Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 14/20 | 0.64 |
| ▸ | HSP90AA1 | P07900 | 4/20 | 0.62 |
| ▸ | PKM | P14618 | 2/20 | 0.62 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.62 |
| ▸ | LMNA | P02545 | 2/20 | 0.62 |
| ▸ | CCR6 | P51684 | 2/20 | 0.62 |
| ▸ | MEN1 | O00255 | 1/20 | 0.62 |
| ▸ | HPGD | P15428 | 1/20 | 0.62 |
| ▸ | HTT | P42858 | 1/20 | 0.62 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.62 |
| ▸ | ATM | Q13315 | 1/20 | 0.62 |
| ▸ | FAAH | O00519 | 5/20 | 0.52 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.44 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.44 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.44 |
| ▸ | DDAH1 | O94760 | 1/20 | 0.41 |
| ▸ | BCHE | P06276 | 1/20 | 0.40 |
| ▸ | CACNA1B | Q00975 | 1/20 | 0.40 |
| ▸ | APBA1 | Q02410 | 1/20 | 0.40 |
| ▸ | APOBEC3G | Q9HC16 | 1/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8560045 | 0.86 | MGLL (0.68) | MGLLHSP90AA1PKMALDH1A1LMNA | |
| SCHEMBL487033 | 0.85 | MGLL (0.84) | MGLLHSP90AA1PKMALDH1A1LMNA | |
| SCHEMBL331752 | 0.85 | MGLL (0.84) | MGLLHSP90AA1PKMALDH1A1LMNA | |
| SCHEMBL4385482 | 0.85 | MGLL (0.84) | MGLLHSP90AA1PKMALDH1A1LMNA | |
| SCHEMBL9156707 | 0.83 | MGLL (0.79) | MGLLHSP90AA1PKMALDH1A1LMNA | |
| SCHEMBL348789 | 0.83 | MGLL (0.64) | MGLLHSP90AA1PKMALDH1A1LMNA | |
| SCHEMBL8852933 | 0.82 | MGLL (0.58) | MGLLHSP90AA1PKMALDH1A1LMNA | |
| SCHEMBL8468701 | 0.82 | MGLL (0.54) | MGLLHSP90AA1PKMALDH1A1LMNA | |
| SCHEMBL9245833 | 0.80 | MGLL (0.75) | MGLLHSP90AA1PKMALDH1A1LMNA | |
| SCHEMBL9877807 | 0.79 | MGLL (0.58) | MGLLHSP90AA1PKMALDH1A1LMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8673539-B2 | Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2014-03-18 | — | — | US | disclosed |
| US-8507323-B2 | Method of producing semiconductor device with patterned photosensitive adhesive | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-08-13 | — | — | US | disclosed |
| US-8445177-B2 | Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-05-21 | — | — | US | disclosed |
| US-8404564-B2 | Adhesive film for semiconductor, composite sheet, and method for producing semiconductor chip using them | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-03-26 | — | — | US | disclosed |
| US-20130062787-A1 | PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART | RESONAC CORPORATION (JP) | 2013-03-14 | — | — | US | disclosed |
| US-8349700-B2 | Photosensitive adhesive, semiconductor device and method for manufacturing semiconductor device | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-01-08 | — | — | US | disclosed |
| US-8323873-B2 | Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-12-04 | — | — | US | disclosed |
| US-20120282547-A1 | PHOTOSENSITIVE ADHESIVE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-11-08 | — | — | US | disclosed |
| US-8293453-B2 | Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-10-23 | — | — | US | disclosed |
| US-8278024-B2 | Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-10-02 | — | — | US | disclosed |
| US-20100112783-A1 | ADHESIVE FILM FOR SEMICONDUCTOR, COMPOSITE SHEET, AND METHOD FOR PRODUCING SEMICONDUCTOR CHIP USING THEM | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2010-05-06 | — | — | US | disclosed |
| EP-2139027-A1 | ADHESIVE FILM FOR SEMICONDUCTOR, COMPOSITE SHEET, AND METHOD FOR PRODUCING SEMICONDUCTOR CHIP USING THEM | Hitachi Chemical Company, Ltd. (JP) | 2009-12-30 | — | — | EP | disclosed |
| US-20080176167-A1 | Photopolymerization; polyimides; photomasks; wafers; sheets; films | RESONAC CORPORATION (JP) | 2008-07-24 | — | — | US | disclosed |
| EP-1918341-A1 | ADHESIVE FILM AND SEMICONDUCTOR DEVICE USING SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2008-05-07 | — | — | EP | disclosed |
| EP-1901123-A1 | PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2008-03-19 | — | — | EP | disclosed |
| US-20070290369-A1 | Resin Paste For Die Bonding And Its Use | HITACHI CHEMICAL CO., LTD. (JP) | 2007-12-20 | — | — | US | disclosed |
| US-20070225438-A1 | Resin Paste for Die Bonding | HITACHI CHEMICAL CO., LTD. (JP) | 2007-09-27 | — | — | US | disclosed |
| EP-1758157-A1 | RESIN PASTE FOR DIE BONDING AND ITS USE | Hitachi Chemical Co., Ltd. (JP) | 2007-02-28 | — | — | EP | disclosed |
| US-5667899-A | SELF-SUPPORTING BONDING FILM OF POLYIMIDES | HITACHI CHEMICAL CO. LTD. (JP) | 1997-09-16 | — | — | US | disclosed |
| US-5605763-A | POLYIMIDE; SEMICONDUCTORS | HITACHI CHEMICAL COMPANY LTD. (JP) | 1997-02-25 | — | — | US | disclosed |