SCHEMBL1151693

SCHEMBL1151693

C=C(C)C(=O)OCCOC(=O)C1CCCC(C(=O)O)C1

nearest known ligand 0.42

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
THRB P10828 1/20 0.42
TSHR P16473 3/20 0.38
ALDH1A1 P00352 1/20 0.37
BTK Q06187 1/20 0.35
EPHX2 P34913 1/20 0.34
POLB P06746 1/20 0.33
APEX1 P27695 1/20 0.33
HTT P42858 1/20 0.33
TDP1 Q9NUW8 1/20 0.33
ANPEP P15144 1/20 0.33
CA1 P00915 1/20 0.32
CA2 P00918 1/20 0.32
SMN1; SMN2 Q16637 1/20 0.31
PPM1B O75688 1/20 0.31
PTPN1 P18031 1/20 0.31
PPP1CC P36873 1/20 0.31
MEN1 O00255 1/20 0.30
KMT2A Q03164 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16243727 0.94 TSHR (0.43) THRBTSHRALDH1A1BTKEPHX2
SCHEMBL17531128 0.88 THRB (0.47) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL17531131 0.85 THRB (0.42) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL14533168 0.85 THRB (0.42) THRBTSHRALDH1A1EPHX2POLB
SCHEMBL16243798 0.85 BTK (0.36) THRBTSHRALDH1A1BTKANPEP
SCHEMBL1152044 0.84 THRB (0.47) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL10040737 0.84 THRB (0.53) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL10040880 0.84 THRB (0.53) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL17531129 0.84 THRB (0.44) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL75023 0.83 THRB (0.46) THRBTSHRALDH1A1POLBAPEX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20160280829-A1 RESIN COMPOSITION FOR FORMING OPTICAL WAVEGUIDE, RESIN FILM FOR FORMING OPTICAL WAVEGUIDE, AND OPTICAL WAVEGUIDE USING THE SAME HITACHI CHEMICAL COMPANY, LTD. (JP) 2016-09-29 US disclosed
US-20160209743-A1 PHOTOSENSITIVE RESIN COMPOSITION FOR FORMING MEMBER HAVING CURVED SHAPE, PHOTOSENSITIVE RESIN FILM FOR FORMING MEMBER HAVING CURVED SHAPE USING SAID COMPOSITION, AND LENS MEMBER MANUFACTRED USING SAID COMPOSITION OR SAID FILM HITACHI CHEMICAL COMPANY, LTD. (JP) 2016-07-21 US disclosed
US-9177819-B2 Method for manufacturing silicon substrate having textured structure TOKUYAMA CORPORATION (JP) 2015-11-03 US disclosed
US-20140349485-A1 METHOD FOR MANUFACTURING SILICON SUBSTRATE HAVING TEXTURED STRUCTURE TOKUYAMA CORPORATION a corporation 2014-11-27 US disclosed
US-8604096-B2 Photosensitive resin composition, photosensitive resin varnish, photosensitive resin film, and photosensitive resin cured product HITACHI CHEMICAL COMPANY, LTD. (JP) 2013-12-10 US disclosed
US-8573765-B2 Active radiation curable ink composition, ink composition for inkjet recording, printed matter, and method of producing molded article of printed matter FUJIFILM CORPORATION (JP) 2013-11-05 US disclosed
US-20120270963-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN VARNISH, PHOTOSENSITIVE RESIN FILM, AND PHOTOSENSITIVE RESIN CURED PRODUCT HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-10-25 US disclosed
US-20110241264-A1 ACTIVE RADIATION CURABLE INK COMPOSITION, INK COMPOSITION FOR INKJET RECORDING, PRINTED MATTER, AND METHOD OF PRODUCING MOLDED ARTICLE OF PRINTED MATTER FUJIFILM CORPORATION (JP) 2011-10-06 US disclosed
US-20110241264-A1 ACTIVE RADIATION CURABLE INK COMPOSITION, INK COMPOSITION FOR INKJET RECORDING, PRINTED MATTER, AND METHOD OF PRODUCING MOLDED ARTICLE OF PRINTED MATTER FUJIFILM CORPORATION (JP) 2011-10-06 US disclosed
US-20110033161-A1 RESIN COMPOSITION FOR PRODUCTION OF CLAD LAYER, RESIN FILM FOR PRODUCTION OF CLAD LAYER UTILIZING THE RESIN COMPOSITION, AND OPTICAL WAVEGUIDE AND OPTICAL MODULE EACH UTILIZING THE RESIN COMPOSITION OR THE RESIN FILM HITACHI CHEMICAL COMPANY, LTD. (JP) 2011-02-10 US disclosed
EP-2239603-A1 RESIN COMPOSITION FOR PRODUCTION OF CLAD LAYER, RESIN FILM FOR PRODUCTION OF CLAD LAYER UTILIZING THE RESIN COMPOSITION, AND OPTICAL WAVEGUIDE AND OPTICAL MODULE EACH UTILIZING THE RESIN COMPOSITION OR THE RESIN FILM Hitachi Chemical Company, Ltd. (JP) 2010-10-13 EP disclosed
EP-2182410-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PHOTOSENSITIVE RESIN PRODUCT, PHOTOSENSITIVE RESIN FILM, CURED PHOTOSENSITIVE RESIN FILM PRODUCT, AND OPTICAL WAVEGUIDE PRODUCED BY USING THOSE PRODUCTS Hitachi Chemical Company, Ltd. (JP) 2010-05-05 EP disclosed