SCHEMBL3671558

SCHEMBL3671558

C(OCC1CO1)C1CO1.Cc1cccc(C)c1O

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 7/20 0.52
GLA P06280 1/20 0.51
TSHR P16473 5/20 0.46
TP53 P04637 3/20 0.46
SMN1; SMN2 Q16637 2/20 0.46
HIF1A Q16665 2/20 0.46
CYP3A4 P08684 1/20 0.46
TDP1 Q9NUW8 2/20 0.43
TRPA1 O75762 1/20 0.42
MAPK1 P28482 1/20 0.41
HPGD P15428 3/20 0.38
MAPT P10636 2/20 0.38
MEN1 O00255 2/20 0.38
KMT2A Q03164 2/20 0.38
CYP1A2 P05177 1/20 0.38
PPARG P37231 1/20 0.38
GABRA1 P14867 1/20 0.37
GABRB2 P47870 1/20 0.37
KDM4E B2RXH2 1/20 0.36
HSD17B10 Q99714 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28045493 1.00 ALDH1A1 (0.52) ALDH1A1GLATSHRTP53SMN1; SMN2
SCHEMBL27722305 0.91 TRPA1 (0.57) ALDH1A1GLATSHRTP53SMN1; SMN2
SCHEMBL6577504 0.85 ALDH1A1 (0.55) ALDH1A1GLATSHRTP53SMN1; SMN2
SCHEMBL3848081 0.85 ALDH1A1 (0.55) ALDH1A1GLATSHRTP53SMN1; SMN2
SCHEMBL27859316 0.84 TRPA1 (0.57) ALDH1A1GLATSHRTP53SMN1; SMN2
O-Xylene SCHEMBL27476227 0.84 ALDH1A1 (0.63) ALDH1A1GLATSHRTP53SMN1; SMN2
Pyrogallol SCHEMBL27626139 0.84 ALDH1A1 (0.44) ALDH1A1GLATSHRTP53SMN1; SMN2
Orthocresol SCHEMBL1287877 0.84 ALDH1A1 (0.54) ALDH1A1GLATSHRTP53SMN1; SMN2
SCHEMBL27944101 0.84 ALDH1A1 (0.46) ALDH1A1GLATSHRTP53SMN1; SMN2
Ammonia Solution, Strong SCHEMBL28677700 0.83 TRPA1 (0.55) ALDH1A1GLATSHRTP53SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114929773-A Two-part epoxy composition for adhesive coating of storage articles SWIMC有限公司 2022-08-19 CN claimed
CN-104583347-A Stabilizer and coating compositions thereof VALSPAR SOURCING INC 2015-04-29 CN claimed
US-7049388-B2 Process for manufacturing an α-dihydroxy derivative and epoxy resins prepared therefrom DOW GLOBAL TECHNOLOGIES INC. (US) 2006-05-23 US claimed
US-6646102-B2 Epoxidizing an alpha - halohydrin intermediate produced from a halide substitution of an alpha -dihydroxy derivative which has been obtained by a dihydroxylation reaction of an aryl allyl ether, oxidation catalysts DOW GLOBAL TECHNOLOGIES INC. 2003-11-11 US claimed
US-20030105268-A1 Process for manufacturing an alpha-dihydroxy derivative and epoxy resins prepared therefrom DOW GLOBAL TECHNOLOGIES INC. 2003-06-05 US claimed
CN-110139805-B Packaging coating resins derived from the reaction of phenols with polyolefinic terpenes 宣伟投资管理有限公司 2022-02-11 CN disclosed
CN-110790914-A Methods of making compositions for containers and other articles and methods of using the same 宣伟投资管理有限公司 2020-02-14 CN disclosed
CN-110139805-A Packaging coating resins derived from the reaction of phenols with polyolefinic terpenes 宣伟投资管理有限公司 2019-08-16 CN disclosed
CN-105722811-B Two (amide groups (alkyl) phenol) compounds and the polymer formed by it 宣伟投资管理有限公司 2019-06-04 CN disclosed
CN-105722811-A Di(amido(alkyl)phenol) compounds and polymers formed therefrom 威士伯采购公司 2016-06-29 CN disclosed
CN-105440582-A USE OF EPOXY RESIN MOLDING MATERIAL AS SEALING MATERIAL HITACHI CHEMICAL CO LTD 2016-03-30 CN disclosed
CN-103517948-A Epoxy resin molding material for sealing and electronic component device HITACHI CHEMICAL CO LTD 2014-01-15 CN disclosed
CN-1238458-C Adhensive film for semiconductor, lead frame with adhensive film for semiconductor and semiconductor device using the same HITACHI CHEMICAL CO LTD (JP) 2006-01-25 CN disclosed
EP-1406885-B1 PROCESS FOR MANUFACTURING AN A-DIHYDROXY DERIVATIVE AND EPOXY RESINS PREPARED THEREFROM DOW GLOBAL TECHNOLOGIES INC (US) 2006-01-18 EP disclosed
EP-1406885-A1 PROCESS FOR MANUFACTURING AN A-DIHYDROXY DERIVATIVE AND EPOXY RESINS PREPARED THEREFROM DOW GLOBAL TECHNOLOGIES INC. (US) 2004-04-14 EP disclosed
US-20040049004-A1 Process for manufacturing an alpha-dihydroxy derivative and epoxy resins prepared therefrom THE DOW CHEMICAL COMPANY 2004-03-11 US disclosed
US-6646102-B2 Epoxidizing an alpha - halohydrin intermediate produced from a halide substitution of an alpha -dihydroxy derivative which has been obtained by a dihydroxylation reaction of an aryl allyl ether, oxidation catalysts DOW GLOBAL TECHNOLOGIES INC. 2003-11-11 US disclosed
US-20030105268-A1 Process for manufacturing an alpha-dihydroxy derivative and epoxy resins prepared therefrom DOW GLOBAL TECHNOLOGIES INC. 2003-06-05 US disclosed
CN-1395604-A Adhensive film for semiconductor, lead frame with adhensive film for semiconductor and semiconductor device using the same HITACHI CHEMICAL CO LTD (JP) 2003-02-05 CN disclosed
WO-2003004481-A1 PROCESS FOR MANUFACTURING AN A-DIHYDROXY DERIVATIVE AND EPOXY RESINS PREPARED THEREFROM DOW GLOBAL TECHNOLOGIES INC. (US) 2003-01-16 WO disclosed