SCHEMBL1223970

SCHEMBL1223970

CCO[Si](CCCOCc1ccccc1)(OCC)OCC

nearest known ligand 0.45

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.45
L3MBTL1 Q9Y468 3/20 0.44
TDP1 Q9NUW8 1/20 0.44
HRH4 Q9H3N8 1/20 0.43
HRH3 Q9Y5N1 1/20 0.43
SMN1; SMN2 Q16637 2/20 0.39
RAB9A P51151 1/20 0.39
MEN1 O00255 1/20 0.39
KMT2A Q03164 1/20 0.39
NAAA Q02083 2/20 0.37
HTT P42858 1/20 0.37
ALDH1A1 P00352 1/20 0.36
HTR1A P08908 1/20 0.36
ADRA1D P25100 1/20 0.36
ADRA1A P35348 1/20 0.36
ADRA1B P35368 1/20 0.36
LTA4H P09960 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10961573 0.85 TSHR (0.44) TSHRL3MBTL1TDP1HRH4HRH3
SCHEMBL10966011 0.83 L3MBTL1 (0.54) TSHRL3MBTL1TDP1HRH4HRH3
SCHEMBL1546155 0.81 MAPT (0.42) TSHRL3MBTL1TDP1SMN1; SMN2MEN1
SCHEMBL9315283 0.80 CHRNB2 (0.33) L3MBTL1TDP1MEN1KMT2AALDH1A1
SCHEMBL13029163 0.80 NAAA (0.40) L3MBTL1TDP1HRH4HRH3NAAA
SCHEMBL9314685 0.79 TP53 (0.34) TDP1NAAA
SCHEMBL9609735 0.79 CYP1A2 (0.37) L3MBTL1TDP1KMT2AALDH1A1
SCHEMBL15387165 0.79 CHRM2 (0.44) L3MBTL1SMN1; SMN2RAB9AMEN1KMT2A
SCHEMBL729820 0.79 TSHR (0.35) TSHRL3MBTL1TDP1ALDH1A1HTR1A
SCHEMBL14524315 0.78 TSHR (0.56) TSHRL3MBTL1TDP1HRH4HRH3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106574116-B Curable composition, cured product, method for using curable composition, and optical device 琳得科株式会社 2020-07-14 CN disclosed
EP-2963088-B1 CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, PHOTOELEMENT SEALING BODY AND METHOD FOR PRODUCING PHOTOELEMENT SEALING BODY LINTEC CORP (JP) 2020-06-10 EP disclosed
US-10266734-B2 Curable composition, cured product, method for using curable composition, and optical device LINTEC CORPORATION (JP) 2019-04-23 US disclosed
EP-3187547-B1 CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, AND OPTICAL DEVICE LINTEC CORP (JP) 2018-12-05 EP disclosed
US-9783715-B2 Curable composition, cured product, method for using curable composition, photoelement sealing body and method for producing photoelement sealing body LINTEC CORPORATION (JP) 2017-10-10 US disclosed
US-20170275513-A1 CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, AND OPTICAL DEVICE LINTEC CORPORATION (JP) 2017-09-28 US disclosed
EP-3187547-A1 CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, AND OPTICAL DEVICE Lintec Corporation (JP) 2017-07-05 EP disclosed
US-20160009970-A1 CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, PHOTOELEMENT SEALING BODY AND METHOD FOR PRODUCING PHOTOELEMENT SEALING BODY LINTEC CORPORATION (JP) 2016-01-14 US disclosed
EP-2963088-A1 CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, PHOTOELEMENT SEALING BODY AND METHOD FOR PRODUCING PHOTOELEMENT SEALING BODY Lintec Corporation (JP) 2016-01-06 EP disclosed
EP-2546306-B1 CURABLE COMPOSITION, HARDENED MATERIAL, AND METHOD FOR USING CURABLE COMPOSITION LINTEC CORP (JP) 2015-05-27 EP disclosed
US-8507044-B2 Molding material composed of polyorganosiloxane compound, sealing material, and sealed optical device LINTEC CORPORATION (JP) 2013-08-13 US disclosed
US-8481669-B2 Molding material comprising polysilsesquioxane compound, sealing material, and sealed optical element LINTEC CORPORATION (JP) 2013-07-09 US disclosed
US-20130035455-A1 CURABLE COMPOSITION, CURED PRODUCT, AND METHOD FOR USING OF CURABLE COMPOSITION LINTEC CORPORATION (JP) 2013-02-07 US disclosed
US-8357261-B2 Adhesive mainly composed of polyorganosiloxane compound LINTEC CORPORATION (JP) 2013-01-22 US disclosed
EP-2546306-A1 CURABLE COMPOSITION, HARDENED MATERIAL, AND METHOD FOR USING CURABLE COMPOSITION LINTEC Corporation (JP) 2013-01-16 EP disclosed
US-20110054139-A1 ADHESIVE MAINLY COMPOSED OF POLYORGANOSILOXANE COMPOUND LINTEC CORPORATION (JP) 2011-03-03 US disclosed
US-20110034659-A1 MOLDING MATERIAL COMPOSED OF POLYORGANOSILOXANE COMPOUND, SEALING MATERIAL, AND SEALED OPTICAL DEVICE LINTEC CORPORATION (JP) 2011-02-10 US disclosed
US-20090005530-A1 Molding material comprising polysilsesquioxane compound, sealing material, and sealed optical element LINTEC CORPORATION (JP) 2009-01-01 US disclosed
US-4528353-A Adhesion promoters for one-component RTV silicone compositions GENERAL ELECTRIC COMPANY (US) 1985-07-09 US disclosed
US-4483973-A Adhesion promoters for one-component RTV silicone compositions GENERAL ELECTRIC COMPANY (US) 1984-11-20 US disclosed