Predicted protein targets (top 18)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 16/20 | 0.64 |
| ▸ | HSP90AA1 | P07900 | 3/20 | 0.53 |
| ▸ | PKM | P14618 | 2/20 | 0.53 |
| ▸ | LMNA | P02545 | 2/20 | 0.53 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.53 |
| ▸ | HPGD | P15428 | 2/20 | 0.53 |
| ▸ | HTT | P42858 | 2/20 | 0.53 |
| ▸ | MEN1 | O00255 | 1/20 | 0.53 |
| ▸ | CCR6 | P51684 | 1/20 | 0.53 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.53 |
| ▸ | ATM | Q13315 | 1/20 | 0.53 |
| ▸ | FAAH | O00519 | 5/20 | 0.52 |
| ▸ | NPSR1 | Q6W5P4 | 2/20 | 0.44 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.44 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.44 |
| ▸ | DDAH1 | O94760 | 1/20 | 0.41 |
| ▸ | CACNA1B | Q00975 | 1/20 | 0.41 |
| ▸ | APBA1 | Q02410 | 1/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9156707 | 0.90 | MGLL (0.79) | MGLLHSP90AA1PKMLMNAALDH1A1 | |
| SCHEMBL2363989 | 0.89 | MGLL (0.77) | MGLLHSP90AA1PKMLMNAALDH1A1 | |
| SCHEMBL486939 | 0.86 | MGLL (0.58) | MGLLHSP90AA1PKMLMNAALDH1A1 | |
| SCHEMBL30540114 | 0.86 | MGLL (0.58) | MGLLHSP90AA1PKMLMNAALDH1A1 | |
| SCHEMBL8560045 | 0.86 | MGLL (0.68) | MGLLHSP90AA1PKMLMNAALDH1A1 | |
| SCHEMBL4385482 | 0.85 | MGLL (0.84) | MGLLHSP90AA1PKMLMNAALDH1A1 | |
| SCHEMBL331752 | 0.85 | MGLL (0.84) | MGLLHSP90AA1PKMLMNAALDH1A1 | |
| SCHEMBL487033 | 0.85 | MGLL (0.84) | MGLLHSP90AA1PKMLMNAALDH1A1 | |
| SCHEMBL8394899 | 0.84 | MGLL (0.56) | MGLLHSP90AA1PKMLMNAALDH1A1 | |
| SCHEMBL1156097 | 0.83 | MGLL (0.64) | MGLLHSP90AA1PKMLMNAALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 132 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0449292-B1 | Multilayer printed circuit board and production thereof | HITACHI LTD (JP) | 1997-08-20 | — | — | EP | claimed |
| US-20260071011-A1 | COMPOUND, RESIN COMPOSITION, PREPREG, RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | RESONAC CORP (JP) | 2026-03-12 | — | — | US | disclosed |
| US-20250326929-A1 | RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE | RESONAC CORP (JP) | 2025-10-23 | — | — | US | disclosed |
| US-20250326893-A1 | RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | RESONAC CORP (JP) | 2025-10-23 | — | — | US | disclosed |
| US-20250287499-A1 | PREPREG, LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | RESONAC CORPORATION (JP) | 2025-09-11 | — | — | US | disclosed |
| US-20250188263-A1 | RESIN COMPOSITION, PREPREG, LAMINATED BOARD, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | RESONAC CORP (JP) | 2025-06-12 | — | — | US | disclosed |
| WO-2025105439-A1 | CURABLE COMPOSITION FOR PREPREG, PREPREG, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | 株式会社レゾナック | 2025-05-22 | — | — | WO | disclosed |
| WO-2025105440-A1 | CURABLE COMPOSITION, PREPREG, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND MOLDED ARTICLE | 株式会社レゾナック | 2025-05-22 | — | — | WO | disclosed |
| EP-4527860-A1 | RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE | Resonac Corporation (JP) | 2025-03-26 | — | — | EP | disclosed |
| WO-2025033357-A1 | ADHESIVE FILM, ADHESIVE FILM WITH METAL LAYER, WIRING FORMATION MEMBER, FORMATION METHOD FOR WIRING LAYER, AND WIRED MEMBER | 株式会社レゾナック | 2025-02-13 | — | — | WO | disclosed |
| EP-0755979-A2 | Thermosetting resin compositions and their use for thin film wiring boards | HITACHI, LTD. (JP) | 1997-01-29 | — | — | EP | disclosed |
| EP-0476589-B1 | Multi-layer wiring substrate and production thereof | HITACHI LTD (JP) | 1996-06-12 | — | — | EP | disclosed |
| EP-0471522-B1 | Resin composition based on polymaleimide and phenolic aralkyl resin | MITSUI TOATSU CHEMICALS (JP) | 1995-12-13 | — | — | EP | disclosed |
| EP-0618269-A1 | Thermosetting resin compositions and their use for thin film wiring boards | HITACHI, LTD. (JP) | 1994-10-05 | — | — | EP | disclosed |
| US-5352762-A | Fluorine-containing biscyanamide thermosetting resin, heat resistance, adhesion | HITACHI, LTD. (JP) | 1994-10-04 | — | — | US | disclosed |
| US-5266654-A | Polymaleimide, phenolic resin with xylylene groups, epoxy resin | MITSUI TOATSU CHEMICALS, INCORPORATED (JP) | 1993-11-30 | — | — | US | disclosed |
| US-5225499-A | Molding materials of epoxy resins and ether imides | HITACHI, LTD. (JP) | 1993-07-06 | — | — | US | disclosed |
| EP-0476589-A2 | Multi-layer wiring substrate and production thereof | HITACHI, LTD. (JP) | 1992-03-25 | — | — | EP | disclosed |
| EP-0471522-A1 | Resin composition based on polymaleimide and phenolic aralkyl resin | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1992-02-19 | — | — | EP | disclosed |
| EP-0449292-A2 | Multilayer printed circuit board and production thereof | HITACHI, LTD. (JP) | 1991-10-02 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20260071011-A1 | COMPOUND, RESIN COMPOSITION, PREPREG, RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | CD79B, C1R, TGFBR1 | MGLL 3867/4885HSP90AA1 3849/4885PKM 3058/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.