⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Formaldehyde SCHEMBL25432583 | 0.95 | CYP4F2 (0.44) | — | |
| SCHEMBL28176663 | 0.91 | PKM (0.43) | — | |
| Ethyl Acetate SCHEMBL28133101 | 0.91 | ALDH1A1 (0.64) | — | |
| SCHEMBL7744030 | 0.85 | MMP8 (0.43) | — | |
| Lactic Acid SCHEMBL6834392 | 0.85 | TP53 (0.44) | — | |
| SCHEMBL29242724 | 0.85 | ALDH1A1 (0.39) | — | |
| SCHEMBL26247238 | 0.84 | CYP4F2 (0.43) | — | |
| SCHEMBL8360055 | 0.83 | — | — | |
| SCHEMBL8945034 | 0.83 | ALDH1A1 (0.48) | — | |
| SCHEMBL28853224 | 0.83 | CYP4F2 (0.44) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Appears in 10012 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20260147279-A1 | DEVELOPER COMPOSITION FOR METAL-CONTAINING PHOTORESIST, AND METHOD OF FORMING PATTERNS INCLUDING DEVELOPING METHOD USING THE COMPOSITION | SAMSUNG SDI CO., LTD. (KR) | 2026-05-28 | — | — | US | claimed |
| US-12585186-B2 | Photoacid generator, chemically amplified resist composition, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-03-24 | — | — | US | claimed |
| CN-121578590-A | Composition for forming lower layer film of patterning material and lower layer film of patterning material | 珠海基石科技有限公司 | 2026-02-27 | — | — | CN | claimed |
| US-20260050214-A1 | MOLECULAR RESIST COMPOSITION AND PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-02-19 | — | — | US | claimed |
| US-12535733-B2 | Molecular resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-01-27 | — | — | US | claimed |
| US-20250377591-A1 | PHOTORESIST COMPOSITION AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE | SAMSUNG ELECTRONICS CO LTD (KR) | 2025-12-11 | — | — | US | claimed |
| EP-4619826-A1 | THICK FILM CHEMICALLY AMPLIFIED POSITIVE TYPE RESIST COMPOSITION AND METHOD FOR MANUFACTURING RESIST FILM USING THE SAME | Merck Patent GmbH (DE) | 2025-09-24 | — | — | EP | claimed |
| EP-4616684-A1 | LIQUID CRYSTALLINE SAM VIA SPIN-COAT ASSEMBLY AND THEIR AREA SELECTIVE DEPOSITION PROPERTIES | Merck Patent GmbH (DE) | 2025-09-17 | — | — | EP | claimed |
| EP-4615891-A1 | DSA OF LIQUID CRYSTAL BLOCK COPOLYMERS FOR INTEGRATED CIRCUIT PATTERNING | Merck Patent GmbH (DE) | 2025-09-17 | — | — | EP | claimed |
| CN-114995058-B | Resin precursor composition, polyimide resin film containing resin precursor composition and application of polyimide resin film | 吉林奥来德光电材料股份有限公司 | 2025-05-06 | — | — | CN | claimed |
| US-5422221-A | Hydrogen atoms of hydroxyl groups in novolac resin replaced by 1,2-naphthoquinonediazidosulfonyl group; sensitiivity, resolution, heat resistance | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1995-06-06 | — | — | US | claimed |
| EP-0629671-A2 | Solvent composition | NITTO CHEMICAL INDUSTRY CO., LTD. (JP) | 1994-12-21 | — | — | EP | claimed |
| US-5164279-A | Quinonediazide | SHIPLEY COMPANY INC. (US) | 1992-11-17 | — | — | US | claimed |
| EP-0211667-B1 | RADIATION-SENSITIVE RESIN COMPOSITION | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1992-03-11 | — | — | EP | claimed |
| EP-0457367-A1 | Radiation-sensitive resin composition | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1991-11-21 | — | — | EP | claimed |
| US-4983492-A | Positive dye photoresist compositions with 2,4-bis(phenylazo)resorcinol | SHIPLEY COMPANY INC. (US) | 1991-01-08 | — | — | US | claimed |
| EP-0345714-A2 | Dyed photoresist compositions and process | ASPECT SYSTEMS CORPORATION (US) | 1989-12-13 | — | — | EP | claimed |
| EP-0273026-A2 | Solvents for Photoresist compositions | SHIPLEY COMPANY INC. (US) | 1988-06-29 | — | — | EP | claimed |
| EP-0120242-B1 | PROCESS FOR COATING A SUBSTRATE WITH POLYIMIDE | International Business Machines Corporation (US) | 1987-01-07 | — | — | EP | claimed |
| EP-0120242-A1 | Process for coating a substrate with polyimide | International Business Machines Corporation (US) | 1984-10-03 | — | — | EP | claimed |