Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | BRD4 | O60885 | 1/20 | 0.50 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.46 |
| ▸ | KMT2A | Q03164 | 7/20 | 0.44 |
| ▸ | MEN1 | O00255 | 6/20 | 0.44 |
| ▸ | ALDH1A1 | P00352 | 6/20 | 0.44 |
| ▸ | HPGD | P15428 | 2/20 | 0.44 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.44 |
| ▸ | POLB | P06746 | 1/20 | 0.43 |
| ▸ | MAPT | P10636 | 1/20 | 0.43 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.43 |
| ▸ | LPAR1 | Q92633 | 1/20 | 0.43 |
| ▸ | LPAR5 | Q9H1C0 | 1/20 | 0.43 |
| ▸ | LPAR3 | Q9UBY5 | 1/20 | 0.43 |
| ▸ | USP2 | O75604 | 1/20 | 0.43 |
| ▸ | KEAP1 | Q14145 | 1/20 | 0.43 |
| ▸ | NFE2L2 | Q16236 | 1/20 | 0.43 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.43 |
| ▸ | LYN | P07948 | 1/20 | 0.42 |
| ▸ | RAB9A | P51151 | 1/20 | 0.41 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL14010063 | 0.99 | BRD4 (0.48) | BRD4MAPK1KMT2AMEN1ALDH1A1 | |
| SCHEMBL14010061 | 0.95 | BRD4 (0.54) | BRD4MAPK1KMT2AMEN1ALDH1A1 | |
| SCHEMBL12574001 | 0.93 | BRD4 (0.59) | BRD4MAPK1KMT2AMEN1ALDH1A1 | |
| SCHEMBL13533865 | 0.92 | BRD4 (0.55) | BRD4MAPK1KMT2AMEN1ALDH1A1 | |
| SCHEMBL14010052 | 0.91 | BRD4 (0.51) | BRD4MAPK1KMT2AMEN1ALDH1A1 | |
| SCHEMBL14010049 | 0.91 | BRD4 (0.56) | BRD4MAPK1KMT2AMEN1ALDH1A1 | |
| SCHEMBL12034649 | 0.88 | MAPK1 (0.56) | MAPK1KMT2AMEN1ALDH1A1HPGD | |
| SCHEMBL26030942 | 0.88 | MEN1 (0.51) | BRD4MAPK1KMT2AMEN1ALDH1A1 | |
| SCHEMBL12317361 | 0.88 | BRD4 (0.60) | BRD4MAPK1KMT2AMEN1ALDH1A1 | |
| SCHEMBL15905656 | 0.87 | BRD4 (0.57) | BRD4MAPK1KMT2AMEN1ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9955583-B2 | Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board | JX NIPPON MINING & METALS CORPORATION (JP) | 2018-04-24 | — | — | US | disclosed |
| US-9949371-B2 | Resin composite electrolytic copper foil, copper clad laminate and printed wiring board | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2018-04-17 | — | — | US | disclosed |
| US-20170306094-A1 | POLYIMIDE COPOLYMER AND MOLDED ARTICLE USING SAME | SOMAR CORPORATION (JP) | 2017-10-26 | — | — | US | disclosed |
| US-20160360615-A1 | RESIN COMPOSITE ELECTROLYTIC COPPER FOIL, COPPER CLAD LAMINATE AND PRINTED WIRING BOARD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2016-12-08 | — | — | US | disclosed |
| US-20160353581-A1 | Carrier-Attached Copper Foil, Laminate, Printed-Wiring Board And Method For Manufacturing The Printed Wiring Board | JX NIPPON MINING & METALS CORPORATION (JP) | 2016-12-01 | — | — | US | disclosed |
| US-20160183380-A1 | SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, RESIN SUBSTRATE, PRINTED WIRING BOARD, COPPER CLAD LAMINATE AND METHOD FOR PRODUCING PRINTED WIRING BOARD | JX NIPPON MINING & METALS CORPORATION (JP) | 2016-06-23 | — | — | US | disclosed |
| US-20160157356-A1 | SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, RESIN SUBSTRATE, PRINTED WIRING BOARD, COPPER CLAD LAMINATE AND METHOD FOR PRODUCING PRINTED WIRING BOARD | JX NIPPON MINING & METALS CORPORATION (JP) | 2016-06-02 | — | — | US | disclosed |
| US-20120189859-A1 | RESIN COMPOSITE ELECTROLYTIC COPPER FOIL, COPPER CLAD LAMINATE AND PRINTED WIRING BOARD | PI R&D CO., LTD. (JP) | 2012-07-26 | — | — | US | disclosed |
| US-20110281126-A1 | RESIN COMPOSITE COPPER FOIL | PI R&D CO., LTD. (JP) | 2011-11-17 | — | — | US | disclosed |
| US-7989081-B2 | Resin composite copper foil, printed wiring board, and production processes thereof | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2011-08-02 | — | — | US | disclosed |
| US-7892651-B2 | Resin composite metal foil, laminate and process for the production of printed wiring board using the laminate | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2011-02-22 | — | — | US | disclosed |
| US-7445852-B2 | Magnetic substrate, laminate of magnetic substrate and method for producing thereof | MITSUI CHEMICALS, INC. (JP) | 2008-11-04 | — | — | US | disclosed |
| US-20070172674-A1 | Resin composite copper foil, printed wiring board, and production processes thereof | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2007-07-26 | — | — | US | disclosed |