Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA1 | P00915 | 1/20 | 0.52 |
| ▸ | CA2 | P00918 | 1/20 | 0.52 |
| ▸ | TSHR | P16473 | 5/20 | 0.41 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.41 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.40 |
| ▸ | ALDH1A1 | P00352 | 8/20 | 0.40 |
| ▸ | GLA | P06280 | 1/20 | 0.40 |
| ▸ | TP53 | P04637 | 3/20 | 0.38 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.38 |
| ▸ | HIF1A | Q16665 | 2/20 | 0.38 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.38 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.37 |
| ▸ | CYP2C9 | P11712 | 2/20 | 0.37 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.37 |
| ▸ | ESR1 | P03372 | 1/20 | 0.34 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.34 |
| ▸ | MAPT | P10636 | 2/20 | 0.34 |
| ▸ | HPGD | P15428 | 2/20 | 0.34 |
| ▸ | MEN1 | O00255 | 1/20 | 0.34 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL17437819 | 0.91 | ALDH1A1 (0.44) | CA1CA2TSHRSMN1; SMN2ALDH1A1 | |
| SCHEMBL7631993 | 0.86 | SHBG (0.44) | CA1CA2TSHRMAPK1SMN1; SMN2 | |
| SCHEMBL1235711 | 0.84 | CA1 (0.47) | CA1CA2TSHRSMN1; SMN2ALDH1A1 | |
| SCHEMBL21097463 | 0.84 | ALDH1A1 (0.49) | CA1CA2TSHRMAPK1SMN1; SMN2 | |
| SCHEMBL1314079 | 0.82 | TSHR (0.39) | TSHRMAPK1SMN1; SMN2ALDH1A1GLA | |
| SCHEMBL3671558 | 0.81 | ALDH1A1 (0.52) | TSHRMAPK1SMN1; SMN2ALDH1A1GLA | |
| SCHEMBL28045493 | 0.81 | ALDH1A1 (0.52) | TSHRMAPK1SMN1; SMN2ALDH1A1GLA | |
| SCHEMBL9272621 | 0.81 | TSHR (0.44) | TSHRMAPK1SMN1; SMN2ALDH1A1GLA | |
| SCHEMBL1627008 | 0.81 | SMN1; SMN2 (0.41) | TSHRMAPK1SMN1; SMN2ALDH1A1GLA | |
| SCHEMBL7734884 | 0.81 | TSHR (0.38) | TSHRMAPK1SMN1; SMN2ALDH1A1GLA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 53 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20030149219-A1 | Process for manufacturing a hydroxyester derivative intermediate and epoxy resins prepared therefrom | BORIACK CLINTON J (US) | 2003-08-07 | — | — | US | claimed |
| US-20020045707-A1 | Process for manufacturing a hydroxyester derivative intermediate and epoxy resins prepared therefrom | DOW GLOBAL TECHNOLOGIES INC. | 2002-04-18 | — | — | US | claimed |
| JP-6107911-A | — | — | None | — | — | JP | disclosed |
| JP-6100657-A | — | — | None | — | — | JP | disclosed |
| JP-5063114-A | — | — | None | — | — | JP | disclosed |
| JP-4292614-A | — | — | None | — | — | JP | disclosed |
| JP-6100658-A | — | — | None | — | — | JP | disclosed |
| JP-6100659-A | — | — | None | — | — | JP | disclosed |
| EP-4681537-A1 | INSECT DAMAGE INHIBITOR, METHOD FOR USING RESIN COMPOSITION, CULTIVATION METHOD, POTTING SOIL, AND METHOD FOR IMPROVING SOIL | Arakawa Chemical Industries, Ltd. (JP) | 2026-01-21 | — | — | EP | disclosed |
| EP-4296297-B1 | EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, FIBER-REINFORCED COMPOSITE MATERIAL, AND METHOD FOR PRODUCING FIBER-REINFORCED COMPOSITE MATERIAL | TORAY INDUSTRIES (JP) | 2025-11-05 | — | — | EP | disclosed |
| WO-2024190475-A1 | INSECT DAMAGE INHIBITOR, METHOD FOR USING RESIN COMPOSITION, CULTIVATION METHOD, POTTING SOIL, AND METHOD FOR IMPROVING SOIL | 国立研究開発法人農業・食品産業技術総合研究機構 | 2024-09-19 | — | — | WO | disclosed |
| EP-0428871-B1 | Epoxy resin composition for semiconductor sealing | SUMITOMO BAKELITE CO (JP) | 1998-03-18 | — | — | EP | disclosed |
| JP-H06107911-A | RESIN COMPOSITION FOR SEMICONDUCTOR SEALING USE | SUMITOMO BAKELITE CO LTD | 1994-04-19 | — | — | JP | disclosed |
| JP-H06100657-A | EPOXY RESIN COMPOSITION | SUMITOMO BAKELITE CO LTD | 1994-04-12 | — | — | JP | disclosed |
| JP-H06100659-A | EPOXY RESIN COMPOSITION | SUMITOMO BAKELITE CO LTD | 1994-04-12 | — | — | JP | disclosed |
| JP-H06100658-A | EPOXY RESIN COMPOSITION | SUMITOMO BAKELITE CO LTD | 1994-04-12 | — | — | JP | disclosed |
| JP-H0563114-A | RESIN COMPOSITION FOR SEALING SEMICONDUCTOR | SUMITOMO BAKELITE CO LTD | 1993-03-12 | — | — | JP | disclosed |
| JP-H04292614-A | RESIN COMPOSITION FOR SEALING SEMICONDUCTOR | SUMITOMO BAKELITE CO LTD | 1992-10-16 | — | — | JP | disclosed |
| US-5143951-A | Curable blends of epoxy resins and siloxane-modified phenolic resin curing agent | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1992-09-01 | — | — | US | disclosed |
| EP-0428871-A2 | Epoxy resin composition for semiconductor sealing | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1991-05-29 | — | — | EP | disclosed |