SCHEMBL1190672

SCHEMBL1190672

O=[Si]([O-])[O-].O=[Si]([O-])[O-].[Hf+4].[Zr]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15518525 0.94
SCHEMBL42699 0.94
SCHEMBL1369334 0.88
SCHEMBL1370295 0.88
SCHEMBL664919 0.88
SCHEMBL404488 0.88
SCHEMBL644385 0.88
SCHEMBL356290 0.88
SCHEMBL9191513 0.88
SCHEMBL15105357 0.88

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9184061-B2 Systems and methods for forming zirconium and/or hafnium-containing layers MICRON TECHNOLOGY, INC. (US) 2015-11-10 US claimed
EP-1532290-B1 SYSTEMS AND METHODS FOR FORMING ZIRCONIUM AND/OR HAFNIUM-CONTAINING LAYERS MICRON TECHNOLOGY INC (US) 2008-12-24 EP claimed
US-7112485-B2 Systems and methods for forming zirconium and/or hafnium-containing layers MICRON TECHNOLOGY, INC. (US) 2006-09-26 US claimed
US-20050160981-A9 Systems and methods for forming zirconium and/or hafnium-containing layers MICRON TECHNOLOGY, INC. (US) 2005-07-28 US claimed
EP-1532290-A2 SYSTEMS AND METHODS FOR FORMING ZIRCONIUM AND/OR HAFNIUM-CONTAINING LAYERS MICRON TECHNOLOGY, INC. (US) 2005-05-25 EP claimed
WO-2004020691-A2 SYSTEMS AND METHODS FOR FORMING ZIRCONIUM AND/OR HAFNIUM-CONTAINING LAYERS MICRON TECHNOLOGY, INC. (US) 2004-03-11 WO claimed
US-20040040501-A1 Systems and methods for forming zirconium and/or hafnium-containing layers MICRON TECHNOLOGY, INC. (US) 2004-03-04 US claimed
US-9184061-B2 Systems and methods for forming zirconium and/or hafnium-containing layers MICRON TECHNOLOGY, INC. (US) 2015-11-10 US disclosed
US-8563085-B2 Precursor composition, methods of forming a layer, methods of forming a gate structure and methods of forming a capacitor SAMSUNG ELECTRONICS CO., LTD. (KR) 2013-10-22 US disclosed
US-20110183527-A1 Precursor Composition, Methods of Forming a Layer, Methods of Forming a Gate Structure and Methods of Forming a Capacitor SAMSUNG ELECTRONICS CO., LTD. (KR) 2011-07-28 US disclosed
US-20110045183-A1 METHODS OF FORMING A LAYER, METHODS OF FORMING A GATE STRUCTURE AND METHODS OF FORMING A CAPACITOR SAMSUNG ELECTRONICS CO., LTD. (KP) 2011-02-24 US disclosed
US-20090130414-A1 Preparation of A Metal-containing Film Via ALD or CVD Processes AIR PRODUCTS AND CHEMICALS, INC. (US) 2009-05-21 US disclosed
EP-2058416-A2 Preparation of a metal-containing film via ALD or CVD processes Air Products and Chemicals, Inc. (US) 2009-05-13 EP disclosed
US-7112485-B2 Systems and methods for forming zirconium and/or hafnium-containing layers MICRON TECHNOLOGY, INC. (US) 2006-09-26 US disclosed
US-20050160981-A9 Systems and methods for forming zirconium and/or hafnium-containing layers MICRON TECHNOLOGY, INC. (US) 2005-07-28 US disclosed
EP-1532290-A2 SYSTEMS AND METHODS FOR FORMING ZIRCONIUM AND/OR HAFNIUM-CONTAINING LAYERS MICRON TECHNOLOGY, INC. (US) 2005-05-25 EP disclosed
WO-2004020691-A2 SYSTEMS AND METHODS FOR FORMING ZIRCONIUM AND/OR HAFNIUM-CONTAINING LAYERS MICRON TECHNOLOGY, INC. (US) 2004-03-11 WO disclosed
US-20040040501-A1 Systems and methods for forming zirconium and/or hafnium-containing layers MICRON TECHNOLOGY, INC. (US) 2004-03-04 US disclosed
US-6350429-B1 IMPREGNATION OF CATION OXIDE FRAMEWORK WITH LIQUID TO FORM PORES, SILICON OXIDE WITH METAL OXIDE, ALUMINUM OXIDE AND PHOSPHOROUS OXIDE ABB LUMMUS GLOBAL INC. 2002-02-26 US disclosed
US-6004527-A HYDROTHERMAL SYNTHESIS OF LARGE PORE MOLECULAR SIEVES FROM MATERIALS, AT LEAST ONE OF WHICH CONTAINS AMORPHOUS FRAMEWORK STRUCTURE WHICH IS RETAINED IN PRODUCT ABB LUMMUS GLOBAL INC. (US) 1999-12-21 US disclosed