Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | NAAA | Q02083 | 1/20 | 0.52 |
| ▸ | HTT | P42858 | 1/20 | 0.39 |
| ▸ | DGKA | P23743 | 1/20 | 0.34 |
| ▸ | GAA | P10253 | 2/20 | 0.34 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.33 |
| ▸ | RAD52 | P43351 | 1/20 | 0.33 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.33 |
| ▸ | POLB | P06746 | 1/20 | 0.33 |
| ▸ | FAAH | O00519 | 1/20 | 0.33 |
| ▸ | DNM1 | Q05193 | 1/20 | 0.33 |
| ▸ | MGAM | O43451 | 1/20 | 0.32 |
| ▸ | SI | P14410 | 1/20 | 0.32 |
| ▸ | MGAM2 | Q2M2H8 | 1/20 | 0.32 |
| ▸ | SOAT1 | P35610 | 1/20 | 0.32 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.32 |
| ▸ | HTR2C | P28335 | 1/20 | 0.32 |
| ▸ | ACHE | P22303 | 4/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28556166 | 0.94 | NAAA (0.55) | NAAAHTTDGKAGAAALDH1A1 | |
| SCHEMBL30226988 | 0.93 | NAAA (0.58) | NAAAHTTDGKARAD52NPSR1 | |
| SCHEMBL28379557 | 0.91 | NAAA (0.47) | NAAAHTTDGKAGAAALDH1A1 | |
| SCHEMBL9323713 | 0.89 | GAA (0.46) | NAAADGKAGAAALDH1A1POLB | |
| SCHEMBL176417 | 0.89 | DGKA (0.42) | NAAADGKAGAAALDH1A1DNM1 | |
| SCHEMBL15356546 | 0.88 | NAAA (0.45) | NAAAHTTDGKAGAAALDH1A1 | |
| SCHEMBL28902382 | 0.87 | NAAA (0.43) | NAAAHTT | |
| SCHEMBL15806575 | 0.85 | GAA (0.54) | NAAAGAAALDH1A1POLBFAAH | |
| SCHEMBL180550 | 0.85 | HTR2C (0.40) | NAAADGKAGAAALDH1A1RAD52 | |
| SCHEMBL5697116 | 0.85 | NAAA (0.36) | NAAADGKAGAAALDH1A1RAD52 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116691232-A | Tire with a tire body | 住友橡胶工业株式会社 | 2023-09-05 | — | — | CN | disclosed |
| WO-2021065621-A1 | COMPOSITE MATERIAL | 日清紡ホールディングス株式会社 | 2021-04-08 | — | — | WO | disclosed |
| EP-2963088-B1 | CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, PHOTOELEMENT SEALING BODY AND METHOD FOR PRODUCING PHOTOELEMENT SEALING BODY | LINTEC CORP (JP) | 2020-06-10 | — | — | EP | disclosed |
| US-10266734-B2 | Curable composition, cured product, method for using curable composition, and optical device | LINTEC CORPORATION (JP) | 2019-04-23 | — | — | US | disclosed |
| EP-3187547-B1 | CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, AND OPTICAL DEVICE | LINTEC CORP (JP) | 2018-12-05 | — | — | EP | disclosed |
| US-9783715-B2 | Curable composition, cured product, method for using curable composition, photoelement sealing body and method for producing photoelement sealing body | LINTEC CORPORATION (JP) | 2017-10-10 | — | — | US | disclosed |
| US-20170275513-A1 | CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, AND OPTICAL DEVICE | LINTEC CORPORATION (JP) | 2017-09-28 | — | — | US | disclosed |
| EP-3187547-A1 | CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, AND OPTICAL DEVICE | Lintec Corporation (JP) | 2017-07-05 | — | — | EP | disclosed |
| US-20160009970-A1 | CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, PHOTOELEMENT SEALING BODY AND METHOD FOR PRODUCING PHOTOELEMENT SEALING BODY | LINTEC CORPORATION (JP) | 2016-01-14 | — | — | US | disclosed |
| EP-2963088-A1 | CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, PHOTOELEMENT SEALING BODY AND METHOD FOR PRODUCING PHOTOELEMENT SEALING BODY | Lintec Corporation (JP) | 2016-01-06 | — | — | EP | disclosed |
| US-8703880-B2 | Curable composition, cured product, and method for using of curable composition | LINTEC CORPORATION (JP) | 2014-04-22 | — | — | US | disclosed |
| US-8507044-B2 | Molding material composed of polyorganosiloxane compound, sealing material, and sealed optical device | LINTEC CORPORATION (JP) | 2013-08-13 | — | — | US | disclosed |
| US-8481669-B2 | Molding material comprising polysilsesquioxane compound, sealing material, and sealed optical element | LINTEC CORPORATION (JP) | 2013-07-09 | — | — | US | disclosed |
| US-20130035455-A1 | CURABLE COMPOSITION, CURED PRODUCT, AND METHOD FOR USING OF CURABLE COMPOSITION | LINTEC CORPORATION (JP) | 2013-02-07 | — | — | US | disclosed |
| US-8357261-B2 | Adhesive mainly composed of polyorganosiloxane compound | LINTEC CORPORATION (JP) | 2013-01-22 | — | — | US | disclosed |
| EP-2546306-A1 | CURABLE COMPOSITION, HARDENED MATERIAL, AND METHOD FOR USING CURABLE COMPOSITION | LINTEC Corporation (JP) | 2013-01-16 | — | — | EP | disclosed |
| US-20110054139-A1 | ADHESIVE MAINLY COMPOSED OF POLYORGANOSILOXANE COMPOUND | LINTEC CORPORATION (JP) | 2011-03-03 | — | — | US | disclosed |
| US-20110034659-A1 | MOLDING MATERIAL COMPOSED OF POLYORGANOSILOXANE COMPOUND, SEALING MATERIAL, AND SEALED OPTICAL DEVICE | LINTEC CORPORATION (JP) | 2011-02-10 | — | — | US | disclosed |
| US-20090005530-A1 | Molding material comprising polysilsesquioxane compound, sealing material, and sealed optical element | LINTEC CORPORATION (JP) | 2009-01-01 | — | — | US | disclosed |
| US-5679821-A | Process for preparing organosilicon compound | TOAGOSEI CO., LTD. (JP) | 1997-10-21 | — | — | US | disclosed |