Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4C | Q9H3R0 | 1/20 | 0.44 |
| ▸ | MMP1 | P03956 | 1/20 | 0.40 |
| ▸ | MMP2 | P08253 | 1/20 | 0.40 |
| ▸ | MMP3 | P08254 | 1/20 | 0.40 |
| ▸ | MMP9 | P14780 | 1/20 | 0.40 |
| ▸ | EPHX1 | P07099 | 4/20 | 0.39 |
| ▸ | MCL1 | Q07820 | 1/20 | 0.38 |
| ▸ | CNR1 | P21554 | 2/20 | 0.35 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.34 |
| ▸ | MEN1 | O00255 | 2/20 | 0.34 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.33 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.33 |
| ▸ | PAOX | Q6QHF9 | 1/20 | 0.33 |
| ▸ | POLB | P06746 | 1/20 | 0.33 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.33 |
| ▸ | GAA | P10253 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1156662 | 1.00 | KDM4C (0.44) | KDM4CMMP1MMP2MMP3MMP9 | |
| SCHEMBL36474 | 0.87 | EPHX1 (0.50) | MMP2EPHX1KMT2AMEN1ALDH1A1 | |
| SCHEMBL238063 | 0.87 | EPHX1 (0.50) | MMP2EPHX1KMT2AMEN1ALDH1A1 | |
| SCHEMBL36475 | 0.87 | EPHX1 (0.50) | MMP2EPHX1KMT2AMEN1ALDH1A1 | |
| SCHEMBL1157329 | 0.84 | EPHX1 (0.61) | EPHX1KMT2AMEN1 | |
| SCHEMBL1157325 | 0.84 | EPHX1 (0.61) | EPHX1KMT2AMEN1 | |
| SCHEMBL15355954 | 0.83 | KDM4C (0.41) | KDM4CMMP1MMP2MMP3MMP9 | |
| SCHEMBL35559 | 0.82 | CNR1 (0.41) | EPHX1CNR1KMT2AMEN1ALDH1A1 | |
| SCHEMBL17732616 | 0.82 | CNR1 (0.41) | EPHX1CNR1KMT2AMEN1ALDH1A1 | |
| SCHEMBL35560 | 0.82 | CNR1 (0.41) | EPHX1CNR1KMT2AMEN1ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20260109860-A1 | HEAT-CURABLE RESIN COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-04-23 | — | — | US | disclosed |
| EP-4729563-A1 | HEAT-CURABLE RESIN COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD., (JP) | 2026-04-22 | — | — | EP | disclosed |
| US-12565608-B2 | Thermally conductive resin composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-03-03 | — | — | US | disclosed |
| US-12521919-B2 | Anisotropic film and method for manufacturing anisotropic film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-01-13 | — | — | US | disclosed |
| US-20250084205-A1 | RESIN COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-03-13 | — | — | US | disclosed |
| US-12146057-B2 | Cyclic imide resin composition, prepreg, copper-clad laminate and printed-wiring board | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2024-11-19 | — | — | US | disclosed |
| EP-4372063-A1 | TAPE LAMINATE, MICROFLUIDIC CHIP AND MICROFLUIDIC DEVICE | SEKISUI CHEMICAL CO., LTD. (JP) | 2024-05-22 | — | — | EP | disclosed |
| US-20230250328-A1 | THERMALLY CONDUCTIVE RESIN COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-08-10 | — | — | US | disclosed |
| US-11608438-B2 | Low-dielectric heat dissipation film composition and low-dielectric heat dissipation film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-03-21 | — | — | US | disclosed |
| US-20220267526-A1 | MALEIMIDE RESIN FILM AND COMPOSITION FOR MALEIMIDE RESIN FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2022-08-25 | — | — | US | disclosed |
| US-20110044863-A1 | MICRO FLUID DEVICE | SEKISUI CHEMICAL CO., LTD. (JP) | 2011-02-24 | — | — | US | disclosed |
| US-7880316-B2 | Dicing die-bonding film and process for producing semiconductor device | NITTO DENKO CORPORATION (JP) | 2011-02-01 | — | — | US | disclosed |
| EP-2256349-A1 | MICRO FLUID DEVICE | Sekisui Chemical Co., Ltd. (JP) | 2010-12-01 | — | — | EP | disclosed |
| US-20100129985-A1 | DICING DIE-BONDING FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE | NITTO DENKO CORPORATION (JP) | 2010-05-27 | — | — | US | disclosed |
| US-20100129988-A1 | DICING DIE-BONDING FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE | NITTO DENKO CORPORATION (JP) | 2010-05-27 | — | — | US | disclosed |
| US-20080314507-A1 | Ic Chip Manufacturing Method | SEKISUI CHEMICAL CO., LTD. (JP) | 2008-12-25 | — | — | US | disclosed |
| EP-1783820-A1 | PROCESS FOR PRODUCING IC CHIP | SEKISUI CHEMICAL CO., LTD. (JP) | 2007-05-09 | — | — | EP | disclosed |
| US-20070037364-A1 | Method for manufacturing semiconductor chip | SEKISUI CHEMICAL CO., LTD. (JP) | 2007-02-15 | — | — | US | disclosed |
| US-20040248382-A1 | Pressure sensitive adhesive double coated tape and method for producing ic chip using it | SEKISUI CHEMICAL CO., LTD. (JP) | 2004-12-09 | — | — | US | disclosed |
| EP-1413615-A1 | PRESSURE SENSITIVE ADHESIVE DOUBLE COATED TAPE AND METHOD FOR PRODUCING IC CHIP USING IT | SEKISUI CHEMICAL CO., LTD. (JP) | 2004-04-28 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12565608-B2 | Thermally conductive resin composition | ITGAM, RAE1, FCGR1A | KDM4C 1735/4885MMP1 1671/4885MMP2 2442/4885 |
| US-20260109860-A1 | HEAT-CURABLE RESIN COMPOSITION | RAD51, COL2A1, SEM1 | KDM4C 903/4885MMP1 2279/4885MMP2 3698/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.