SCHEMBL1244501

SCHEMBL1244501

NC1(N)C=CC=C(c2ccccc2-c2ccccc2-c2ccccc2)C1

nearest known ligand 0.35

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.35
HSD17B10 Q99714 2/20 0.35
DPP4 P27487 1/20 0.32
SLC6A2 P23975 1/20 0.32
SLC6A4 P31645 1/20 0.32
SLC6A3 Q01959 1/20 0.32
HDAC4 P56524 1/20 0.32
HDAC2 Q92769 1/20 0.32
HDAC8 Q9BY41 1/20 0.32
HDAC6 Q9UBN7 1/20 0.32
HPGD P15428 1/20 0.31
BCL2L1 Q07817 1/20 0.31
CYP2A6 P11509 1/20 0.31
MAPK1 P28482 1/20 0.31
NISCH Q9Y2I1 1/20 0.31
BCAT2 O15382 1/20 0.31
PTGS2 P35354 1/20 0.30
MEN1 O00255 1/20 0.30
APAF1 O14727 1/20 0.30
NPC1 O15118 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10614677 0.98 ALDH1A1 (0.36) ALDH1A1HSD17B10DPP4SLC6A2SLC6A4
SCHEMBL5671293 0.83 NPC1 (0.37) ALDH1A1HDAC2HPGDNPC1LMNA
Methane SCHEMBL28000918 0.82 NPC1 (0.36) ALDH1A1HDAC2HPGDNPC1LMNA
SCHEMBL29170920 0.80 NPC1 (0.42) ALDH1A1HSD17B10SLC6A2SLC6A4SLC6A3
SCHEMBL28058791 0.79 SLC6A2 (0.32) ALDH1A1HSD17B10SLC6A2SLC6A4SLC6A3
SCHEMBL27902284 0.76 THRB (0.36) ALDH1A1HSD17B10HDAC4HDAC2HDAC8
SCHEMBL9766554 0.74 PTGS2 (0.37) ALDH1A1HSD17B10HDAC4HDAC2HDAC8
SCHEMBL9332805 0.73 NCOA1 (0.43) ALDH1A1HSD17B10MAPK1NISCHPTGS2
Ether SCHEMBL16934634 0.72 NPC1 (0.33) ALDH1A1HPGDNPC1LMNAMAPT
SCHEMBL27336597 0.68 SLC6A2 (0.39) ALDH1A1HSD17B10DPP4SLC6A2SLC6A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9688815-B2 Method for producing polyimide precursor and method for producing polyimide RICOH COMPANY, LTD. (JP) 2017-06-27 US disclosed
US-20160122474-A1 METHOD FOR PRODUCING POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING POLYIMIDE RICHO COMPANY, LTD. (JP) 2016-05-05 US disclosed
EP-3004211-A1 METHOD FOR PRODUCING POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING POLYIMIDE Ricoh Company, Ltd. (JP) 2016-04-13 EP disclosed
WO-2014192665-A1 METHOD FOR PRODUCING POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING POLYIMIDE RICOH COMPANY, LTD. (JP) 2014-12-04 WO disclosed
US-7879535-B2 A fine conductive metal pattern superior in heat resistance, adhesion property to a base surface and durability on a polyimide surface; simplification; grafting an acylic monomer on polyimide to interact with electroless plating catalyst; reduction of metal salt in defined pattern; printed circuit FUJIFILM CORPORATION (JP) 2011-02-01 US disclosed
US-7739789-B2 Method for forming surface graft, conductive film and metal patterns FUJIFILM CORPORATION (JP) 2010-06-22 US disclosed
US-7438950-B2 Metallic pattern forming method and conductive pattern material FUJIFILM CORPORATION (JP) 2008-10-21 US disclosed
US-20070212883-A1 Method For Forming Surface Graft, Method For Forming Conductive Film, Method For Forming Method Pattern, Method For Forming Multilayer Wiring Board, Surface Graft Material, And Conductive Material FUJIFILM CORPORATION (JP) 2007-09-13 US disclosed
EP-1742991-A1 METHOD FOR FORMING SURFACE GRAFT, METHOD FOR FORMING CONDUCTIVE FILM, METHOD FOR FORMING METAL PATTERN, METHOD FOR FORMING MULTILAYER WIRING BOARD, SURFACE GRAFT MATERIAL, AND CONDUCTIVE MATERIAL Fuji Photo Film Co., Ltd. (JP) 2007-01-17 EP disclosed
US-20050266255-A1 Conductive film forming method and conductive material FUJI PHOTO FILM CO., LTD. 2005-12-01 US disclosed
US-20050266352-A1 Forming a region in which a graft polymer, that directly bonds to a surface of a base material that includes a polyimide is generated in a pattern shape; imparting electroless plating catalyst or a precursor thereof and electroless plating so as to form a metallic film in the pattern shape FUJI PHOTO FILM CO., LTD. 2005-12-01 US disclosed
US-20050214693-A1 Pattern forming method, graft pattern material, conductive pattern forming method and conductive pattern material FUJI PHOTO FILM CO., LTD. 2005-09-29 US disclosed
WO-2005090454-A1 METHOD FOR FORMING SURFACE GRAFT, METHOD FOR FORMING CONDUCTIVE FILM, METHOD FOR FORMING METAL PATTERN, METHOD FOR FORMING MULTILAYER WIRING BOARD, SURFACE GRAFT MATERIAL, AND CONDUCTIVE MATERIAL FUJI PHOTO FILM CO., LTD. (JP) 2005-09-29 WO disclosed
EP-1580595-A2 Pattern forming method, graft pattern material, conductive pattern forming method and conductive pattern material FUJI PHOTO FILM CO., LTD. (JP) 2005-09-28 EP disclosed