Predicted protein targets (top 11)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CAD | P27708 | 1/20 | 0.36 |
| ▸ | TSHR | P16473 | 2/20 | 0.32 |
| ▸ | RAB9A | P51151 | 2/20 | 0.32 |
| ▸ | LMNA | P02545 | 1/20 | 0.32 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.32 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.32 |
| ▸ | ADRA1A | P35348 | 1/20 | 0.32 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.32 |
| ▸ | MAPT | P10636 | 1/20 | 0.32 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.32 |
| ▸ | ACACB | O00763 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1142519 | 0.90 | RAB9A (0.40) | CADTSHRRAB9ALMNACYP3A4 | |
| SCHEMBL1142717 | 0.89 | MAPT (0.36) | CADRAB9ACYP3A4MAPTNPSR1 | |
| SCHEMBL1143023 | 0.86 | CAD (0.41) | CADACACB | |
| SCHEMBL1143132 | 0.78 | CAD (0.36) | CADACACB | |
| SCHEMBL12472137 | 0.73 | — | — | |
| SCHEMBL820356 | 0.73 | — | — | |
| SCHEMBL1142637 | 0.71 | MAPT (0.33) | RAB9AMAPTNPSR1 | |
| SCHEMBL1142391 | 0.70 | CAD (0.33) | CADMAPT | |
| SCHEMBL820452 | 0.70 | — | — | |
| SCHEMBL1142958 | 0.69 | ACHE (0.33) | RAB9AMAPTNPSR1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8765868-B2 | Resin composition for insulating film or surface-protective film of electronic components, method for producing pattern-cured film and electronic components | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2014-07-01 | — | — | US | disclosed |
| US-20110027544-A1 | Resin composition for insulating film or surface-protective film of electronic components, method for producing pattern-cured film and electronic components | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2011-02-03 | — | — | US | disclosed |