SCHEMBL8560045

SCHEMBL8560045

O=C1C=CC(=O)N1c1ccc(Oc2ccc(C(c3ccc(Oc4ccc(N5C(=O)C=CC5=O)cc4)cc3)c3ccc(Oc4ccc(N5C(=O)C=CC5=O)cc4)cc3)cc2)cc1

nearest known ligand 0.68

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 14/20 0.68
HSP90AA1 P07900 4/20 0.56
LMNA P02545 3/20 0.56
PKM P14618 2/20 0.56
ALDH1A1 P00352 2/20 0.56
CCR6 P51684 2/20 0.56
MEN1 O00255 1/20 0.56
HPGD P15428 1/20 0.56
HTT P42858 1/20 0.56
KMT2A Q03164 1/20 0.56
ATM Q13315 1/20 0.56
FAAH O00519 5/20 0.56
TDP1 Q9NUW8 2/20 0.47
MAPK1 P28482 1/20 0.47
NPSR1 Q6W5P4 1/20 0.47
DDAH1 O94760 1/20 0.43
BCHE P06276 1/20 0.42
CACNA1B Q00975 1/20 0.42
APBA1 Q02410 1/20 0.42
APOBEC3G Q9HC16 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4385482 0.88 MGLL (0.84) MGLLHSP90AA1LMNAPKMALDH1A1
SCHEMBL487033 0.88 MGLL (0.84) MGLLHSP90AA1LMNAPKMALDH1A1
SCHEMBL331752 0.88 MGLL (0.84) MGLLHSP90AA1LMNAPKMALDH1A1
SCHEMBL22862128 0.88 MGLL (0.71) MGLLHSP90AA1LMNAPKMALDH1A1
SCHEMBL1255913 0.88 MGLL (0.71) MGLLHSP90AA1LMNAPKMALDH1A1
SCHEMBL348789 0.86 MGLL (0.64) MGLLHSP90AA1LMNAPKMALDH1A1
SCHEMBL1156097 0.86 MGLL (0.64) MGLLHSP90AA1LMNAPKMALDH1A1
SCHEMBL9156707 0.86 MGLL (0.79) MGLLHSP90AA1LMNAPKMALDH1A1
SCHEMBL22862078 0.82 MGLL (0.64) MGLLHSP90AA1LMNAPKMALDH1A1
SCHEMBL9245833 0.82 MGLL (0.75) MGLLHSP90AA1LMNAPKMALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5780145-A CURED EPXOY AND OR IMIDE RESINS WITH FILLERS AND GLOBULAR POWDER WITH SPECIFIC PARTICLE SIZE USED AS A SEALING MATERIALS FOR SEMICONDUCTORS SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1998-07-14 US disclosed
US-5719225-A RESIN COMPOSITION CONTAINING FILLER COMPRISING GLOBULAR POWDERS OF DIFFERENT PARTICLE SIZES IN SPECIFIED RATIOS SUMITOMO CHEMICAL COMPANY, LTD. (JP) 1998-02-17 US disclosed