⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL12794888 | 0.98 | — | — | |
| SCHEMBL12794802 | 0.88 | — | — | |
| SCHEMBL12972155 | 0.81 | ALDH1A1 (0.35) | — | |
| SCHEMBL1230316 | 0.81 | — | — | |
| SCHEMBL12190541 | 0.79 | — | — | |
| SCHEMBL2446917 | 0.78 | CYP1A2 (0.30) | — | |
| SCHEMBL483740 | 0.77 | — | — | |
| SCHEMBL9861470 | 0.76 | PRKD3 (0.38) | — | |
| SCHEMBL3923447 | 0.76 | — | — | |
| SCHEMBL7007451 | 0.73 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10208206-B2 | Curable resin composition and cured product thereof, sealing material for optical semiconductor, die bonding material, and optical semiconductor light-emitting element | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2019-02-19 | — | — | US | disclosed |
| US-20160115318-A1 | Curable Resin Composition and Cured Product Thereof, Sealing Material for Optical Semiconductor, Die Bonding Material, and Optical Semiconductor Light-Emitting Element | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2016-04-28 | — | — | US | disclosed |
| EP-2995634-A1 | CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF, SEALING MATERIAL FOR OPTICAL SEMICONDUCTOR, DIE BONDING MATERIAL, AND OPTICAL SEMICONDUCTOR LIGHT-EMITTING ELEMENT | Asahi Kasei Chemicals Corporation (JP) | 2016-03-16 | — | — | EP | disclosed |
| US-8658346-B2 | Pattern forming process, chemically amplified positive resist composition, and resist-modifying composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-02-25 | — | — | US | disclosed |
| EP-2128193-B1 | POROUS POLYIMIDE | IBIDEN CO LTD (JP) | 2013-06-19 | — | — | EP | disclosed |
| US-8426105-B2 | Resist-modifying composition and pattern forming process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-04-23 | — | — | US | disclosed |
| CN-102076734-B | Modified resin composition, method for producing same, and curable resin composition containing same | ASAHI KASEI CHEMICALS CORP (JP) | 2013-02-27 | — | — | CN | disclosed |
| US-8367310-B2 | Pattern forming process and resist-modifying composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-02-05 | — | — | US | disclosed |
| EP-2138525-B1 | EPOXY SILICONE AND METHOD FOR PRODUCTION THEREOF, AND CURABLE RESIN COMPOSITION USING THE SAME AND USE THEREOF | ASAHI KASEI CHEMICALS CORP (JP) | 2012-12-26 | — | — | EP | disclosed |
| US-8329384-B2 | Resist-modifying composition and pattern forming process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-12-11 | — | — | US | disclosed |
| EP-1086969-B1 | NOVEL POLYISOCYANATE AND METHOD FOR PRODUCING THE SAME | ASAHI CHEMICAL IND (JP) | 2009-08-12 | — | — | EP | disclosed |
| US-6469122-B1 | POLYISOCYANATE OBTAINED BY REACTING A DIISOCYANATE SELECTED FROM AN ALIPHATIC DIISOCYANATE AND AN ALICYCLIC DIISOCYANATE WITH A POLYOL HAVING A NUMBER AVERAGE MOLECULAR WEIGHT OF FROM 3,000 TO 30,000; CURABLE SEALANT | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2002-10-22 | — | — | US | disclosed |
| EP-0844283-B1 | Curable resin composition and cured products | JSR CORP (JP) | 2002-10-09 | — | — | EP | disclosed |
| US-6313233-B1 | CAN BE CURED AND FABRICATED WITHOUT PRODUCING NO CRACKS INTO A CURED PRODUCT SUCH AS A SEMICONDUCTOR DEVICE HAVING A LOW DIELECTRIC CONSTANT, HIGH HEAT RESISTANCE AND MOISTURE RESISTANCE, SUPERIOR ADHESION TO VARIOUS SUBSTRATE MATERIALS | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 2001-11-06 | — | — | US | disclosed |
| EP-1086969-A1 | NOVEL POLYISOCYANATE AND PROCESS FOR PRODUCING THE SAME | Asahi Kasei Kogyo Kabushiki Kaisha (JP) | 2001-03-28 | — | — | EP | disclosed |
| US-6011123-A | ORGANOSILANE COMPOUND; POLYAMIC ACIDS HAVING A HYDROLYZABLE SILYL GROUP OR CARBOXYLIC ACID ANHYDRIDE GROUP, OR BOTH, AND POLYIMIDES HAVING A HYDROLYZABLE SILYL GROUP OR CARBOXYLIC ACID ANHYDRIDE GROUP, OR BOTH. | JSR CORPORATION (JP) | 2000-01-04 | — | — | US | disclosed |
| EP-0844283-A1 | Curable resin composition and cured products | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1998-05-27 | — | — | EP | disclosed |
| EP-0319911-B1 | Laminated structure | NIPPON SHEET GLASS CO LTD (JP) | 1994-04-06 | — | — | EP | disclosed |
| US-4925737-A | POLYESTER AND POLYVINYL BUTYRAL SHEETS LAMINATED WITH CURED ADHESIVE OF AMINOORGANOSILICON AND DIAMINE REACTION PRODUCT; SAFETY GLASS | NIPPON SHEET GLASS CO., LTD. (JP) | 1990-05-15 | — | — | US | disclosed |
| EP-0319911-A2 | Laminated structure | Nippon Sheet Glass Co., Ltd. (JP) | 1989-06-14 | — | — | EP | disclosed |