — — EP disclosed
CN-117813193-A Method for regenerating pipe 株式会社力森诺科 2024-04-02 — — CN disclosed
WO-2023238931-A1 FILLED STRUCTURE, POLYURETHANE FOAM-FORMING COMPOSITION FOR FILLED STRUCTURE, POLYURETHANE FOAM FOR FILLED STRUCTURE, AND METHOD FOR PRODUCING FILLED STRUCTURE 東ソー株式会社 2023-12-14 — — WO disclosed
US-20230257509-A1 POLYOL COMPOSITION FOR SOFT POLYURETHANE FOAM MOLDING, COMPOSITION FOR SOFT POLYURETHANE FOAM MOLDING, SOFT POLYURETHANE FOAM, AND PRODUCTION METHOD FOR SAME TOSOH CORPORATION (JP) 2023-08-17 — — US disclosed
WO-2022044967-A1 POLYORGANO SILSESQUIOXANE, CURABLE COMPOSITION, CURED PRODUCT, HARD COAT FILM, ADHESIVE SHEET, AND LAMINATE 株式会社ダイセル 2022-03-03 — — WO disclosed
WO-2022044507-A1 CURABLE RESIN COMPOSITION, ELECTRIC/ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING ELECTRIC/ELECTRONIC COMPONENT 昭和電工株式会社 2022-03-03 — — WO disclosed
WO-2022044969-A1 POLYORGANOSILSESQUIOXANE, CURABLE COMPOSITION, CURED OBJECT, HARDCOAT FILM, TRANSFER FILM, AND ADHESIVE SHEET 株式会社ダイセル 2022-03-03 — — WO disclosed
WO-2022044968-A1 POLYORGANOSILSESQUIOXANE, CURABLE COMPOSITION, CURED ARTICLE, HARD COATING FILM, TRANSFER FILM, AND ADHESIVE SHEET 株式会社ダイセル 2022-03-03 — — WO disclosed
WO-2022030115-A1 CURABLE RESIN COMPOSITION, ELECTRIC/ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING ELECTRIC/ELECTRONIC COMPONENT 昭和電工株式会社 2022-02-10 — — WO disclosed
EP-1917304-B1 PROPYLENE BASED RESIN COMPOSITION MITSUI CHEMICALS INC (JP) 2011-06-22 — — EP disclosed
US-7901858-B2 Mixed cyclic phenol sulfides, and charge control agents and toners using the same HODOGAYA CHEMICAL CO., LTD. (JP) 2011-03-08 — — US disclosed
US-20110045396-A1 Charge Controlling Agent and Toner Using Metal Compound of Cyclic Phenol Sulfide HODOGAYA CHEMICAL CO., LTD. 2011-02-24 — — US disclosed
EP-2287674-A1 CHARGE CONTROLLING AGENT AND TONER USING METAL COMPOUND OF CYCLIC PHENOL SULFIDE Hodogaya Chemical Co., Ltd. (JP) 2011-02-23 — — EP disclosed
US-20080281046-A1 Propylene Based Resin Composition MITSUI CHEMICALS, INC. (JP) 2008-11-13 — — US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20110045396-A1 Charge Controlling Agent and Toner Using Metal Compound of Cyclic Phenol Sulfide SMC4, SMC2, SMC1A ESR1 658/4885ESR2 2540/4885CYP3A4 4661/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.

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