SCHEMBL114847

SCHEMBL114847

CC(N)C(N)(c1ccccc1)c1ccccc1

nearest known ligand 0.48

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
KCNN4 O15554 3/20 0.48
CYP1A2 P05177 1/20 0.47
CYP2D6 P10635 1/20 0.47
TAAR1 Q96RJ0 3/20 0.39
SLC6A2 P23975 2/20 0.39
MAOA P21397 1/20 0.39
SLC6A4 P31645 1/20 0.39
SLC6A3 Q01959 1/20 0.39
SIGMAR1 Q99720 1/20 0.39
CYP2A6 P11509 1/20 0.39
ADORA2A P29274 1/20 0.39
ADORA1 P30542 1/20 0.39
ADRA2A P08913 1/20 0.38
ADRA2C P18825 1/20 0.38
LMNA P02545 1/20 0.38
HIF1A Q16665 1/20 0.38
KDM4E B2RXH2 1/20 0.38
MAPK1 P28482 1/20 0.37
KIF11 P52732 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7158095 0.84 CYP2D6 (0.37) KCNN4CYP1A2CYP2D6TAAR1SLC6A2
SCHEMBL9722972 0.82 LTA4H (0.45) MAOAMAPK1
SCHEMBL636076 0.81 KCNN4 (0.44) KCNN4CYP1A2CYP2D6TAAR1SLC6A2
SCHEMBL13851926 0.81 KCNN4 (0.44) KCNN4CYP1A2CYP2D6TAAR1SLC6A2
SCHEMBL11133940 0.80 CYP2D6 (0.52) KCNN4CYP1A2CYP2D6TAAR1ADRA2A
SCHEMBL29024476 0.80 KCNN4 (0.48) KCNN4CYP1A2CYP2D6TAAR1SLC6A2
SCHEMBL1751596 0.78 MAPK1 (0.46) KCNN4CYP1A2CYP2D6TAAR1SLC6A2
SCHEMBL4855348 0.77 KCNN4 (0.43) KCNN4CYP1A2CYP2D6TAAR1SLC6A2
SCHEMBL5284524 0.76 KCNN4 (0.44) KCNN4CYP1A2CYP2D6TAAR1ADRA2A
SCHEMBL4462197 0.76 MAOA (0.39) KCNN4MAOAMAPK1KIF11

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1414 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116082636-B Polyamic acid resin, preparation method thereof and positive photosensitive resin composition 广东粤港澳大湾区黄埔材料研究院 2025-03-18 CN claimed
CN-118084793-A Diamine monomer containing imidazole structure, and preparation method and application thereof 波米科技有限公司 2024-05-28 CN claimed
US-11535686-B2 Tough, high temperature polymers produced by stereolithography CARBON, INC. (US) 2022-12-27 US claimed
CN-111205646-B Black matte polyimide film and preparation method thereof 株洲时代华鑫新材料技术有限公司 2022-09-09 CN claimed
CN-110873919-B Optical film 住友化学株式会社 2022-08-19 CN claimed
CN-114605153-A Preparation method of high-thermal-conductivity graphite film 中汇睿能凤阳新材料科技有限公司 2022-06-10 CN claimed
CN-109825185-B High-temperature-resistant anticorrosive coating and preparation method thereof 四川特聚新材料科技有限公司 2021-07-30 CN claimed
CN-111205646-A Black matte polyimide film and preparation method thereof 株洲时代华鑫新材料技术有限公司 2020-05-29 CN claimed
CN-110304625-A Graphene induces the preparation method of the high thermal conductivity graphite film of orientation of polyimide crystallization 浙江福斯特新材料研究院有限公司 2019-10-08 CN claimed
CN-110272374-A 3- oxo -2- arylisoindole quinoline two phthalonitrile monomer, preparation method, containing its thermoset composition and application thereof 沙特基础工业全球技术有限公司 2019-09-24 CN claimed
US-7416695-B2 Semiconductive polymide film and process for production thereof KANEKA CORPORATION (JP) 2008-08-26 US claimed
US-6500913-B2 REACTING AROMATIC DIACID WITH AROMATIC AMINE COUNCIL OF SCIENTIFIC AND INDUSTRIAL RESEARCH (IN) 2002-12-31 US claimed
US-5763688-A HYDROGENATING A CARBONYL COMPOUND, RUTHENIUM-PHOSPHINE COMPLEX CATALYST, BASE, DIAMINE RESEARCH DEVELOPMENT CORPORATION OF JAPAN (JP) 1998-06-09 US claimed
EP-0538850-B1 New polyurea resins and their preparation and use IHARA CHEMICAL IND CO (JP) 1997-01-22 EP claimed
US-5319058-A Improved heat resistance when polyisocyanate component is a combination of an aliphatic diisocyanate and a cyclic trimer of an aliphatic polyisocyanate IHARA CHEMICAL INDUSTRY CO., LTD. (JP) 1994-06-07 US claimed
EP-0362649-B1 Radiation-sensitive compositions and their use BASF AG (DE) 1994-03-02 EP claimed
US-5284734-A Insulating layers and printed circuits; precursors for polyimides and polyquinazolines BASF AKTIENGESELLSCHAFT (DE) 1994-02-08 US claimed
EP-0538850-A2 New polyurea resins and their preparation and use IHARA CHEMICAL INDUSTRY Co., Ltd. (JP) 1993-04-28 EP claimed
EP-0362649-A2 Radiation-sensitive compositions and their use BASF Aktiengesellschaft (DE) 1990-04-11 EP claimed
EP-0323644-A1 Polyimide resin and insulating film for electric and electronic devices NISSAN CHEMICAL INDUSTRIES LTD. (JP) 1989-07-12 EP claimed