SCHEMBL1224337

SCHEMBL1224337

CO[Si](Cl)(Cl)c1ccccc1

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA4 P22748 2/20 0.38
ESR1 P03372 1/20 0.34
ESR2 Q92731 1/20 0.34
POLB P06746 1/20 0.33
CA12 O43570 1/20 0.33
CA1 P00915 1/20 0.33
CA2 P00918 1/20 0.33
CA7 P43166 1/20 0.33
CA9 Q16790 1/20 0.33
CA14 Q9ULX7 1/20 0.33
ALDH1A1 P00352 3/20 0.32
LTA4H P09960 1/20 0.32
CYP1A2 P05177 1/20 0.32
CYP2C19 P33261 1/20 0.32
TSHR P16473 4/20 0.31
MEN1 O00255 1/20 0.31
MAPT P10636 1/20 0.31
KMT2A Q03164 1/20 0.31
ATM Q13315 1/20 0.31
ORAI1 Q96D31 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1224540 0.79 CA4 (0.38) CA4ESR1ESR2POLBCA12
SCHEMBL10824434 0.79 CA4 (0.38) CA4ESR1ESR2POLBCA12
SCHEMBL4265454 0.78 TSHR (0.33) ESR1ESR2ALDH1A1LTA4HTSHR
SCHEMBL17835349 0.77 ACHE (0.40) CA1CA2CA7CA9ALDH1A1
SCHEMBL4195240 0.77 ESR1 (0.38) CA4ESR1ESR2POLBCA12
SCHEMBL10606245 0.76 ORAI1 (0.32) ESR1ESR2ALDH1A1LTA4HTSHR
SCHEMBL18108034 0.75 CA4 (0.35) CA4ESR1ESR2POLBCA12
SCHEMBL5154791 0.75 ESR1 (0.41) ESR1ESR2
SCHEMBL18108055 0.75 CA4 (0.35) CA4ESR1ESR2POLBCA12
SCHEMBL646249 0.75 CA4 (0.43) CA4ESR1ESR2POLBCA12

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 89 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119324093-A Low-temperature composite polymer conductive silver paste with high conductivity and low silver content and preparation method thereof 宁夏中色新材料有限公司 2025-01-17 CN claimed
CN-119324093-A Low-temperature composite polymer conductive silver paste with high conductivity and low silver content and preparation method thereof 宁夏中色新材料有限公司 2025-01-17 CN disclosed
CN-113574116-B Curable composition, cured product, and method for using curable composition 琳得科株式会社 2023-02-28 CN disclosed
CN-112739775-B Curable composition, cured product, and method for using curable composition 琳得科株式会社 2022-11-01 CN disclosed
CN-115151611-A Curable composition, cured product, and method for using curable composition 琳得科株式会社 2022-10-04 CN disclosed
CN-115124973-A Adhesive paste, method for using adhesive paste, and method for manufacturing semiconductor device 琳得科株式会社 2022-09-30 CN disclosed
WO-2022202844-A1 ADHESIVE PASTE, METHOD FOR USING ADHESIVE PASTE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE リンテック株式会社 2022-09-29 WO disclosed
WO-2022202846-A1 ADHESIVE PASTE, METHOD FOR USING ADHESIVE PASTE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE リンテック株式会社 2022-09-29 WO disclosed
WO-2022202119-A1 CURABLE COMPOSITION AND CURED OBJECT リンテック株式会社 2022-09-29 WO disclosed
WO-2022202845-A1 ADHESIVE PASTE, USAGE METHOD FOR ADHESIVE PASTE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE リンテック株式会社 2022-09-29 WO disclosed
US-20110124812-A1 FIXING MATERIAL COMPRISING SILANE COMPOUND POLYMER AND PHOTONIC DEVICE SEALED BODY LINTEC CORPORATION (JP) 2011-05-26 US disclosed
US-20110054139-A1 ADHESIVE MAINLY COMPOSED OF POLYORGANOSILOXANE COMPOUND LINTEC CORPORATION (JP) 2011-03-03 US disclosed
US-20110034659-A1 MOLDING MATERIAL COMPOSED OF POLYORGANOSILOXANE COMPOUND, SEALING MATERIAL, AND SEALED OPTICAL DEVICE LINTEC CORPORATION (JP) 2011-02-10 US disclosed
US-20090156775-A1 POLYSILANE AND POLYSILANE-CONTAINING RESIN COMPOSITION OSAKA GAS CO., LTD. (JP) 2009-06-18 US disclosed
US-20090005530-A1 Molding material comprising polysilsesquioxane compound, sealing material, and sealed optical element LINTEC CORPORATION (JP) 2009-01-01 US disclosed
EP-1999167-A2 ZIEGLER-NATTA CATALYST WITH IN SITU-GENERATED DONOR Novolen Technology Holdings, C.V. (NL) 2008-12-10 EP disclosed
US-20080249278-A1 Sealing material for optical element and sealed optical element LINTEC CORPORATION (JP) 2008-10-09 US disclosed
EP-1958979-A1 POLYSILANE AND RESIN COMPOSITION CONTAINING POLYSILANE OSAKA GAS CO., LTD. (JP) 2008-08-20 EP disclosed
WO-2007106348-A2 ZIEGLER-NATTA CATALYST WITH IN SITU-GENERATED DONOR NOVOLEN TECHNOLOGY HOLDINGS C.V. (NL) 2007-09-20 WO disclosed
US-20070213204-A1 Ziegler-Natta catalyst with in situ-generated donor NOVOLEN TECHNOLOGY HOLDINGS C.V. 2007-09-13 US disclosed