⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL674489 | 0.71 | ALDH1A1 (0.32) | — | |
| SCHEMBL6048965 | 0.63 | — | — | |
| SCHEMBL1224948 | 0.63 | — | — | |
| SCHEMBL27800849 | 0.62 | — | — | |
| SCHEMBL6525051 | 0.59 | ALDH1A1 (0.32) | — | |
| SCHEMBL6048980 | 0.59 | — | — | |
| SCHEMBL195841 | 0.59 | — | — | |
| SCHEMBL6048748 | 0.57 | — | — | |
| SCHEMBL17732197 | 0.57 | — | — | |
| SCHEMBL9224804 | 0.56 | ALDH1A1 (0.37) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111819249-A | Curable composition, cured product, method for producing cured product, and method for using curable composition | 琳得科株式会社 | 2020-10-23 | — | — | CN | disclosed |
| CN-106574116-B | Curable composition, cured product, method for using curable composition, and optical device | 琳得科株式会社 | 2020-07-14 | — | — | CN | disclosed |
| EP-2963088-B1 | CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, PHOTOELEMENT SEALING BODY AND METHOD FOR PRODUCING PHOTOELEMENT SEALING BODY | LINTEC CORP (JP) | 2020-06-10 | — | — | EP | disclosed |
| WO-2019176828-A1 | CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING CURED PRODUCT, AND METHOD FOR USING CURABLE COMPOSITION | リンテック株式会社 | 2019-09-19 | — | — | WO | disclosed |
| US-10266734-B2 | Curable composition, cured product, method for using curable composition, and optical device | LINTEC CORPORATION (JP) | 2019-04-23 | — | — | US | disclosed |
| EP-3187547-B1 | CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, AND OPTICAL DEVICE | LINTEC CORP (JP) | 2018-12-05 | — | — | EP | disclosed |
| US-9783715-B2 | Curable composition, cured product, method for using curable composition, photoelement sealing body and method for producing photoelement sealing body | LINTEC CORPORATION (JP) | 2017-10-10 | — | — | US | disclosed |
| US-20170275513-A1 | CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, AND OPTICAL DEVICE | LINTEC CORPORATION (JP) | 2017-09-28 | — | — | US | disclosed |
| EP-3187547-A1 | CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, AND OPTICAL DEVICE | Lintec Corporation (JP) | 2017-07-05 | — | — | EP | disclosed |
| US-9359533-B2 | Curable composition, cured product, and method for using curable composition | LINTEC CORPORATION (JP) | 2016-06-07 | — | — | US | disclosed |
| EP-2963088-A1 | CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, PHOTOELEMENT SEALING BODY AND METHOD FOR PRODUCING PHOTOELEMENT SEALING BODY | Lintec Corporation (JP) | 2016-01-06 | — | — | EP | disclosed |
| US-20150065663-A1 | CURABLE COMPOSITION, CURED PRODUCT, AND METHOD FOR USING CURABLE COMPOSITION | LINTEC CORPORATION (JP) | 2015-03-05 | — | — | US | disclosed |
| EP-2829579-A1 | CURABLE COMPOSITION, CURED PRODUCT, AND METHOD FOR USING CURABLE COMPOSITION | LINTEC Corporation (JP) | 2015-01-28 | — | — | EP | disclosed |
| US-8728624-B2 | Fixing material comprising silane compound polymer and photonic device sealed body | LINTEC CORPORATION (JP) | 2014-05-20 | — | — | US | disclosed |
| US-8507044-B2 | Molding material composed of polyorganosiloxane compound, sealing material, and sealed optical device | LINTEC CORPORATION (JP) | 2013-08-13 | — | — | US | disclosed |
| US-20130096253-A1 | FIXING MATERIAL COMPRISING SILANE COMPOUND POLYMER AND PHOTONIC DEVICE SEALED BODY | LINTEC CORPORATION (JP) | 2013-04-18 | — | — | US | disclosed |
| US-8357261-B2 | Adhesive mainly composed of polyorganosiloxane compound | LINTEC CORPORATION (JP) | 2013-01-22 | — | — | US | disclosed |
| US-20110124812-A1 | FIXING MATERIAL COMPRISING SILANE COMPOUND POLYMER AND PHOTONIC DEVICE SEALED BODY | LINTEC CORPORATION (JP) | 2011-05-26 | — | — | US | disclosed |
| US-20110054139-A1 | ADHESIVE MAINLY COMPOSED OF POLYORGANOSILOXANE COMPOUND | LINTEC CORPORATION (JP) | 2011-03-03 | — | — | US | disclosed |
| US-20110034659-A1 | MOLDING MATERIAL COMPOSED OF POLYORGANOSILOXANE COMPOUND, SEALING MATERIAL, AND SEALED OPTICAL DEVICE | LINTEC CORPORATION (JP) | 2011-02-10 | — | — | US | disclosed |