SCHEMBL123402

SCHEMBL123402

CCC(=O)CC(=O)OOC(C)C.CCC(=O)CC(=O)OOC(C)C.[Ti]

nearest known ligand 0.36

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.36
FAAH O00519 4/20 0.31
CNR1 P21554 1/20 0.31
CNR2 P34972 1/20 0.31
LMNA P02545 2/20 0.31
MGAM O43451 1/20 0.30
GAA P10253 1/20 0.30
SI P14410 1/20 0.30
MGAM2 Q2M2H8 1/20 0.30
ALDH1A1 P00352 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28225601 0.98 TDP1 (0.38) TDP1FAAHCNR1CNR2LMNA
SCHEMBL29613361 0.96 TDP1 (0.36) TDP1FAAHCNR1CNR2LMNA
SCHEMBL28226393 0.90 FFAR3 (0.32) TDP1
SCHEMBL27034026 0.87 TDP1 (0.30) TDP1
SCHEMBL30462935 0.84 ALDH1A1 (0.37) FAAHCNR1CNR2LMNAALDH1A1
SCHEMBL124651 0.84 ALDH1A1 (0.37) FAAHCNR1CNR2LMNAALDH1A1
SCHEMBL2115317 0.82 MGAM (0.38) TDP1LMNAMGAMGAASI
SCHEMBL2475707 0.82 ALDH1A1 (0.38) FAAHCNR1CNR2LMNAALDH1A1
SCHEMBL4626350 0.82 MGAM (0.38) TDP1FAAHMGAMGAASI
SCHEMBL29613313 0.80 ALDH1A1 (0.37) FAAHCNR1CNR2LMNAALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025043515-A1 ADDITION CURABLE THERMALLY CONDUCTIVE ORGANOPOLYSILOXANE ADHESIVE COMPOSITION DOW SILICONES CORPORATION (US) 2025-03-06 WO disclosed
EP-3575373-B1 COATING AGENT FOR CONCRETE STRUCTURE DOW TORAY CO LTD (JP) 2025-02-19 EP disclosed
CN-118382676-A Low temperature fast cure dual cure silicone 美国陶氏有机硅公司 2024-07-23 CN disclosed
CN-118271847-A Room temperature curable organopolysiloxane composition for protecting electrical/electronic components 陶氏东丽株式会社 2024-07-02 CN disclosed
CN-114761492-B Highly thermally conductive flowable silicone composition 美国陶氏有机硅公司 2024-06-11 CN disclosed
EP-4370606-A1 THERMAL CONDUCTIVE SILICONE COMPOSITION Dow Silicones Corporation (US) 2024-05-22 EP disclosed
CN-117730123-A Heat conductive silicone composition 美国陶氏有机硅公司 2024-03-19 CN disclosed
CN-114981336-B Dual cure composition 美国陶氏有机硅公司 2023-11-14 CN disclosed
CN-116964153-A Dual cure organopolysiloxane compositions with pot life stability 美国陶氏有机硅公司 2023-10-27 CN disclosed
CN-116529328-A Method for preparing film and composition therefor 美国陶氏有机硅公司 2023-08-01 CN disclosed
CN-114302917-A Dual cure composition 美国陶氏有机硅公司 2022-04-08 CN disclosed
CN-114144477-A Curable organopolysiloxane composition, cured product, and electrical/electronic device 美国陶氏有机硅公司 2022-03-04 CN disclosed
US-8247516-B2 Room-temperature curable organopolysiloxane composition DOW CORNING TORAY COMPANY, LTD. (JP) 2012-08-21 US disclosed
EP-2207856-B1 ROOM-TEMPERATURE CURABLE ORGANOPOLYSILOXANE COMPOSITION DOW CORNING TORAY CO LTD (JP) 2012-03-07 EP disclosed
US-7813038-B2 Light-scattering film, polarizing plate and image display FUJIFILM CORPORATION (JP) 2010-10-12 US disclosed
US-20100236450-A1 Room-Temperature Curable Organopolysiloxane Composition DOW TORAY CO., LTD. (JP) 2010-09-23 US disclosed
EP-2207856-A1 ROOM-TEMPERATURE CURABLE ORGANOPOLYSILOXANE COMPOSITION Dow Corning Toray Co., Ltd. (JP) 2010-07-21 EP disclosed
WO-2010008036-A1 ROOM-TEMPERATURE-CURABLE ORGANOPOLYSILOXANE COMPOSITION DOW CORNING TORAY CO., LTD. (JP) 2010-01-21 WO disclosed
WO-2009054279-A1 ROOM-TEMPERATURE CURABLE ORGANOPOLYSILOXANE COMPOSITION DOW CORNING TORAY CO., LTD. (JP) 2009-04-30 WO disclosed
EP-0354267-A1 Room temperature curable organopolysiloxane composition TORAY SILICONE COMPANY, LIMITED (JP) 1990-02-14 EP disclosed