SCHEMBL12235014

SCHEMBL12235014

CCC(C)(C)CC(C)(C(=O)OCC(=O)OCC(F)(F)C(F)(F)F)C(C)(C)CC

nearest known ligand 0.33

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
FGFR1 P11362 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14817217 0.92
SCHEMBL10191367 0.92 FGFR1 (0.33) FGFR1
SCHEMBL15160026 0.92 FGFR1 (0.31) FGFR1
SCHEMBL14331407 0.90 HTT (0.33)
SCHEMBL12235013 0.86
SCHEMBL12235944 0.86
SCHEMBL14817690 0.85 DGKA (0.30)
SCHEMBL13760128 0.84 FGFR1 (0.33) FGFR1
SCHEMBL15865971 0.84 MMP8 (0.32)
SCHEMBL15080720 0.84

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2088466-B1 Resist composition for immersion exposure, method of forming resist pattern using the same, and fluorine-containing compound TOKYO OHKA KOGYO CO LTD (JP) 2016-10-26 EP disclosed
US-8742038-B2 Resist composition for immersion exposure, method of forming resist pattern using the same, and fluorine-containing compound TOKYO OHKA KOGYO CO., LTD. (JP) 2014-06-03 US disclosed
US-8450044-B2 Positive resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2013-05-28 US disclosed
US-8404428-B2 Positive resist composition, method of forming resist pattern using the same, and fluorine-containing polymeric compound TOKYO OHKA KOGYO CO., LTD. (JP) 2013-03-26 US disclosed
US-8039199-B2 Negative resist composition for immersion exposure and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2011-10-18 US disclosed
US-20090274976-A1 Negative resist composition for immersion exposure and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2009-11-05 US disclosed