SCHEMBL115757

SCHEMBL115757

Nc1nnnc(N)c1-c1ccccc1

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPK1 P28482 3/20 0.52
NPSR1 Q6W5P4 1/20 0.52
AKT2 P31751 1/20 0.50
KMT2A Q03164 1/20 0.50
L3MBTL1 Q9Y468 2/20 0.46
SMARCA2 P51531 2/20 0.44
SMARCA4 P51532 2/20 0.44
PBRM1 Q86U86 2/20 0.44
KDM4E B2RXH2 2/20 0.44
MAPT P10636 2/20 0.44
TDP1 Q9NUW8 2/20 0.44
TDO2 P48775 2/20 0.43
CSNK1A1 P48729 1/20 0.43
CLK4 Q9HAZ1 1/20 0.43
RPS6KA3 P51812 1/20 0.43
NPC1 O15118 1/20 0.42
RAB9A P51151 1/20 0.42
DHFR P00374 1/20 0.41
HEXA P06865 1/20 0.41
HEXB P07686 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27568556 0.85 RPS6KA3 (0.45) MAPK1NPSR1AKT2KMT2AL3MBTL1
SCHEMBL7162150 0.75 DHFR (0.66) MAPK1L3MBTL1KDM4EMAPTTDP1
SCHEMBL517627 0.75 LMNA (0.48) MAPK1NPSR1AKT2KMT2ASMARCA2
SCHEMBL27872020 0.75 CLK4 (0.53) MAPK1NPSR1AKT2KMT2AL3MBTL1
SCHEMBL500715 0.72 LMNA (0.56) MAPK1KMT2AL3MBTL1KDM4EMAPT
SCHEMBL22360955 0.70 LMNA (0.54) MAPK1KMT2AL3MBTL1KDM4EMAPT
SCHEMBL29115860 0.70 MAPK1 (0.53) MAPK1NPSR1AKT2KMT2AL3MBTL1
SCHEMBL10166769 0.70 MAPK1 (0.68) MAPK1NPSR1AKT2KMT2AL3MBTL1
SCHEMBL20837496 0.69 ALDH1A1 (0.50) MAPK1NPSR1AKT2KMT2AL3MBTL1
SCHEMBL675595 0.69 ALDH1A1 (0.50) MAPK1NPSR1AKT2KMT2AL3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 73 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119955410-A Organosilicon high-temperature-resistant anticorrosive paint and preparation method thereof 淄博霁峰新材料科技有限公司 2025-05-09 CN claimed
US-11535686-B2 Tough, high temperature polymers produced by stereolithography CARBON, INC. (US) 2022-12-27 US claimed
US-8779036-B2 Catalysis of epoxy resin formulations EVONIK DEGUSSA GMBH (DE) 2014-07-15 US claimed
EP-2456804-A1 CATALYSIS OF EPOXY RESIN FORMULATIONS HAVING SPARINGLY SOLUBLE CATALYSTS Evonik Degussa GmbH (DE) 2012-05-30 EP claimed
US-20120115988-A1 CATALYSIS OF EPOXY RESIN FORMULATIONS HAVING SPARINGLY SOLUBLE CATALYSTS EVONIK DEGUSSA GMBH (DE) 2012-05-10 US claimed
CN-102414243-A Catalysis of epoxy resin formulations EVONIK DEGUSSA GMBH 2012-04-11 CN claimed
EP-2424916-A1 CATALYSIS OF EPOXY RESIN FORMULATIONS Evonik Degussa GmbH (DE) 2012-03-07 EP claimed
US-20120041101-A1 CATALYSIS OF EPOXY RESIN FORMULATIONS EVONIK DEGUSSA GMBH (DE) 2012-02-16 US claimed
WO-2011009648-A1 CATALYSIS OF EPOXY RESIN FORMULATIONS HAVING SPARINGLY SOLUBLE CATALYSTS EVONIK DEGUSSA GMBH (DE) 2011-01-27 WO claimed
WO-2010124901-A1 CATALYSIS OF EPOXY RESIN FORMULATIONS EVONIK DEGUSSA GMBH (DE) 2010-11-04 WO claimed
CN-119955410-A Organosilicon high-temperature-resistant anticorrosive paint and preparation method thereof 淄博霁峰新材料科技有限公司 2025-05-09 CN disclosed
US-11833744-B2 Dual precursor resin systems for additive manufacturing with dual cure resins CARBON, INC. (US) 2023-12-05 US disclosed
US-11834574-B2 Dual cure additive manufacturing resins for production of flame retardant objects CARBON, INC. (US) 2023-12-05 US disclosed
US-11814472-B2 Epoxy dual cure resins for additive manufacturing CARBON, INC. (US) 2023-11-14 US disclosed
US-20230143277-A1 DUAL CURE STEREOLITHOGRAPHY RESINS CONTAINING DIELS-ALDER ADDUCTS CARBON INC (US) 2023-05-11 US disclosed
US-20120115988-A1 CATALYSIS OF EPOXY RESIN FORMULATIONS HAVING SPARINGLY SOLUBLE CATALYSTS EVONIK DEGUSSA GMBH (DE) 2012-05-10 US disclosed
CN-102414243-A Catalysis of epoxy resin formulations EVONIK DEGUSSA GMBH 2012-04-11 CN disclosed
EP-2424916-A1 CATALYSIS OF EPOXY RESIN FORMULATIONS Evonik Degussa GmbH (DE) 2012-03-07 EP disclosed
US-20120041101-A1 CATALYSIS OF EPOXY RESIN FORMULATIONS EVONIK DEGUSSA GMBH (DE) 2012-02-16 US disclosed
WO-2010124901-A1 CATALYSIS OF EPOXY RESIN FORMULATIONS EVONIK DEGUSSA GMBH (DE) 2010-11-04 WO disclosed