⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL14817690 | 0.94 | DGKA (0.30) | — | |
| SCHEMBL10191365 | 0.92 | — | — | |
| SCHEMBL12235014 | 0.86 | FGFR1 (0.33) | — | |
| SCHEMBL13558159 | 0.86 | DGKA (0.30) | — | |
| SCHEMBL12235944 | 0.84 | — | — | |
| SCHEMBL14817267 | 0.83 | — | — | |
| SCHEMBL15865972 | 0.82 | — | — | |
| SCHEMBL14548547 | 0.81 | — | — | |
| SCHEMBL13153222 | 0.80 | — | — | |
| SCHEMBL16572698 | 0.80 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8742038-B2 | Resist composition for immersion exposure, method of forming resist pattern using the same, and fluorine-containing compound | TOKYO OHKA KOGYO CO., LTD. (JP) | 2014-06-03 | — | — | US | disclosed |
| US-8642244-B2 | Resist composition for immersion exposure, method of forming resist pattern using the same, and fluorine-containing compound | TOKYO OHKA KOGYO CO., LTD. (JP) | 2014-02-04 | — | — | US | disclosed |
| US-8501387-B2 | — | — | 2013-08-06 | — | — | US | disclosed |
| US-8450044-B2 | Positive resist composition and method of forming resist pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2013-05-28 | — | — | US | disclosed |
| US-8367296-B2 | Positive resist composition, method of forming resist pattern, and polymeric compound | TOKYO OHKA KOGYO CO., LTD. (JP) | 2013-02-05 | — | — | US | disclosed |
| US-8039199-B2 | Negative resist composition for immersion exposure and method of forming resist pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2011-10-18 | — | — | US | disclosed |
| US-20100081086-A1 | POSITIVE RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND POLYMERIC COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 2010-04-01 | — | — | US | disclosed |
| US-20090274976-A1 | Negative resist composition for immersion exposure and method of forming resist pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2009-11-05 | — | — | US | disclosed |