SCHEMBL123316

SCHEMBL123316

CC1(Cn2c(=O)n(CC3(C)CO3)c(=O)n(CC3(C)CO3)c2=O)CO1

nearest known ligand 0.34

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
TP53 P04637 1/20 0.34
HBB P68871 1/20 0.34
SMN1; SMN2 Q16637 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6153134 1.00 TP53 (0.34) TP53HBBSMN1; SMN2
SCHEMBL12040249 0.92 HTT (0.33) TP53HBBSMN1; SMN2
SCHEMBL10818548 0.89 GABRP (0.32)
SCHEMBL11189216 0.86 APEX1 (0.36)
SCHEMBL11188385 0.85 HTT (0.38)
SCHEMBL11184084 0.85 CYP3A4 (0.55) SMN1; SMN2
SCHEMBL11323944 0.85 HTT (0.38)
SCHEMBL11183800 0.85 CYP3A4 (0.55) SMN1; SMN2
SCHEMBL11193144 0.77 ALDH1A1 (0.31)
SCHEMBL10329448 0.74 TP53 (0.30) TP53HBBSMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 86 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20110031443-A1 Multicomponent carbon nanotube-polymer complex, composition for forming the same, and preparation method thereof SAMSUNG ELECTRONICS CO., LTD. (KR) 2011-02-10 US claimed
US-7763885-B2 Organic thin film transistor having surface-modified carbon nanotubes SAMSUNG ELECTRONICS CO., LTD. (KR) 2010-07-27 US claimed
US-20090121216-A9 Organic thin film transistor having surface-modified carbon nanotubes SAMSUNG ELECTRONICS CO., LTD. 2009-05-14 US claimed
US-20080191198-A1 Organic thin film transistor having surface-modified carbon nanotubes SAMSUNG ELECTRONICS CO., LTD. 2008-08-14 US claimed
EP-1121394-B1 THERMOSETTING POWDER COATING SYSTEMS TIGERWERK LACK U FARBENFABRIK (AT) 2004-08-18 EP claimed
EP-1057875-B1 RESIN COMPOSITIONS FOR POWDERY COATINGS NISSAN CHEMICAL IND LTD (JP) 2004-04-28 EP claimed
EP-0794984-B1 RESIN COMPOSITION FOR POWDER COATING NISSAN CHEMICAL IND LTD (JP) 2003-02-05 EP claimed
EP-0822189-B1 Method for producing purified epoxy compound NISSAN CHEMICAL IND LTD (JP) 2002-10-30 EP claimed
US-6335389-B1 COMPOSITION INCLUDING CARBOXYL GROUP-CONTAINING RESIN HAVING SPECIFIED NUMBER AVERAGE MOLECULAR WEIGHT, ACID VALUE AND GLASS TRANSITION TEMPERATURE, POLY-BETA-METHYLGLYCIDYL COMPOUND, STERICALLY HINDERED AMINE AS YELLOWING INHIBITOR NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2002-01-01 US claimed
US-6303706-B1 Resin composition for powder coating NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2001-10-16 US claimed
EP-1057875-A1 RESIN COMPOSITIONS FOR POWDERY COATINGS Nissan Chemical Industries, Ltd. (JP) 2000-12-06 EP claimed
US-6114473-A COMPRISING CARBOXYL GROUP-CONTAINING RESIN HAVING MOLECULAR WEIGHT OF 1,000 TO 20,000, ACID VALUE OF 5 TO 200, GLASS TRANSITION TEMPERATURE OF 30 TO 120 DEGREES C, POLYMERIZATION INHIBITOR, TRIS(BETA-METHYLGLYCIDYL)ISOCYANURATE NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2000-09-05 US claimed
US-5892065-A REACTING (2-METHYK)EPIHALOHYDRIN WITH A COMPOUND CONTAINING CARBOXY OR AMIDE GROUPS NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 1999-04-06 US claimed
EP-0822189-A2 Method for producing purified epoxy compound NISSAN CHEMICAL INDUSTRIES LTD. (JP) 1998-02-04 EP claimed
WO-1996017026-A1 RESIN COMPOSITION FOR POWDER COATING NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 1996-06-06 WO claimed
JP-8325481-A None JP disclosed
JP-8311163-A None JP disclosed
WO-1996017026-A1 RESIN COMPOSITION FOR POWDER COATING NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 1996-06-06 WO disclosed
WO-1996017026-A1 RESIN COMPOSITION FOR POWDER COATING NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 1996-06-06 WO disclosed
JP-S5858956-A COMPOSITION FOR BINDING OF MOLD MITSUI TOATSU CHEM INC 1983-04-07 JP disclosed